Patents by Inventor Ma Hongzhong

Ma Hongzhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9378885
    Abstract: A low cost, reduced form factor, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes a unitary header assembly construction that ensures device coplanarity and also includes vertically oriented terminal pins. The device utilizes preconfigured flat coil windings that are disposed directly within a planar core. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 28, 2016
    Assignee: Pulse Electronics, Inc.
    Inventors: Ma Hongzhong, Robert Lu
  • Publication number: 20150130577
    Abstract: A low cost, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes an interleaved flat coil and coil winding arrangement that ensures low leakage inductance while using a combination of flat coil windings and self-bonded Litz coil windings. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for using and manufacturing the aforementioned inductive devices are also disclosed.
    Type: Application
    Filed: September 3, 2014
    Publication date: May 14, 2015
    Inventors: Ma Hongzhong, Li Huatu
  • Publication number: 20140340186
    Abstract: A low cost, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes an interleaved flat coil arrangement that ensures low leakage inductance while using a smaller number of flat coil windings compared to prior art devices. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.
    Type: Application
    Filed: April 2, 2014
    Publication date: November 20, 2014
    Inventors: Wang Xianfeng, Ma Hongzhong
  • Publication number: 20130278371
    Abstract: A low cost, reduced form factor, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes a unitary header assembly construction that ensures device coplanarity and also includes vertically oriented terminal pins. The device utilizes preconfigured flat coil windings that are disposed directly within a planar core. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 24, 2013
    Inventors: Ma Hongzhong, Robert Lu