Patents by Inventor Maja Schroeder

Maja Schroeder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8877868
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: November 4, 2014
    Assignees: Henkel IP & Holding GmbH, Henkel US IP LLC
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • Publication number: 20140238603
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited, Henkel Corporation
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • Patent number: 8076422
    Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: December 13, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Marcus Heemann, Eckhard Pürkner, Volker Erb, Maja Schroeder, Dirk Vianden
  • Publication number: 20100256274
    Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.
    Type: Application
    Filed: June 11, 2010
    Publication date: October 7, 2010
    Inventors: Marcus Heemann, Eckhard Pürkner, Volker Erb, Maja Schroeder, Dirk Vianden