Patents by Inventor Lyang-Gung Wang
Lyang-Gung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230226661Abstract: The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 ?m to 10 ?m. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.Type: ApplicationFiled: January 10, 2023Publication date: July 20, 2023Inventors: I-PENG YAO, YUNG-CHANG HUNG, HSIEN-CHANG HUNG, LYANG-GUNG WANG, HSIN-RU SONG, JENG YI WU, CHI CHE HUANG
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Patent number: 10702970Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.Type: GrantFiled: January 5, 2018Date of Patent: July 7, 2020Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wei-Te Liu, Wen-Chieh Wu, Yung-Chang Hung
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Patent number: 10076818Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.Type: GrantFiled: July 14, 2015Date of Patent: September 18, 2018Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
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Publication number: 20180193974Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.Type: ApplicationFiled: January 5, 2018Publication date: July 12, 2018Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, WEI-TE LIU, WEN-CHIEH WU, YUNG-CHANG HUNG
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Patent number: 9889630Abstract: The sheet of a polishing equipment of the present invention includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.Type: GrantFiled: August 5, 2009Date of Patent: February 13, 2018Assignee: BESTAC ADVANCED MATERIAL CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu
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Patent number: 9862071Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.Type: GrantFiled: September 21, 2010Date of Patent: January 9, 2018Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
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Publication number: 20170239783Abstract: The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced.Type: ApplicationFiled: April 14, 2017Publication date: August 24, 2017Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG, WEN-CHIEH WU
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Publication number: 20170203407Abstract: A back pad capable of color rendering end-of-life includes an absorption layer, a dye capsule layer and a carrier layer. The absorption layer has a surface. The dye capsule layer is disposed on the surface of the absorption layer. The carrier layer is laminated onto the dye capsule layer. The dye capsule layer of the present disclosure can be dissolved to release dyes after water penetrates in the back pad, and the end-of-life of the back pad can be easily determined through a color-rendering effect of the dyes.Type: ApplicationFiled: May 9, 2016Publication date: July 20, 2017Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG
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Publication number: 20160089764Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.Type: ApplicationFiled: July 14, 2015Publication date: March 31, 2016Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, LYANG-GUNG WANG
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Patent number: 9193028Abstract: The present invention relates to a sheet for mounting a workpiece, which includes a sheet body. The sheet body includes a top surface, a plurality of foamed pores, and a plurality of surface holes or at least one surface groove. The top surface is used for mounting a workpiece. The foamed pores are disposed in the interior of the sheet body. The surface holes or the surface groove have opening on the top surface but does not communicate with the foamed pores. The surface holes or the surface groove is formed by machining, and arranged in at least one pattern. Whereby, the time for taking off the workpiece from the sheet is reduced.Type: GrantFiled: November 2, 2011Date of Patent: November 24, 2015Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu, Wei-Te Liu
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Patent number: 9044840Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.Type: GrantFiled: April 21, 2011Date of Patent: June 2, 2015Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Chun-Ta Wang, Hsin-Ru Song
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Patent number: 8765259Abstract: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.Type: GrantFiled: October 19, 2010Date of Patent: July 1, 2014Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
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Publication number: 20140090774Abstract: The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced.Type: ApplicationFiled: October 3, 2013Publication date: April 3, 2014Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG, WEN-CHIEH WU
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Patent number: 8491359Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.Type: GrantFiled: August 24, 2010Date of Patent: July 23, 2013Assignee: Bestac Advanced Material Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
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Patent number: 8485869Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.Type: GrantFiled: September 24, 2010Date of Patent: July 16, 2013Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
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Patent number: 8414669Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.Type: GrantFiled: September 16, 2010Date of Patent: April 9, 2013Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
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Publication number: 20120126472Abstract: The present invention relates to a sheet for mounting a workpiece, which includes a sheet body. The sheet body includes a top surface, a plurality of foamed pores, and a plurality of surface holes or at least one surface groove. The top surface is used for mounting a workpiece. The foamed pores are disposed in the interior of the sheet body. The surface holes or the surface groove have opening on the top surface but does not communicate with the foamed pores. The surface holes or the surface groove is formed by machining, and arranged in at least one pattern. Whereby, the time for taking off the workpiece from the sheet is reduced.Type: ApplicationFiled: November 2, 2011Publication date: May 24, 2012Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, WEN-CHIEH WU, WEI-TE LIU
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Publication number: 20120094584Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.Type: ApplicationFiled: April 21, 2011Publication date: April 19, 2012Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, CHUN-TA WANG, HSIN-RU SONG
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Patent number: 8087975Abstract: The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect.Type: GrantFiled: June 4, 2009Date of Patent: January 3, 2012Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Zong-Yao Ku
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Publication number: 20110070814Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.Type: ApplicationFiled: September 21, 2010Publication date: March 24, 2011Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang