Abstract: Embodiments of a semiconductor device and method provide a quad flat no-lead semiconductor package which can have an arrangement of both chip-on-lead (COL) style leads and a die pad for supporting a die, and can also provide non-COL leads, both COL leads and a leadframe power pad, COL leads which have varying lengths to reduce stress resulting from thermal mismatch between a semiconductor die and leads, and a die pad with a curved, meandering edge to reduce stress resulting from thermal mismatch between the semiconductor die and the die pad.

Abstract: A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the tape. The combination includes a frame for holding edges of a tape carrying a plurality of singulated devices, and a vacuum chuck having upper surfaces for contacting an underside of a tape carrying a plurality of singulated devices. The vacuum chuck extends along a perimeter circumscribing the singulated devices, and at least one groove is defined in the upper surface of the vacuum chuck. Conduit for providing fluid communication between the groove and a vacuum source are provided. Upon evacuation of the volume defined between the groove and the tape, the tape is drawn down into the groove and stretched, thereby increasing the separation or gap between adjacent dice and reducing the risk of damage upon removal of the dice.

Abstract: A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the tape. The combination includes a frame for holding edges of a tape carrying a plurality of singulated devices, and a vacuum chuck having upper surfaces for contacting an underside of a tape carrying a plurality of singulated devices. The vacuum chuck extends along a perimeter circumscribing the singulated devices, and at least one groove is defined in the upper surface of the vacuum chuck. Conduit for providing fluid communication between the groove and a vacuum source are provided. Upon evacuation of the volume defined between the groove and the tape, the tape is drawn down into the groove and stretched, thereby increasing the separation or gap between adjacent dice and reducing the risk of damage upon removal of the dice.

Abstract: The transport of singulated die devices (110) is improved by utilizing condition sensitive adhesive tape (102) in a die transport system (100). Condition sensitive adhesive tape (102) is adhered to the bottom surface of a carrier plate (104) so as to cover a series of holes (106) formed in the carrier plate (104). The tape (102) is preferably heat sensitive adhesive tape (102) and may alternatively be ultraviolet light sensitive adhesive tape (102). The die transport system (100) contains die devices (110) in the carrier plate (104) by adhering the condition sensitive adhesive tape (102) to the bottom surface of the die devices (110). To release the die devices (110), the tape (102) is exposed to a certain condition in order to diminish its adhesiveness. Then, a vacuum suction force is used to pick up the die device (110) and remove it from the transport system (100).

Abstract: The transport of singulated die devices (110) is improved by utilizing condition sensitive adhesive tape (102) in a die transport system (100). Condition sensitive adhesive tape (102) is adhered to the bottom surface of a carrier plate (104) so as to cover a series of holes (106) formed in the carrier plate (104). The tape (102) is preferably heat sensitive adhesive tape (102) and may alternatively be ultraviolet light sensitive adhesive tape (102). The die transport system (100) contains die devices (110) in the carrier plate (104) by adhering the condition sensitive adhesive tape (102) to the bottom surface of the die devices (110). To release the die devices (110), the tape (102) is exposed to a certain condition in order to diminish its adhesiveness. Then, a vacuum suction force is used to pick up the die device (110) and remove it from the transport system (100).