Patents by Inventor Makoto Imanishi
Makoto Imanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8358018Abstract: An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.Type: GrantFiled: April 29, 2009Date of Patent: January 22, 2013Assignee: Panasonic CorporationInventors: Makoto Imanishi, Yoshihiro Tomura, Kentaro Kumazawa
-
Publication number: 20090278265Abstract: An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.Type: ApplicationFiled: April 29, 2009Publication date: November 12, 2009Applicant: Panasonic CorporationInventors: Makoto Imanishi, Yoshihiro Tomura, Kentaro Kumazawa
-
Publication number: 20080179378Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: October 31, 2007Publication date: July 31, 2008Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Patent number: 7387229Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: January 22, 2004Date of Patent: June 17, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Patent number: 7350684Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: April 26, 2005Date of Patent: April 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
-
Patent number: 7246430Abstract: In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.Type: GrantFiled: June 2, 2004Date of Patent: July 24, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takahiro Yonezawa, Ken Kobayashi, Mikio Hasegawa, Hiroshi Nasu, Makoto Imanishi, Katsuhiko Watanabe
-
Publication number: 20050191838Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: ApplicationFiled: April 26, 2005Publication date: September 1, 2005Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
-
Patent number: 6910613Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: June 29, 2001Date of Patent: June 28, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
-
Publication number: 20050071991Abstract: In the electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that have piezoelectric elements provided in a stack in the mounting direction of the electronic component. Therefore, the size in the horizontal direction of the load sensor can be reduced, and the load applied to the electronic component can be detected at the neighborhood of the mounting position of the electronic component. Moreover, by comparing a position in a two-dimensional space in which the load values in the X-direction and the Y-direction of the horizontal load are served as coordinate values with a tolerance range in the two-dimensional space, mounting failure can be detected from a deviation in the horizontal loads.Type: ApplicationFiled: June 2, 2004Publication date: April 7, 2005Inventors: Takahiro Yonezawa, Ken Kobayashi, Mikio Hasegawa, Hiroshi Nasu, Makoto Imanishi, Katsuhiko Watanabe
-
Patent number: 6787391Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: December 18, 2000Date of Patent: September 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Publication number: 20040149803Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: January 22, 2004Publication date: August 5, 2004Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
-
Publication number: 20040102030Abstract: A preheat device is installed, thereby executing before forming bumps to electrode parts a pre formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during a bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps formed can be heated under a bonding strength improvement condition by a bonding stage through controlling the heating by a controller.Type: ApplicationFiled: January 2, 2003Publication date: May 27, 2004Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
-
Patent number: 6619535Abstract: Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.Type: GrantFiled: April 27, 2001Date of Patent: September 16, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Takahiro Yonezawa, Shinji Kanayama, Ryoichiro Katano, Takaharu Mae
-
Patent number: 6568580Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.Type: GrantFiled: July 25, 2001Date of Patent: May 27, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe
-
Patent number: 6527905Abstract: A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently.Type: GrantFiled: November 2, 2000Date of Patent: March 4, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Akira Kabeshita, Kohei Enchi, Satoshi Shida
-
Patent number: 6494358Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.Type: GrantFiled: July 25, 2001Date of Patent: December 17, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe
-
Patent number: 6481616Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.Type: GrantFiled: October 17, 2001Date of Patent: November 19, 2002Assignee: Matsushita Electric Industrial Co. Ltd.Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
-
Patent number: 6392202Abstract: An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.Type: GrantFiled: September 19, 2001Date of Patent: May 21, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama
-
Publication number: 20020030087Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.Type: ApplicationFiled: October 17, 2001Publication date: March 14, 2002Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
-
Publication number: 20020011479Abstract: An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.Type: ApplicationFiled: September 19, 2001Publication date: January 31, 2002Inventors: Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama