Abstract: An apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

Abstract: A method and apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

Abstract: A megasonic bath with horizontal wafer orientation that may be conveniently interfaced with brush scrub systems. The megasonic transducer creates a sonic energy flow in the direction of the wafers. The sonic energy causes cavitation which loosens and displaces particles from the surface of the wafers. Water jets produce a horizontal flow across the wafer surfaces. The horizontal flow created by the water jets keeps the wafer surfaces wet, exposes the surfaces to fresh chemicals, and removes the particles which have been displaced or loosened by the sonic energy.

Abstract: An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination.

Abstract: An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination.

Abstract: An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination.