Abstract: A chip scale package with outer dimensions for high of semiconductor chips to facilitate handling, testing, and later attachment of the package to further electrical circuitry. The chip scale package has four main components: semiconductor chip, a lead frame, a connection between the semiconductor chip and the lead frame, and an encapsulation sealing the semiconductor chip from the surrounding atmosphere. The semiconductor chip has a body, an active surface, and the dimensions that are between about 70% and 80% of the outer dimensions of the chip scale package. The lead frame has an intermediate path directly in line with, and perpendicular to, the surface of the semiconductor chip, thereby minimizing parasitic inductance and capacitance, and a thermal or ground slug.

Abstract: A radio frequency power amplifier for a battery powered handset unit of a wireless communications system having a low power signal amplification path and a high power signal amplification path. Logic and biasing means within the handset select between the low power signal path and the high power signal depending upon the handset being within or outside a prescribed distance from a base station. In this way, the signals received at the base station from the handset are at the required power level.

Abstract: An apparatus and process are described for the cooling and condensing of sulfur and water vapors from a Claus gas below the sulfur freezing point (248.degree. F.) at low pressure (<30 psia), so that solid sulfur and condensed water are simultaneously removed from the Claus gas without solid sulfur plugging of the separation equipment and with efficient separation of the sulfur from water.