Patents by Inventor Luis CHAU

Luis CHAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240057306
    Abstract: Features described herein generally relate to systems and methods for assembling an electronic device. Particularly, the electronic device can be assembled by holding a portion of the first component arranged in a first plane in a holding position with a stream of air output from a nozzle of an assembly system and aligning the portion of the first component with an opening in a portion of the second component arranged in a second plane parallel to the first plane while the portion of the first component is held in the holding position.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 15, 2024
    Applicant: Google LLC
    Inventors: Luis Chau, Fiona Au, Alex Locke, Wayman Leung
  • Patent number: 11622178
    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: April 4, 2023
    Assignee: Google LLC
    Inventors: Cindy Ngoc-Tran Au, Gordon Robert Dix, Luis Chau, William Raeming Dong, Laurie Man Sum Kwan
  • Publication number: 20220232304
    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.
    Type: Application
    Filed: January 20, 2022
    Publication date: July 21, 2022
    Applicant: Google LLC
    Inventors: Cindy Ngoc-Tran Au, Gordon Robert Dix, Luis Chau, William Raeming Dong, Laurie Man Sum Kwan
  • Patent number: 11265632
    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: March 1, 2022
    Assignee: Google LLC
    Inventors: Cindy Ngoc-Tran Au, Gordon Robert Dix, Luis Chau, William Raeming Dong, Laurie Man Sum Kwan
  • Patent number: 9433104
    Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: August 30, 2016
    Assignee: MULTI-FINELINE ELECTRONIX, INC.
    Inventors: Dale Wesselmann, Luis Chau, Chengkong Chris Wu
  • Patent number: 9018532
    Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: April 28, 2015
    Assignee: Multi-Fineline Electronix, Inc.
    Inventors: Dale Wesselmann, Luis Chau, Chengkong Chris Wu
  • Publication number: 20140216792
    Abstract: A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps: providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material. Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.
    Type: Application
    Filed: July 12, 2012
    Publication date: August 7, 2014
    Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Simon Sebanz, Hannes Voraberger, Richard McConnell, Luis Chau
  • Publication number: 20130312256
    Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.
    Type: Application
    Filed: July 30, 2013
    Publication date: November 28, 2013
    Applicant: MULTI-FINELINE ELECTRONIX, INC.
    Inventors: Dale WESSELMANN, Luis CHAU, Chengkong Chris WU
  • Publication number: 20120314382
    Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 13, 2012
    Applicant: MULTI-FINELINE ELECTRONIX, INC.
    Inventors: Dale WESSELMANN, Luis CHAU, Chengkong Chris WU