Patents by Inventor Lyndon James Larson

Lyndon James Larson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6940177
    Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 ?m/m° C. between ?40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: September 6, 2005
    Assignee: Dow Corning Corporation
    Inventors: Stanton James Dent, Lyndon James Larson, Robert Thomas Nelson, Debra Charilla Rash
  • Publication number: 20030214051
    Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 &mgr;m/m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.
    Type: Application
    Filed: May 16, 2002
    Publication date: November 20, 2003
    Inventors: Stanton James Dent, Lyndon James Larson, Robert Thomas Nelson, Debra Charilla Rash