Abstract: A radio and antenna system has a first microwave radio, second microwave radio, a first antenna and a dual mode coupler that has a first dual mode transmission line extending between a first port and a third port and a second dual mode transmission line extending between a second port and a microwave absorbing termination. The first microwave radio is coupled to the first port. The second microwave radio is coupled to the second port. The antenna is coupled to the third port. The first dual mode transmission line is coupled to the second dual mode transmission line so that microwave signals in either of the first dual mode transmission line and the second dual mode transmission line propagates microwave signals in the other of the first dual mode transmission line and the second dual mode transmission line.

Abstract: A radio and antenna system has a first microwave radio, second microwave radio, a first antenna and a dual mode coupler that has a first dual mode transmission line extending between a first port and a third port and a second dual mode transmission line extending between a second port and a microwave absorbing termination. The first microwave radio is coupled to the first port. The second microwave radio is coupled to the second port. The antenna is coupled to the third port. The first dual mode transmission line is coupled to the second dual mode transmission line so that microwave signals in either of the first dual mode transmission line and the second dual mode transmission line propagates microwave signals in the other of the first dual mode transmission line and the second dual mode transmission line.

Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.

Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.

Abstract: A multi-layer circuit comprises first and second transmission lines. The first transmission line includes vertically stacked bottom and middle dielectric layers. A conductive pattern is disposed between the bottom and middle dielectric layers. A bottom ground layer is in contact with a bottom surface of the bottom dielectric layer. The second transmission line is vertically stacked above the first transmission line and includes a top dielectric layer and a conductive pattern in contact with a top surface of the top dielectric layer and at least one ground layer separating a bottom surface of the top dielectric layer from the middle dielectric layer. At least one plated through hole electrically connects the first and second transmission lines. All of the dielectric layers comprise a ceramic-filled substrate with woven glass reinforcement.

Abstract: A circuit and method of making a multi-layer circuit including a microstrip and stripline.