Abstract: A method for the preparation of an optical waveguide device characterized in that it comprises a first step for forming a first resin film on a substrate provided thereon with a lower clad layer; a second step for patterning the first resin film into a shape of an optical waveguide to thus form a core layer; a third step for forming a second resin film by coating the surfaces of the lower clad layer and the core layer with a solution containing a material for forming the second resin film according to the spin-coating method in such a manner that the thickness of the resulting film as measured from the upper surface of the lower clad layer and as determined after drying ranges from 3 to 10 times the thickness of the core layer and then drying the coated layer; and a fourth step for removing the second resin film in such a manner that the thickness of the second resin film as determined from the upper surface of the lower clad layer is less than 3 times that of the core layer and that the second resin film thu

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess, and optical elements formed. The optical element comprises a substrate 1, an optical waveguide structure layer 10 of resin disposed in a part of the region on the substrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical waveguide structure layer 10 includes an optical waveguide 4 and a clad layer. A coupler layer is disposed between the substrate 1 and the optical waveguide structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical waveguide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less than 20 angstroms.

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess, and optical elements formed. The optical element comprises a substrate 1, an optical waveguide structure layer 10 of resin disposed in a part of the region on the substrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical waveguide structure layer 10 includes an optical waveguide 4 and a clad layer. A coupler layer is disposed between the substrate 1 and the optical waveguide structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical waveguide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less than 20 angstroms.

Abstract: A method of producing optical elements using a substrate having a recess, which is capable of easily removing a film in the recess. An optical element comprises a substrate 1, and optical wavefuide structure layer 10 of resin disposed in a part of the region on the suvstrate 1, and a recess 21 formed in the region where the optical waveguide structure layer 10 is not disposed. The optical wavefuide structure layer 10 includes an optical wavefude 4 and a clad layer. A coupler layer is disposed vetween the substrate 1 and the optical wavefude structure layer 10, and the film thickness distribution range of the coupler layer in the region below the optical wavefuide 4 is such that the minimum film thickness is not more than 30 angstroms and the maximum film thickness is not less htan 20 angstroms.

Abstract: A method for the preparation of an optical waveguide device characterized in that it comprises a first step for forming a first resin film on a substrate provided thereon with a lower clad layer; a second step for patterning the first resin film into a shape of an optical waveguide to thus form a core layer; a third step for forming a second resin film by coating the surfaces of the lower clad layer and the core layer with a solution containing a material for forming the second resin film according to the spin-coating method in such a manner that the thickness of the resulting film as measured from the upper surface of the lower clad layer and as determined after drying ranges from 3 to 10 times the thickness of the core layer and then drying the coated layer; and a fourth step for removing the second resin film in such a manner that the thickness of the second resin film as determined from the upper surface of the lower clad layer is less than 3 times that of the core layer and that the second resin film thu