Patents by Inventor Luisa M. Deckard

Luisa M. Deckard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparing composites by using resins
    Publication number: 20080156429
    Abstract: A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices, (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curi
    Type: Application
    Filed: June 13, 2007
    Publication date: July 3, 2008
    Inventors: Luisa M. Deckard, Jennifer J. Zinck
  • Preparing composites by using resins
    Patent number: 7258896
    Abstract: A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curi
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: August 21, 2007
    Assignee: HRL Laboratories, LLC
    Inventors: Luisa M. Deckard, Jennifer J. Zinck
  • Method for assembly of complementary-shaped receptacle site and device microstructures
    Patent number: 7018575
    Abstract: A method for assembly including the steps of: (a) providing a plurality of microstructure components with each of the components having a bottom with the same three dimensional shape; (b) forming a mold with at least one protuberance from a surface thereof so that the at least one protuberance has the same shape; (c) molding a moldable substrate with the mold to form a molded substrate having a surface with at least one recess having the same shape; and (d) positioning a first of the plurality of microstructure components into said at least one recess. Each of the microstructure components may be formed by a masking and etching process, with the mold being formed by the same masking and etching process. The positioning step may consist of mixing the microstructure components with a fluid to form a slurry; and depositing the slurry on the surface of the molded substrate to cause the first of the plurality of microstructure components to self-align in the recess.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: March 28, 2006
    Assignee: HRL Laboratories, LLC
    Inventors: Peter D. Brewer, Andrew T. Hunter, Luisa M. Deckard
  • Preparing composites by using resins
    Publication number: 20030094734
    Abstract: A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curi
    Type: Application
    Filed: October 18, 2002
    Publication date: May 22, 2003
    Inventors: Luisa M. Deckard, Jennifer J. Zinck
  • Method for assembly of complementary-shaped receptacle site and device microstructures
    Publication number: 20030068519
    Abstract: A method for assembly including the steps of:
    Type: Application
    Filed: August 12, 2002
    Publication date: April 10, 2003
    Applicant: HRL LABORATORIES, LLC
    Inventors: Peter D. Brewer, Andrew T. Hunter, Luisa M. Deckard