Patents by Inventor MAHENDRA C. ORILALL
MAHENDRA C. ORILALL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964359Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.Type: GrantFiled: October 23, 2019Date of Patent: April 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Ashwin Chockalingham, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
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Publication number: 20240123568Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).Type: ApplicationFiled: June 21, 2023Publication date: April 18, 2024Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Patent number: 11958162Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 17, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Publication number: 20230330805Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.Type: ApplicationFiled: April 24, 2023Publication date: October 19, 2023Applicant: Applied Materials, Inc.Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
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Patent number: 11772229Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 11, 2019Date of Patent: October 3, 2023Assignee: Applied Materials, Inc.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Patent number: 11745302Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: March 22, 2021Date of Patent: September 5, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Patent number: 11724362Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: December 8, 2020Date of Patent: August 15, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
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Publication number: 20220402091Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: June 7, 2022Publication date: December 22, 2022Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Patent number: 11446788Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: August 15, 2019Date of Patent: September 20, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Ashwin Chockalingam, Ashavani Kumar, Fred C. Redeker, Nag B. Patibandla
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Publication number: 20220056222Abstract: Polymer compositions capable of being crosslinked, for example by ionizing radiation such as electron beam radiation, are prepared from masterbatch compositions containing thermoplastic polymer, multi(meth)acrylate-functionalized resin, and, optionally, scorch retarder (which is preferably present if the multi(meth)acrylate-functionalized resin has a low (meth)acrylate equivalent weight). Such polymer compositions are useful for the manufacture of articles such as films, fibers and the like.Type: ApplicationFiled: December 16, 2019Publication date: February 24, 2022Inventors: Michael A. Bailey, Jeffrey Klang, Mahendra C. Orilall, Zackariah J. Weinert, Weijin Lu
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Publication number: 20220033606Abstract: Foamed products are produced using multi-component systems which are advantageously free of isocyanate. The components of the systems are combined, with the resulting mixture then undergoing curing and foaming to provide a foamed product, wherein the characteristics of the foamed product may be varied by selecting particular reactants to be present in the multi-component system. The systems employ at least one (meth)acrylate compound having two or more (meth)acrylate functional groups per molecule, at least one thiol compound having two or more thiol functional groups per molecule, at least one free radical initiator, at least one blowing agent, at least one surfactant, and optionally at least one promoter for the free radical initiator.Type: ApplicationFiled: December 2, 2019Publication date: February 3, 2022Inventors: Zackariah J. WEINERT, Jon SCHOLTE, Michael A. BAILEY, Mahendra C. ORILALL
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Publication number: 20210205951Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: ApplicationFiled: March 22, 2021Publication date: July 8, 2021Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
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Publication number: 20210107116Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: ApplicationFiled: December 8, 2020Publication date: April 15, 2021Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh Jagdish KHANNA, Jason G. FUNG, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Gregory E. MENK, Nag B. PATIBANDLA
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Patent number: 10953515Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.Type: GrantFiled: November 16, 2016Date of Patent: March 23, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
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Patent number: 10875145Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 22, 2015Date of Patent: December 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10875153Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: January 20, 2016Date of Patent: December 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Ashwin Chockalingam
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Patent number: 10821573Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 19, 2015Date of Patent: November 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10800000Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.Type: GrantFiled: January 29, 2016Date of Patent: October 13, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Mahendra C. Orilall, Fred C. Redeker, Rajeev Bajaj
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Publication number: 20200147750Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Patent number: 10618141Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.Type: GrantFiled: October 20, 2016Date of Patent: April 14, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Ashwin Chockalingam, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield