Patents by Inventor Luling Wang
Luling Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240122505Abstract: An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of electrodes and a controller. The plurality of electrodes may be configured to provide a plurality of electrode signals based on a target environment. The plurality of electrodes may include one or more working electrodes, a first reference electrode, and a second reference electrode. The one or more working electrodes may be configured to provide an analyte signal based on a presence of an analyte in the target environment. The first reference electrode may be configured to provide a first baseline signal of the target environment. The second reference electrode may include a different type of electrode than the first reference electrode. The second reference electrode may be configured to provide a second baseline signal of the target environment. The controller may be operatively coupled to the plurality of electrodes.Type: ApplicationFiled: October 12, 2022Publication date: April 18, 2024Inventors: Anna M. Belle, Mohsen Askarinya, Omid Mahdavi, Luling Wang
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Publication number: 20230314340Abstract: An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of biotransducers and a controller. The plurality of biotransducers are configured to provide a baseline signal, one or more analyte signals, and at least one error condition signal. The plurality of biotransducers at least one reference biotransducer, one or more working biotransducers, and at least one working as reference biotransducer. The controller is operatively coupled to the plurality of biotransducers and is configured to receive the baseline signal, the one or more analyte signals, and the error correction signal. The controller is further configured to determine and/or output one or more adjusted analyte levels using the baseline signal, the one or more analyte signals, and the error correction signal.Type: ApplicationFiled: March 29, 2022Publication date: October 5, 2023Inventors: Luling Wang, Anna M. Belle, Mohsen Askarinya, David A. Ruben, Omid Mahdavi, David A. Anderson, Shawn C. Kelley
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Patent number: 9735031Abstract: The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKamin)<pKa<18 (pKamax)). The pKa values of the individual components are related to the pH of the polishing composition/slurry (pHslurry) by the following equation: pKamin+6<pHslurry<pKamax?6. The polishing composition also has less than about 100 parts per million (ppm) of sulfate ions and less than about 100 ppm of halide ions, and operates in the 7-12 pH range.Type: GrantFiled: September 17, 2015Date of Patent: August 15, 2017Assignee: FUJIFILM PLANAR SOLUTIONS, LLCInventors: Luling Wang, Abhudaya Mishra, Deepak Mahulikar, Richard Wen
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Patent number: 9735030Abstract: The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKamin)<pKa<18 (pKamax)). The pKa values of the individual components are related to the pH of the polishing composition/slurry (pHslurry) by the following equation: pKamin+6<pHslurry<pKamax?6. The polishing composition also has less than about 100 parts per million (ppm) of sulfate ions and less than about 100 ppm of halide ions, and operates in the 7-12 pH range.Type: GrantFiled: September 5, 2014Date of Patent: August 15, 2017Assignee: FUJIFILM PLANAR SOLUTIONS, LLCInventors: Luling Wang, Abhudaya Mishra, Deepak Mahulikar, Richard Wen
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Patent number: 9583359Abstract: Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide films are provided herein. The compositions comprise an anionic abrasive, a nitride removal rate enhancer containing a carboxyl or carboxylate group, water, and optionally, an anionic polymer. The synergistic combination of anionic (negatively charged) abrasives and the nitride removal rate enhancer provide beneficial charge interactions with the dielectric films during CMP, a high SiN rate and selectivity enhancement (over oxide), and stable colloidal dispersed slurries.Type: GrantFiled: April 4, 2014Date of Patent: February 28, 2017Assignee: Fujifilm Planar Solutions, LLCInventors: Abhudaya Mishra, Luling Wang
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Patent number: 9558959Abstract: Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide films are provided herein. The compositions comprise an anionic abrasive, a nitride removal rate enhancer containing a carboxyl or carboxylate group, water, and optionally, an anionic polymer. The synergistic combination of anionic (negatively charged) abrasives and the nitride removal rate enhancer provide beneficial charge interactions with the dielectric films during CMP, a high SiN rate and selectivity enhancement (over oxide), and stable colloidal dispersed slurries.Type: GrantFiled: September 17, 2015Date of Patent: January 31, 2017Assignee: FUJIFILM PLANAR SOLUTIONS, LLCInventors: Abhudaya Mishra, Luling Wang
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Publication number: 20160223439Abstract: A method of preparation of a 2-D array of particles comprising: mixing the particles and a first liquid, the first liquid having the properties of being soluble in water and reducing surface tension of a water surface; adding the mixture to the water surface; and transferring the 2-D array onto a solid surface. A composition comprising: a 2-D array of particles; and a polymer substantially enveloping the 2-D array of particles.Type: ApplicationFiled: February 23, 2016Publication date: August 4, 2016Inventors: Sanford A. Asher, Alexander Tikhonov, Luling Wang, Jian-Tao Zhang
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Publication number: 20160189976Abstract: The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKamin)<pKa<18 (pKamax)). The pKa values of the individual components are related to the pH of the polishing composition/slurry (pHslurry) by the following equation: pKamin+6<pHslurry<pKamax?6. The polishing composition also has less than about 100 parts per million (ppm) of sulfate ions and less than about 100 ppm of halide ions, and operates in the 7-12 pH range.Type: ApplicationFiled: September 17, 2015Publication date: June 30, 2016Inventors: Luling Wang, Abhudaya Mishra, Deepak Mahulikar, Richard Wen
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Patent number: 9304074Abstract: A method of preparation of a 2-D array of particles comprising: mixing the particles and a first liquid, the first liquid having the properties of being soluble in water and reducing surface tension of a water surface; adding the mixture to the water surface; and transferring the 2-D array onto a solid surface. A composition comprising: a 2-D array of particles; and a polymer substantially enveloping the 2-D array of particles.Type: GrantFiled: July 19, 2012Date of Patent: April 5, 2016Assignee: University of Pittsburgh—Of The Commonwealth System of Higher EducationInventors: Sanford A. Asher, Alexander Tilchonov, Luling Wang, Jian-Tao Zhang
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Publication number: 20160079080Abstract: Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide films are provided herein. The compositions comprise an anionic abrasive, a nitride removal rate enhancer containing a carboxyl or carboxylate group, water, and optionally, an anionic polymer. The synergistic combination of anionic (negatively charged) abrasives and the nitride removal rate enhancer provide beneficial charge interactions with the dielectric films during CMP, a high SiN rate and selectivity enhancement (over oxide), and stable colloidal dispersed slurries.Type: ApplicationFiled: September 17, 2015Publication date: March 17, 2016Inventors: Abhudaya Mishra, Luling Wang
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Publication number: 20160068710Abstract: The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKamin)<pKa<18 (pKamax)). The pKa values of the individual components are related to the pH of the polishing composition/slurry (pHslurry) by the following equation: pKamin+6<pHslurry<pKamax?6. The polishing composition also has less than about 100 parts per million (ppm) of sulfate ions and less than about 100 ppm of halide ions, and operates in the 7-12 pH range.Type: ApplicationFiled: September 5, 2014Publication date: March 10, 2016Inventors: Luling Wang, Abhudaya Mishra, Deepak Mahulikar, Richard Wen
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Publication number: 20150284593Abstract: Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide films are provided herein. The compositions comprise an anionic abrasive, a nitride removal rate enhancer containing a carboxyl or carboxylate group, water, and optionally, an anionic polymer. The synergistic combination of anionic (negatively charged) abrasives and the nitride removal rate enhancer provide beneficial charge interactions with the dielectric films during CMP, a high SiN rate and selectivity enhancement (over oxide), and stable colloidal dispersed slurries.Type: ApplicationFiled: April 4, 2014Publication date: October 8, 2015Inventors: Luling Wang, Abhudaya Mishra
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Publication number: 20140204364Abstract: A method of preparation of a 2-D array of particles comprising: mixing the particles and a first liquid, the first liquid having the properties of being soluble in water and reducing surface tension of a water surface; adding the mixture to the water surface; and transferring the 2-D array onto a solid surface. A composition comprising: a 2-D array of particles; and a polymer substantially enveloping the 2-D array of particles.Type: ApplicationFiled: July 19, 2012Publication date: July 24, 2014Inventors: Sanford A. Asher, Alexander Tilchonov, Luling Wang, Jian-Tao Zhang
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Patent number: 8742130Abstract: The present invention provides new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. The present invention also discloses processes for manufacturing new hydrate forms of triazole, triazole alkaline salt, and alkali-doped 1,2,4-triazole. The present invention also relates to compositions for different applications of new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. In addition, the present invention provides co-crystal form of triazole with acid, and methods of preparing thereof.Type: GrantFiled: November 1, 2012Date of Patent: June 3, 2014Assignee: Fujifilm Planar Solutions, LLCInventors: Deepak Mahulikar, Luling Wang
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Publication number: 20140121382Abstract: The present invention provides new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. The present invention also discloses processes for manufacturing new hydrate forms of triazole, triazole alkaline salt, and alkali-doped 1,2,4-triazole. The present invention also relates to compositions for different applications of new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. In addition, the present invention provides co-crystal form of triazole with acid, and methods of preparing thereof.Type: ApplicationFiled: November 1, 2012Publication date: May 1, 2014Applicant: FUJIFILM PLANAR SOLUTIONS, LLCInventors: Deepak Mahulikar, Luling Wang
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Publication number: 20120062883Abstract: The present invention provides a method of making highly charged, monodisperse particles which do not absorb deep ultraviolet (UV) light and a method of making crystalline colloidal array (CCA) deep UV narrow band radiation filters by using these highly charged monodisperse particles. The CCA filter rejects and/or selects particular regions of the electromagnetic spectrum while transmitting adjacent spectral regions. The filtering devices of the present invention are wavelength tunable over significant spectral intervals by changing the incident angle of the CCA filter relative to the light. Larger wavelength changes can be obtained by changing the concentrations of particles in the CCAs. The present invention also includes applications of the CCA filter to hyperspectral imaging and Raman imaging devices.Type: ApplicationFiled: September 7, 2011Publication date: March 15, 2012Inventors: Sanford A. Asher, Luling Wang, David Tuschel