Patents by Inventor Lyubomir Micic

Lyubomir Micic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for manufacturing a semiconductor device
    Patent number: 5232463
    Abstract: An apparatus for manufacturing a semiconductor device having two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and having one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between the sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).
    Type: Grant
    Filed: September 18, 1992
    Date of Patent: August 3, 1993
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Lyubomir Micic, Gunter Gartlein, Eberhard Schmitt, Axel Muller, Egon Seng, Siegfried Spindler
  • Method of manufacturing an encapsulated semiconductor device with a can type housing
    Patent number: 5166098
    Abstract: This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: November 24, 1992
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Lyubomir Micic, Gunter Gartlein, Eberhard Schmitt, Axel Muller, Egon Seng, Siegfried Spindler
  • Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method
    Patent number: 5023702
    Abstract: This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can.In the manufacturing method the manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).
    Type: Grant
    Filed: August 4, 1989
    Date of Patent: June 11, 1991
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Lyubomir Micic, Gunter Gartlein, Eberhard Schmitt, Axel Muller, Egon Seng, Siegfried Spindler