Abstract: A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.

Abstract: The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element.

Abstract: A multiphoton-excitation laser scanning microscope capable of efficiently collecting fluorescence emitted from a specimen to acquire a brighter multiphoton-excitation fluorescence image is provided. This multiphoton-excitation laser scanning microscope includes a multiphoton-excitation laser light source for emitting ultrashort pulsed laser light, a light-scanning unit configured to scan a specimen with the ultrashort pulsed laser light emitted from the multiphoton-excitation laser light source in two dimensions, an objective lens configured to focus the ultrashort pulsed laser light scanned by the light-scanning unit on the specimen, a collector lens disposed opposite the objective lens, with the light-scanning unit disposed therebetween, to collect fluorescence emitted from the specimen, and a light detector configured to detect the fluorescence collected by the collector lens. The collector lens has a higher numerical aperture and a larger field number than the objective lens.

Abstract: A steering system includes a steering unit which can be configured to convert an operation input to an input shaft into an arbitrary amount of rotation or an arbitrary turning force and output the arbitrary amount of rotation or the arbitrary turning force from an output shaft. A steering handlebar can be configured to be coupled to the input shaft. A support bracket can be configured to be coupled to the output shaft and to support a front wheel of the vehicle. A housing can be configured to accommodate the steering unit. The steering unit can be configured to be mounted to a front end portion of a vehicle body frame of the vehicle integrally therewith by the housing.

Abstract: In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

Abstract: A semiconductor device in which a chip is embedded in a wiring board and bump electrodes formed over the front surface of the semiconductor chip are flip-chip coupled to wiring formed in the wiring board and the entire back surface of the semiconductor chip functions well as a back electrode and a method of manufacturing the semiconductor device. A semiconductor chip is embedded inside a wiring board. The semiconductor chip is flip-chip coupled (face down) to a base substrate as the core layer of the wiring board through bump electrodes. A conductive film is formed over the semiconductor chip's surface reverse to the surface over which bump electrodes are formed. The conductive film functions as a back electrode which supplies a reference voltage to the integrated circuit in the semiconductor chip. The conductive film is electrically coupled to third-layer wiring through vias.

Abstract: A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.

Abstract: A steering system includes a steering unit which can be configured to convert an operation input to an input shaft into an arbitrary amount of rotation or an arbitrary turning force and output the arbitrary amount of rotation or the arbitrary turning force from an output shaft. A steering handlebar can be configured to be coupled to the input shaft. A support bracket can be configured to be coupled to the output shaft and to support a front wheel of the vehicle. A housing can be configured to accommodate the steering unit. The steering unit can be configured to be mounted to a front end portion of a vehicle body frame of the vehicle integrally therewith by the housing.

Abstract: In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

Abstract: In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

Abstract: A multiphoton-excitation laser scanning microscope capable of efficiently collecting fluorescence emitted from a specimen to acquire a brighter multiphoton-excitation fluorescence image is provided. This multiphoton-excitation laser scanning microscope includes a multiphoton-excitation laser light source for emitting ultrashort pulsed laser light, a light-scanning unit configured to scan a specimen with the ultrashort pulsed laser light emitted from the multiphoton-excitation laser light source in two dimensions, an objective lens configured to focus the ultrashort pulsed laser light scanned by the light-scanning unit on the specimen, a collector lens disposed opposite the objective lens, with the light-scanning unit disposed therebetween, to collect fluorescence emitted from the specimen, and a light detector configured to detect the fluorescence collected by the collector lens. The collector lens has a higher numerical aperture and a larger field number than the objective lens.

Abstract: A microscope apparatus that can observe into the interior of a specimen and that can apply an optical stimulus over a wide area within a short period of time is provided. The microscope apparatus comprises at least one observation scanning optical system including a laser light source for emitting observation laser light, an objective lens, and a scanning optical system for two-dimensionally scanning the observation laser light in a predetermined examination plane of the specimen via the objective lens; and at least one stimulus optical system which includes a lamp light source for emitting light having a wavelength used for optical stimulation and which irradiates the specimen with the light emitted from the lamp light source.

Abstract: Packaging performance of a semiconductor device is improved. A semiconductor device has a package substrate having a base material formed of resin; a semiconductor chip mounted on a main surface of the package substrate; a tape substrates being stacked on the package substrate in several stages, and electrically connected to a substrate at a lower stage via a plurality of solder balls; a second-stage chip, third-stage chip, and fourth-stage chip mounted on the tape substrates at respective stages; and a plurality of solder balls provided on a back surface of the package substrate; wherein a sealing body, which resin-seals the semiconductor chip and is formed by resin molding, is formed on a main surface of a package substrate disposed at the lowest stage, and the sealing body is disposed between the package substrate at the lowest stage and the tape substrate stacked thereon.

Abstract: A work assignment system for assigning and composing a work formed from a plurality of work standards to a plurality of stations. A display displays the names of the plurality of work standards as composition targets. A composition condition is input. The plurality of work standards are divided in accordance with the composition condition and one group of the divided work standards is assigned to a station. The assignment result of the work standards of each station to a work assignment file is output.

Abstract: An imaging device includes an imager including an optical receiver, an optical element located on an optical path extending to the optical receiver, a substrate to which the imager is fixed, a casing which covers the imager and the optical element, and a dustproof light-shielding member interposed between the imager and the optical element. The dustproof light-shielding member has an opening which allows light to pass, and a fitting portion formed like a recess in which the imager is to be fitted. The dustproof light-shielding member is held between the imager and the optical element to form a sealed space, protecting a space between the imager and the optical element against dust.

Abstract: An information management system includes a work standard creation subsystem, a standard manhour database, a standard manhour setting subsystem, and a work assignment subsystem. The information management system downloads a work standard group with manhour data from the standard manhour setting subsystem and divisionally composes the work standards of the work standard group to a plurality of stations on the basis of a composition condition input by the user into the work assignment subsystem.

Abstract: It provides at a low price a compressor capable of preventing a waste oil pipe from falling off and curbing leakage of lubricating oil and oscillation of the pipe. An L-shaped waste oil pipe 8 for returning lubricating oil 20 to a bottom of a motor chamber 22 is connected to a waste oil passage 33 of a main frame 3 so as to put at least a part of the waste oil pipe 8 in elastic contact with an internal surface of an airtight container 2.

Abstract: In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

Abstract: There are provided a fixed-scroll moveable device which is capable of moving a fixed-scroll of a scroll compressor in the directions of an X axis and a Y axis, and an orbiting-scroll revolution compensation device which is capable of revolving an orbiting-scroll in a &thgr; direction by way of a main frame. An optimum angle of the fixed-scroll relative to the orbiting-scroll and an optimum wrap clearance are determined at the same time while orbitally moving the orbiting-scroll. Thereby, alignment of a scroll compression section is performed in a short time with a high precision including positioning of a rotating direction of the fixed-scroll relative to the orbiting-scroll.