Patents by Inventor Lukas Urban
Lukas Urban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11248295Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.Type: GrantFiled: November 30, 2018Date of Patent: February 15, 2022Assignee: Veeco Instruments Inc.Inventors: Sandeep Krishnan, Lukas Urban
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Patent number: 10782676Abstract: A modular work cell for a production robot includes a base module, on which at least one production robot is arranged, disposed inside the modular work cell. The modular work cell further includes wall elements, a control cabinet, an access, and a feed unit for workpieces which is arranged between the access and the production robot. The base module, the control cabinet, the feed unit and the access form a mechanically and electrically interconnected transport assembly configured for transport. The wall elements can be transported separate from the transport assembly.Type: GrantFiled: January 22, 2018Date of Patent: September 22, 2020Assignee: BENTELER MASCHINENBAU GMBHInventors: Martin Besik, Radovan Kout, Jiri Malý, Petr Masilko, Vaclav Sula, Lukas Urban
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Patent number: 10316412Abstract: A wafer carrier for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. Each pocket includes a floor surface and a peripheral wall surface surrounding the floor surface and defining a periphery of that pocket. Each pocket has a center situated along a corresponding wafer carrier radial axis. In each of the pockets, a set of bumpers is positioned primarily at a distal portion of the wafer retention pocket opposite the central axis so as to maintain a gap of at least a predefined size between the peripheral wall surface at the distal portion and an edge of a wafer to be placed in the wafer retention pocket.Type: GrantFiled: April 18, 2012Date of Patent: June 11, 2019Assignee: Veeco Instruments Inc.Inventors: Sandeep Krishnan, Jeffrey Scott Montgomery, Lukas Urban, Alexander I. Gurary, Yuliy Rashkovsky
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Publication number: 20190169745Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.Type: ApplicationFiled: November 30, 2018Publication date: June 6, 2019Inventors: Sandeep Krishnan, Lukas Urban
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Patent number: 10167571Abstract: A wafer carrier and methods of making the same for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. A thermally-insulating spacer is situated at least partially in the at least one wafer retention pocket and arranged to maintain a spacing between the peripheral wall surface and the wafer, the spacer being constructed from a material having a thermal conductivity less than a thermal conductivity of the wafer carrier such that the spacer limits heat conduction from portions of the wafer carrier body to the wafer. The wafer carrier further includes a spacer retention feature that engages with the spacer and includes a surface oriented to prevent centrifugal movement of the spacer when subjected to rotation about the central axis.Type: GrantFiled: March 15, 2013Date of Patent: January 1, 2019Assignee: Veeco Instruments Inc.Inventors: Sandeep Krishnan, William E. Quinn, Jeffery S. Montgomery, Joshua Mangum, Lukas Urban
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Patent number: 10145013Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.Type: GrantFiled: January 26, 2015Date of Patent: December 4, 2018Assignee: Veeco Instruments Inc.Inventors: Sandeep Krishnan, Lukas Urban
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Publication number: 20180210424Abstract: A modular work cell for a production robot includes a base module, on which at least one production robot is arranged, disposed inside the modular work cell. The modular work cell further includes wall elements, a control cabinet, an access, and a feed unit for workpieces which is arranged between the access and the production robot. The base module, the control cabinet, the feed unit and the access form a mechanically and electrically interconnected transport assembly configured for transport. The wall elements can be transported separate from the transport assembly.Type: ApplicationFiled: January 22, 2018Publication date: July 26, 2018Applicant: Benteler Maschinenbau GmbHInventors: Martin Besik, Radovan Kout, Jiri Malý, Petr Masilko, Vaclav Sula, Lukas Urban
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Publication number: 20170076972Abstract: A wafer carrier for a plurality of wafers, the wafer carrier having a platen with a plurality of openings and a plurality of wafer retention platforms, the platen configured to rotate about a first axis, the plurality of wafer retention platforms configured to rotate about respective second axes, each of the wafer retention platforms rotatably coupled to one of the plurality of openings by friction reducing bearings, the platen and the plurality of wafer retention platforms and the friction reducing bearings all being constructed of the same material.Type: ApplicationFiled: September 15, 2016Publication date: March 16, 2017Inventors: Sandeep Krishnan, Lukas Urban, Alexander Gurary, Keng Moy, Ajit Paranjpe
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Publication number: 20170053049Abstract: Improvements to the heating uniformity of a wafer carrier for a chemical vapor deposition (CVD) system can be made based on a computational thermal model built according physical and operational characteristics of the CVD system. Operation of the thermal model is simulated, where a process recipe to be carried out on the CVD system is modeled, including heat transfers taking place in the virtual CVD system, to produce a set of thermal-spatial non-uniformities in at least one region of interest of a virtual wafer carrier. Structural corrections to be made to the pocket floor of each of the at least one wafer retention pocket are determined based on the set of thermal-spatial non-uniformities and on a predefined thermal-pocket floor relation that defines at least one design rule for correcting the pocket floor to achieve an increase in thermal uniformity throughout the at least one region of interest.Type: ApplicationFiled: August 16, 2016Publication date: February 23, 2017Inventors: Lukas Urban, Sandeep Krishnan
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Publication number: 20150211148Abstract: A wafer carrier for use in a chemical vapor deposition (CVD) system includes a plurality of wafer retention pockets, each having a peripheral wall surface surrounding a floor surface and defining a periphery of that wafer retention pocket. Each wafer retention pocket has a periphery with a shape defined by at least a first arc having a first radius of curvature situated around a first arc center and a second arc having a second radius of curvature situated around a second arc center. The second arc is different from the first arc, either by its radius of curvature, arc center, or both.Type: ApplicationFiled: January 26, 2015Publication date: July 30, 2015Inventors: Sandeep Krishnan, Lukas Urban
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Publication number: 20140261187Abstract: A wafer carrier and methods of making the same for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. A thermally-insulating spacer is situated at least partially in the at least one wafer retention pocket and arranged to maintain a spacing between the peripheral wall surface and the wafer, the spacer being constructed from a material having a thermal conductivity less than a thermal conductivity of the wafer carrier such that the spacer limits heat conduction from portions of the wafer carrier body to the wafer. The wafer carrier further includes a spacer retention feature that engages with the spacer and includes a surface oriented to prevent centrifugal movement of the spacer when subjected to rotation about the central axis.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Inventors: Sandeep Krishnan, Wiliam E. Quinn, Jeffery S. Montgomery, Joshua Mangum, Lukas Urban, Alexander Gurary
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Publication number: 20130298831Abstract: A cleaning carrier for in-situ cleaning of a process chamber of a material deposition tool and method for in-situ cleaning using a cleaning carrier. The cleaning carrier includes a body formed symmetrically about a central axis and having a geometry generally corresponding to the geometry of the removable wafer carrier for use with the tool, and a tool interface that facilitates mounting of the cleaning carrier body on a portion of the material deposition tool that accepts the removable wafer carrier. A set of deployable and retractable brushes are operatively coupled with the cleaning carrier body via a corresponding set of deployment and retraction mechanisms, the brushes being movable between a retracted position for handling of the cleaning carrier and a deployed position for cleaning an interior surface of the process chamber.Type: ApplicationFiled: May 14, 2012Publication date: November 14, 2013Inventors: Bassam Shamoun, Alex Gurary, Vadim Boguslavskiy, Matthew King, Lukas Urban
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Publication number: 20130276704Abstract: A wafer carrier for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. Each pocket includes a floor surface and a peripheral wall surface surrounding the floor surface and defining a periphery of that pocket. Each pocket has a center situated along a corresponding wafer carrier radial axis. In each of the pockets, a set of bumpers is positioned primarily at a distal portion of the wafer retention pocket opposite the central axis so as to maintain a gap of at least a predefined size between the peripheral wall surface at the distal portion and an edge of a wafer to be placed in the wafer retention pocket.Type: ApplicationFiled: April 18, 2012Publication date: October 24, 2013Inventors: Sandeep Krishnan, Jeffrey Scott Montgomery, Lukas Urban, Alexander I. Gurary, Yuliy Rashkovsky
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Publication number: 20130065403Abstract: A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface.Type: ApplicationFiled: November 9, 2012Publication date: March 14, 2013Inventors: Ajit Paranjpe, Boris Volf, Eric A. Armour, Sandeep Krishnan, Guanghua Wei, Lukas Urban