Patents by Inventor Madoka Minagawa

Madoka Minagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8437584
    Abstract: In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 7, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Yasunobu Matsuoka, Toshiki Sugawara, Koichiro Adachi, Naoki Matsushima, Saori Hamamura, Madoka Minagawa, Norio Chujo
  • Patent number: 8406581
    Abstract: A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: March 26, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Saori Hamamura, Naoki Matsushima, Madoka Minagawa, Satoshi Kaneko, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Tsutomu Kono
  • Patent number: 8401347
    Abstract: A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: March 19, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Naoki Matsushima, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Madoka Minagawa, Saori Hamamura, Satoshi Kaneko, Tsutomu Kono
  • Publication number: 20120128292
    Abstract: A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devices 2a and 2b are disposed on a circuit board 1, so that they are optically coupled with optical guides 11 formed on the circuit board 1, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film 31, and an electric wiring layer 3 is laminated, so that the electrodes of the optical devices 2 and wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element 4; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing.
    Type: Application
    Filed: June 2, 2010
    Publication date: May 24, 2012
    Applicant: Hitachi-Ltd.
    Inventors: Saori Hamamura, Naoki Matsushima, Madoka Minagawa, Satoshi Kaneko, Norio Chujo, Yasunobu Matsuoka, Toshiki Sugawara, Tsutomu Kono
  • Publication number: 20120024959
    Abstract: An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.
    Type: Application
    Filed: March 31, 2011
    Publication date: February 2, 2012
    Inventors: Madoka MINAGAWA, Naoya KANDA, Isao SAKAMA, Shigeru SAGAWA, Daisuke SHIBATA
  • Publication number: 20110026878
    Abstract: In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.
    Type: Application
    Filed: July 27, 2010
    Publication date: February 3, 2011
    Applicant: Hitachi, Ltd.
    Inventors: Yasunobu MATSUOKA, Toshiki Sugawara, Koichiro Adachi, Naoki Matsushima, Saori Hamamura, Madoka Minagawa, Norio Chujo
  • Publication number: 20100209041
    Abstract: A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.
    Type: Application
    Filed: November 23, 2009
    Publication date: August 19, 2010
    Applicant: HITACHI, LTD.
    Inventors: Naoki MATSUSHIMA, Norio CHUJO, Yasunobu MATSUOKA, Toshiki SUGAWARA, Madoka MINAGAWA, Saori HAMAMURA, Satoshi KANEKO, Tsutomu KONO
  • Patent number: 7655207
    Abstract: An aluminum complex hydroxide salt having Al oxide octahedral layers and a divalent anion among the octahedral layers, wherein an aluminosilicate anion expressed by the following general formula (1), [NapAlqSirOz]2???(1) wherein p, q, r and z are positive numbers satisfying, 5?z?20, z=(p/2)+(3q/2)+2r+1, 0<p/q<1, 0.01?q/r?1 is, at least, contained as the divalent anion. The aluminum complex hydroxide salt can be favorably used as a compounding agent for resins, and exhibits excellent heat retaining property as well as excellent transparency particularly when it is mixed as a heat retaining agent into films for agricultural use.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: February 2, 2010
    Assignee: Mizusawa Chemicals, Ltd.
    Inventor: Madoka Minagawa
  • Publication number: 20090110625
    Abstract: An aluminum complex hydroxide salt having Al oxide octahedral layers and a divalent anion among the octahedral layers, wherein an aluminosilicate anion expressed by the following general formula (1), [NapAlqSirOz]2???(1) wherein p, q, r and z are positive numbers satisfying, 5?z?20, z=(p/2)+(3q/2)+2r+1, 0<p/q<1, 0.01?q/r?1 is, at least, contained as the divalent anion. The aluminum complex hydroxide salt can be favorably used as a compounding agent for resins, and exhibits excellent heat retaining property as well as excellent transparency particularly when it is mixed as a heat retaining agent into films for agricultural use.
    Type: Application
    Filed: April 19, 2007
    Publication date: April 30, 2009
    Inventor: Madoka Minagawa
  • Patent number: 7190072
    Abstract: When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: March 13, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Naoya Kanda, Madoka Minagawa, Kosuke Inoue, Hiroshi Homma
  • Patent number: 7172130
    Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: February 6, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Shigeharu Tsunoda, Hiroshi Hozoji, Madoka Minagawa
  • Patent number: 7122087
    Abstract: There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: October 17, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Naoya Kanda, Kosuke Inoue, Madoka Minagawa, Shigeharu Tsunoda
  • Patent number: 7057283
    Abstract: A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide ?-ray shielding of the semiconductor device.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: June 6, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda, Madoka Minagawa, Naoya Kanda, Ichiro Anjo, Asao Nishimura, Akira Yajima, Kenji Ujiie
  • Publication number: 20050230791
    Abstract: When an RFID-tag is formed by joining a semiconductor chip (RFID chip) to an antenna consisting of a rolled metal foil or the like using ultrasonic waves, the pressure impressed to the semiconductor chip is suppressed to avoid the damage of the semiconductor chip. For this purpose, the present invention provides an RFID-tag 1 wherein gold bumps are joined to the metal foil by pressing the gold bumps formed on the semiconductor chip against an antenna member, and impressing ultrasonic waves; and the RFID-tag wherein a matte surface having a low glossiness is formed on the metal foil, or a surface having shallow rolling streaks is formed on the metal foil, and gold bumps are joined to the surface.
    Type: Application
    Filed: March 10, 2005
    Publication date: October 20, 2005
    Inventors: Naoya Kanda, Madoka Minagawa, Kosuke Inoue, Hiroshi Homma
  • Patent number: 6930388
    Abstract: A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: August 16, 2005
    Assignee: Renesas Technology Corp.
    Inventors: Yoshihide Yamaguchi, Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda, Naoya Kanda, Madoka Minagawa, Ichiro Anjo, Asao Nishimura, Kenji Ujiie, Akira Yajima
  • Publication number: 20050130425
    Abstract: There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 16, 2005
    Inventors: Naoya Kanda, Kosuke Inoue, Madoka Minagawa, Shigeharu Tsunoda
  • Publication number: 20050101060
    Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.
    Type: Application
    Filed: October 8, 2004
    Publication date: May 12, 2005
    Inventors: Shigeharu Tsunoda, Hiroshi Hozoji, Madoka Minagawa
  • Patent number: 6835320
    Abstract: A composite metal polybasic salt containing a trivalent metal, zinc metal and a divalent metal as metal components and having a novel crystal structure, and a method of preparing the same. The invention further deals with a composite metal polybasic salt which has anion-exchanging property, which by itself is useful as an anion-exchanger, capable of introducing anions suited for the use upon anion-exchange, and finds a wide range of applications, and a method of preparing the same. The composite metal polybasic salt has a particular chemical composition and X-ray diffraction peaks, exhibiting peaks at 2&thgr;=2 to 15°, 2&thgr;=19.5 to 24° and 2&thgr;=33 to 50°, and a single peak at 2&thgr;=60 to 64° in the X-ray diffraction (Cu-&agr;).
    Type: Grant
    Filed: March 6, 2001
    Date of Patent: December 28, 2004
    Assignee: Mizusawa Industrial Chemicals, Ltd.
    Inventors: Yoshinobu Komatsu, Hitoshi Ishida, Hiroshi Igarashi, Masami Kondo, Madoka Minagawa, Tetsu Sato, Teiji Sato
  • Publication number: 20040234442
    Abstract: A composite metal polybasic salt containing a trivalent metal, zinc metal and a divalent metal as metal components and having a novel crystal structure, and a method of preparing the same. The invention further deals with a composite metal polybasic salt which has anion-exchanging property, which by itself is useful as an anion-exchanger, capable of introducing anions suited for the use upon anion-exchange, and finds a wide range of applications, and a method of preparing the same. The composite metal polybasic salt has a particular chemical composition and X-ray diffraction peaks, exhibiting peaks at 2&thgr;=2 to 15°, 2&thgr;=19.5 to 24° and 2&thgr;=33 to 50°, and a single peak at 2&thgr;=60 to 64° in the X-ray diffraction (Cu-&agr;).
    Type: Application
    Filed: May 3, 2004
    Publication date: November 25, 2004
    Inventors: Yoshinobu Komatsu, Hitoshi Ishida, Hiroshi Igarashi, Masami Kondo, Madoka Minagawa, Tetsu Sato, Teiji Sato
  • Patent number: 6822317
    Abstract: A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: November 23, 2004
    Assignee: Renesas Technology Corporation
    Inventors: Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda, Madoka Minagawa, Naoya Kanda, Ichiro Anjo, Asao Nishimura, Akira Yajima, Kenji Ujiie