Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Abstract: An image forming apparatus includes: an extraction unit configured to extract an image for position detection from job image data; a first image forming unit configured to form the image for position detection on a recording medium; a second image forming unit disposed on a downstream in a feeding direction of the recording medium relative to the first image forming unit; a first detection unit configured to detect the image for position detection formed by the first image forming unit; and a determining unit configured to determine a correction amount of an image forming position of the second image forming unit based on a position of the image for position detection that is detected by the detection unit and a position of the image for position detection in the image data.

Abstract: An image forming apparatus includes: an extraction unit configured to extract an image for position detection from job image data; a first image forming unit configured to form the image for position detection on a recording medium; a second image forming unit disposed on a downstream in a feeding direction of the recording medium relative to the first image forming unit; a first detection unit configured to detect the image for position detection formed by the first image forming unit; and a determining unit configured to determine a correction amount of an image forming position of the second image forming unit based on a position of the image for position detection that is detected by the detection unit and a position of the image for position detection in the image data.

Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.

Abstract: An ejection apparatus includes: a first ejection unit configured to eject droplets on a recording medium conveyed in a conveyance direction to form an image for detection; a first detection unit disposed downstream of the first ejection unit and configured to detect the image for detection; a second ejection unit disposed downstream of the detection unit and configured to eject droplets on the recording medium; and a control unit configured to: predict a first elongation amount of the recording medium based on a first difference between a first set time period and a first detection time period from a reference time point to a first detection time point when the image for detection is detected by the first detection unit; and perform delay control on the second ejection unit for delaying an ejection timing of the second ejection unit based on the predicted elongation amount.

Abstract: An image processing apparatus includes a processor. The processor is configured to set an image position of a reference image in a transport direction of a recording medium to an arbitrary position on a specific page of the recording medium. The reference image is formed using a first color and serves as a reference for an image position of an image of a second color to be formed after the image of the first color is formed. The processor is also configured to adjust the image position for the second color on an adjacent page, located adjacently upstream of the specific page in the transport direction, by using image information of the reference image formed on the specific page.

Abstract: An image forming apparatus includes an image forming unit, first and second detectors, and a corrector. The image forming unit includes first and second image forming units disposed downstream of the first unit in a transport direction of a recording medium and causes the first and second units to form predetermined correction images onto the recording medium. The first detector is disposed downstream of the first unit and upstream of the second unit in the transport direction, and detects the correction image formed by the first unit. The second detector is disposed downstream of the second unit in the transport direction and detects the correction image formed by the second unit. The corrector corrects an image position of the second unit in a width direction of the recording medium by using the correction images formed by the first and second units and detected by the first and second detectors.

Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: An ejection apparatus includes: a first ejection unit configured to eject droplets on a recording medium conveyed in a conveyance direction to form an image for detection; a first detection unit disposed downstream of the first ejection unit and configured to detect the image for detection; a second ejection unit disposed downstream of the detection unit and configured to eject droplets on the recording medium; and a control unit configured to: predict a first elongation amount of the recording medium based on a first difference between a first set time period and a first detection time period from a reference time point to a first detection time point when the image for detection is detected by the first detection unit; and perform delay control on the second ejection unit for delaying an ejection timing of the second ejection unit based on the predicted elongation amount.

Abstract: An image processing apparatus includes a processor. The processor is configured to set an image position of a reference image in a transport direction of a recording medium to an arbitrary position on a specific page of the recording medium. The reference image is formed using a first color and serves as a reference for an image position of an image of a second color to be formed after the image of the first color is formed. The processor is also configured to adjust the image position for the second color on an adjacent page, located adjacently upstream of the specific page in the transport direction, by using image information of the reference image formed on the specific page.

Abstract: An image forming apparatus includes an image forming unit, first and second detectors, and a corrector. The image forming unit includes first and second image forming units disposed downstream of the first unit in a transport direction of a recording medium and causes the first and second units to form predetermined correction images onto the recording medium. The first detector is disposed downstream of the first unit and upstream of the second unit in the transport direction, and detects the correction image formed by the first unit. The second detector is disposed downstream of the second unit in the transport direction and detects the correction image formed by the second unit. The corrector corrects an image position of the second unit in a width direction of the recording medium by using the correction images formed by the first and second units and detected by the first and second detectors.

Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: It is an object to provide a technique capable of providing a semiconductor device with information indicating a plurality of electrical characteristics. A semiconductor device sorting system includes a characteristic measurement unit measuring electrical characteristics of a semiconductor device, a rank determination database for classifying the electrical characteristics into ranks, a calculation unit classifying the plurality of electrical characteristics of the semiconductor device measured by the characteristic measurement unit into a plurality of ranks with reference to the rank determination database, a writing unit converting the plurality of ranks classified by the calculation unit into a graphic symbolic code and forming the graphic symbolic code on the semiconductor device, a reading unit reading the plurality of ranks from the graphic symbolic code formed on the semiconductor device, and a sorting unit sorting the semiconductor device based on the plurality of ranks being read by the reading unit.

Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.

Abstract: A power module includes one control IC and a plurality of reverse conducting insulated gate bipolar transistors (RC-IGBTs). The control IC has the functions of a high-voltage IC and a low-voltage IC. The plurality of RC-IGBTs are disposed on three of four sides of the control IC and connected to the control IC through only wires.