Abstract: A wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound includes at least one of a polyethylene-based resin and a polypropylene-based resin as an additive. The method of preparing the wholly aromatic liquid crystalline polyester resin compound includes adding at least one of a polyethylene-based resin and a polypropylene-based resin as an additive.

Abstract: Provided are a wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound comprises a first wholly aromatic liquid crystalline polyester resin with a low melting point, a second wholly aromatic liquid crystalline polyester resin with a high melting point, and an additive, wherein the amount of the first wholly aromatic liquid crystalline polyester resin is 5 to 10 parts by weight with respect to 100 parts by weight of the second wholly aromatic liquid crystalline polyester resin.

Abstract: Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices.

Abstract: Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.

Abstract: A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.

Abstract: A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

Abstract: Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.

Abstract: A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

Abstract: The invention relates to a method of preparing wholly aromatic polyester including: mixing monomers, introducing the mixed monomers into a reactor having a rectangular or trapezoidal plate type stirring impeller, and polymerizing the introduced monomers through esterification with a power per unit volume of 10˜60 kW/m3, a length (L) to diameter (D) ratio of the stirring impeller is 1˜3:1, and a distance between the bottom of the reactor and a lower portion of the stirring impeller is 1/100˜ 1/15 times of the diameter (D); b) pulverizing the obtained polymer; and c) solid state polymerizing the pulverized polymer.

Abstract: Disclosed herein is a liquid crystal polyester resin composition and a printed circuit board using the composition. The composition comprises a liquid crystal polyester, a polybenzimidazole and an aprotic solvent. The composition exhibits good thermal stability and has a low dielectric constant. The composition can be advantageously used as a material for printed circuit boards (PCBS) used in semiconductor packages, mobile devices and LCD devices.