Abstract: A method and system for photodetector packaging system is provided with a insulating substrate having a shoulder section and a wire bond is used for coupling the photodetector to the insulating substrate at the shoulder section. The system includes an optical fiber that directs incident light directly to the photodetector. Also provided is a method and system for packaging photodetectors with a insulating substrate using conducting vias and a wire bond to couple the photodetector to the insulating substrate. The system includes conducting tabs that are coupled to the conducting vias. The metal tabs are coupled with a transimpedance amplifier by wire bonds and the transimpedance amplifier is coupled to a limiting amplifier by wire bonds.

Abstract: A system and apparatus for packaging a laser diode is provided according to the present invention. It includes a solid structure having a first cavity, wherein the first cavity receives a fiber pipe with optical fiber, which is aligned to the laser diode. The solid structure also includes a recess that receives the fiber pipe; and a step for receiving a sealing ring. The solid structure is multi-layered and may be manufactured from ceramic material, beryllium oxide or aluminum nitride. The solid structure includes a second cavity that accommodates a fiber alignment mechanism; a sub-mount on which the laser diode is placed; and/or heat sink used for conducting heat from the laser diode.

Abstract: A system and process is provided for packaging optical-electronic components used in fiber-optics networks. A top lid with an opening covers all the components of the optical-electronic package. A fiber boot with a groove is provided, wherein the opening in the top lid mates with the fiber boot groove. The fiber boot groove is located between plural shoulders. An optical fiber passes through an opening in the fiber boot and is firmly held within the fiber boot.

Abstract: A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.

Abstract: A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.

Abstract: A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an ?s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.

Abstract: A photo-voltaic power cell based on a photoelectric semiconductor compound and the method of using and making the same. The semiconductor compound in the photo-voltaic power cell of the present invention can be electrolytically formed at a cathode in an electrolytic solution by causing discharge or decomposition of ions or molecules of a non-metallic component with deposition of the non-metallic component on the cathode and simultaneously providing ions of a metal component which discharge and combine with the non-metallic component at the cathode thereby forming the semiconductor compound film material thereon. By stoichiometrically adjusting the amounts of the components, or otherwise by introducing dopants into the desired amounts, an N-type layer can be formed and thereafter a P-type layer can be formed with a junction therebetween. The invention is effective in producing homojunction semiconductor materials and heterojunction semiconductor materials.