Abstract: A terahertz carrier sending apparatus and a terahertz carrier receiving apparatus include a feed transmission line configured to receive an electrical signal sent by a radio frequency sending circuit. A mode excitation structure is configured to excite a terahertz signal. A mode conversion structure includes an inner cavity whose inner wall is metal. A circuit board is configured to fasten the feed transmission line and the mode excitation structure. The mode conversion structure further includes a positioning slot. A part of the circuit board and the mode excitation structure are inserted into the inner cavity of the mode conversion structure. A plurality of metal through holes are distributed on both sides of the mode excitation structure. A boundary of the positioning slot is metal and press-fitted on the metal through holes on the both sides of the mode excitation structure.

Abstract: The present disclosure describes a terahertz carrier sending apparatus and a terahertz carrier receiving apparatus. The sending apparatus includes a radio frequency sending chip, a mode conversion structure, a terahertz transmission line, and a circuit board. The radio frequency sending chip is packaged on the circuit board, and includes a radio frequency sending circuit, a feed transmission line, and a mode excitation structure. The mode conversion structure includes a metal inner wall, configured to couple a terahertz signal excited by the mode excitation structure into the terahertz transmission line. The terahertz transmission line is configured to transmit the terahertz signal. The receiving apparatus includes a similar part in a receiving direction. The subject matter herein implements efficient electromagnetic coupling and improves data transmission bandwidth.

Abstract: This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.

Abstract: A distributed radar includes a control unit, a receive antenna, and N transmit antennas. The N transmit antennas include a first transmit antenna, a second transmit antenna, and a third transmit antenna. There is a first distance (?x1) between the first transmit antenna and the second transmit antenna, there is a second distance (?x2) between the first transmit antenna (201) and the third transmit antenna (203), and ?x1 is less than ?x2. The second transmit antenna is connected to the control unit by using a first cable (L1), the third transmit antenna is connected to the control unit by using a second cable (L2), a ratio of ?x1 to ?x2 is a first ratio, a ratio of a length of L1 to a length of L2 is a second ratio, and the second ratio is greater than the first ratio.

Abstract: A transmission cable is provided to implement high-speed inter-device interconnection and intercommunication. The transmission cable includes a positive dispersion transmission section, a negative dispersion transmission section, and a dispersion matching section. A cross-sectional diameter of the positive dispersion transmission section is less than a cross-sectional diameter of the negative dispersion transmission section. The dispersion matching section is configured to connect the positive dispersion transmission section and the negative dispersion transmission section. The transmission cable can implement dispersion cancellation to reduce total group delay.

Abstract: This application provides a feed apparatus, a dual-band microwave antenna, and a dual-band antenna device. The feed apparatus includes a low-frequency feed and a high-frequency feed. The high-frequency feed is embedded into the low-frequency feed. The low-frequency feed includes a plurality of low-frequency array elements arranged in an array. The high-frequency feed includes a plurality of high-frequency array elements arranged in an array. At least one high-frequency array element is embedded into the low-frequency array element, and the low-frequency array element and each high-frequency array element embedded into the low-frequency array element have a common waveguide wall.

Abstract: This application provides a feed apparatus, a dual-band microwave antenna, and a dual-band antenna device. The feed apparatus includes a low-frequency feed and a high-frequency feed. The high-frequency feed is embedded into the low-frequency feed. The low-frequency feed includes a plurality of low-frequency array elements arranged in an array. The high-frequency feed includes a plurality of high-frequency array elements arranged in an array. At least one high-frequency array element is embedded into the low-frequency array element, and the low-frequency array element and each high-frequency array element embedded into the low-frequency array element have a common waveguide wall.