Patents by Inventor Makoto Koyama
Makoto Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940048Abstract: A valve device includes a body that defines a passage through which a fluid flows, a shaft that is movably supported with respect to the body and defines an axis, a valve element that is fixed to the shaft to open and close the passage; and a cylindrical bearing bush that movably supports the shaft with respect to the body, in which the bearing bush includes a mixed region in which a metal core material and expanded graphite are mixed with each other, and a first expanded graphite region made of only the expanded graphite such that the metal core material is not exposed in an inner circumferential side region in contact with an outer circumferential surface of the shaft.Type: GrantFiled: March 10, 2021Date of Patent: March 26, 2024Assignee: MIKUNI CORPORATIONInventors: Toshiaki Ishii, Makoto Koyama, Daisuke Takayama
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Patent number: 11448142Abstract: Provided is an exhaust valve device 1 for a vehicle in which a valve element 7 is supported in an exhaust passage 4 by a rotating shaft 5 axially supported by a valve body 3, a flexible joint member 16 is secured to an output shaft 13a of a motor unit 13 attached to the valve body 3, and a lower end of the flexible joint member 16 and an upper end of the rotating shaft 5 are coupled via a rigid joint member 15, in which the rigid joint member 15 includes: a sealing element 18 having a sealing surface 18a and arm portions 18c, the sealing surface 18a being coupled to one end of the rotating shaft 5 and sealing an axially supported portion of one end of the rotating shaft to prevent exhaust gas from leaking, the arm portions 18c being formed in a periphery of the sealing surface 18a; and a transmission element 19 having a spring groove 19a and engagement grooves 19b, the spring groove 19a being coupled to the end of the flexible joint member 16, the engagement grooves 19b being engaged with the arm portions 18cType: GrantFiled: January 21, 2021Date of Patent: September 20, 2022Assignee: MIKUNI CORPORATIONInventors: Toshiaki Ishii, Makoto Koyama, Daisuke Takayama, Naoki Tanaka
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Publication number: 20210396315Abstract: A valve device includes a body that defines a passage through which a fluid flows, a shaft that is movably supported with respect to the body and defines an axis, a valve element that is fixed to the shaft to open and close the passage; and a cylindrical bearing bush that movably supports the shaft with respect to the body, in which the bearing bush includes a mixed region in which a metal core material and expanded graphite are mixed with each other, and a first expanded graphite region made of only the expanded graphite such that the metal core material is not exposed in an inner circumferential side region in contact with an outer circumferential surface of the shaft.Type: ApplicationFiled: March 10, 2021Publication date: December 23, 2021Applicant: MIKUNI CORPORATIONInventors: Toshiaki ISHII, Makoto KOYAMA, Daisuke TAKAYAMA
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Patent number: 11105274Abstract: An exhaust valve device for a vehicle includes: a valve element 7 axially supported by a rotating shaft 5 in a bore 4 of a valve body 3 produced through casting; sealing projections 21 and 22 integrally formed on an inner circumferential surface of the bore 4 to follow one side portion 7a and the other side portion 7b of an outer circumferential edge of the valve element 7 at a fully closed position; sealing surfaces 21a and 22a of the sealing projections 21 and 22, the right side portion 7a and the left side portion 7b of the valve element 7 at the fully closed position abutting respectively on the sealing surfaces; R-shaped corners 21b and 22b formed between the inner circumferential surface of the bore 4 and the sealing surfaces 21a and 22a; and diameter enlarged portions 25 formed in the inner circumferential surface of the bore 4 to enlarge the bore 4 that are adjacent respectively to the sealing surfaces 21a and 22a of the sealing projections 21 and 22 and correspond to lengths of the sealing surfaces 2Type: GrantFiled: January 21, 2021Date of Patent: August 31, 2021Assignee: MIKUNI CORPORATIONInventors: Toshiaki Ishii, Makoto Koyama, Daisuke Takayama, Naoki Tanaka
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Publication number: 20210254560Abstract: Provided is an exhaust valve device 1 for a vehicle in which a valve element 7 is supported in an exhaust passage 4 by a rotating shaft 5 axially supported by a valve body 3, a flexible joint member 16 is secured to an output shaft 13a of a motor unit 13 attached to the valve body 3, and a lower end of the flexible joint member 16 and an upper end of the rotating shaft 5 are coupled via a rigid joint member 15, in which the rigid joint member 15 includes: a sealing element 18 having a sealing surface 18a and arm portions 18c, the sealing surface 18a being coupled to one end of the rotating shaft 5 and sealing an axially supported portion of one end of the rotating shaft to prevent exhaust gas from leaking, the arm portions 18c being formed in a periphery of the sealing surface 18a; and a transmission element 19 having a spring groove 19a and engagement grooves 19b, the spring groove 19a being coupled to the end of the flexible joint member 16, the engagement grooves 19b being engaged with the arm portions 18cType: ApplicationFiled: January 21, 2021Publication date: August 19, 2021Applicant: MIKUNI CORPORATIONInventors: Toshiaki ISHII, Makoto KOYAMA, Daisuke TAKAYAMA, Naoki TANAKA
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Publication number: 20210254561Abstract: An exhaust valve device for a vehicle includes: a valve element 7 axially supported by a rotating shaft 5 in a bore 4 of a valve body 3 produced through casting; sealing projections 21 and 22 integrally formed on an inner circumferential surface of the bore 4 to follow one side portion 7a and the other side portion 7b of an outer circumferential edge of the valve element 7 at a fully closed position; sealing surfaces 21a and 22a of the sealing projections 21 and 22, the right side portion 7a and the left side portion 7b of the valve element 7 at the fully closed position abutting respectively on the sealing surfaces; R-shaped corners 21b and 22b formed between the inner circumferential surface of the bore 4 and the sealing surfaces 21a and 22a; and diameter enlarged portions 25 formed in the inner circumferential surface of the bore 4 to enlarge the bore 4 that are adjacent respectively to the sealing surfaces 21a and 22a of the sealing projections 21 and 22 and correspond to lengths of the sealing surfaces 2Type: ApplicationFiled: January 21, 2021Publication date: August 19, 2021Applicant: MIKUNI CORPORATIONInventors: Toshiaki ISHII, Makoto KOYAMA, Daisuke TAKAYAMA, Naoki TANAKA
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Publication number: 20210254559Abstract: Provided is an exhaust valve device 1 for a vehicle in which a valve element 7 is supported to be able to be opened and closed in an exhaust passage 4 by a rotating shaft 5 axially supported by a valve body 3, a motor unit 13 is attached to the valve body 3 via a thermal insulation bracket 11, and an output shaft 13a of the motor unit 13 is coupled to the rotating shaft 5, the exhaust valve device 1 including: an outer circumferential, guide surface 10a provided at the valve body 3 and having an arc shape around an axial line C of the rotating shaft 5 at the center; and an inner circumferential guide surface 12a provided at the thermal insulation bracket 11 and brought into slide contact with the outer circumferential guide surface 10a to guide the thermal insulation bracket 11 to be secured at a prescribed securing angle to the valve body 3 around the axial line C of the rotating shaft 5 at the center.Type: ApplicationFiled: January 21, 2021Publication date: August 19, 2021Applicant: MIKUNI CORPORATIONInventors: Toshiaki ISHII, Makoto KOYAMA, Daisuke TAKAYAMA, Naoki TANAKA
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Patent number: 8178195Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical insulation, mechanical strength, flexibility and workability can be obtained.Type: GrantFiled: November 21, 2006Date of Patent: May 15, 2012Assignees: Toray Industries, Inc., Kawamura Sangyo Co., Ltd.Inventors: Shinichiro Miyaji, Makoto Koyama, Miyoshi Yokura
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Publication number: 20100204202Abstract: A drug containing a compound having the formula (I): or a pharmacologically acceptable salt thereof or their hydrates, which alleviates motor complications associated with a treatment with levodopa for Parkinson's disease, delays the onset of motor complications associated with a treatment with levodopa, and inhibiting or delaying the advance of symptoms of Parkinson's disease is provided. The compound having the formula (I) has a serotonin 1A receptor partial agonist action, does not have an antagonist action against dopamine D2 receptors, has an agonist action against dopamine D3 receptors, has an effect of alleviation and delay of onset of motor complications associated with repeated doses of levodopa and, further, is also effective against associated with psychiatric symptoms in advanced stage Parkinson's disease patients.Type: ApplicationFiled: November 28, 2008Publication date: August 12, 2010Applicant: Asubio Pharma Co., Ltd.Inventors: Yoshihiro Tani, Makoto Koyama
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Publication number: 20090258207Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical in sulation, mechanical strength, flexibility and workability can be obtained.Type: ApplicationFiled: November 21, 2006Publication date: October 15, 2009Applicants: TORAY INDUSTRIES, INC., KAWAMUR SANGYO CO., LTD.Inventors: Shinichiro Miyaji, Makoto Koyama, Miyoshi Yokura
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Patent number: 7094715Abstract: A non-halogen series floor material includes a first intermediate resin layer containing filler of 100 to 400 mass parts with respect to resin ingredient of 100 mass parts, the resin ingredient consisting essentially of resin having no chlorine atom in chemical structure, a surface resin layer integrally formed at an upper surface side of the first intermediate resin layer, the surface resin layer containing resin having no chloride atom in chemical structure and having a thickness of 100 to 1,000 ?m, a second intermediate resin layer integrally formed at a lower surface side of the first intermediate resin layer, the second intermediate resin layer containing resin having no chloride atom in chemical structure and filler of 0 to 200 mass parts with respect to resin ingredient of 100 mass parts, and a backing layer integrally formed at a lower surface side of the second intermediate resin layer, the backing layer being formed of a fibrous fabric constituted by fibers containing resin having no chloride atom iType: GrantFiled: October 29, 2003Date of Patent: August 22, 2006Assignee: Suminoe Textile Co., LTDInventors: Eiji Sakaguchi, Makoto Koyama, Junichi Takeda, Yoshiharu Nishino, Hiroaki Ishii
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Publication number: 20050095412Abstract: A non-halogen series floor material includes a first intermediate resin layer containing filler of 100 to 400 mass parts with respect to resin ingredient of 100 mass parts, the resin ingredient consisting essentially of resin having no chlorine atom in chemical structure, a surface resin layer integrally formed at an upper surface side of the first intermediate resin layer, the surface resin layer containing resin having no chloride atom in chemical structure and having a thickness of 100 to 1,000 ?m, a second intermediate resin layer integrally formed at a lower surface side of the first intermediate resin layer, the second intermediate resin layer containing resin having no chloride atom in chemical structure and filler of 0 to 200 mass parts with respect to resin ingredient of 100 mass parts, and a backing layer integrally formed at a lower surface side of the second intermediate resin layer, the backing layer being formed of a fibrous fabric constituted by fibers containing resin having no chloride atom iType: ApplicationFiled: October 29, 2003Publication date: May 5, 2005Inventors: Eiji Sakaguchi, Makoto Koyama, Junichi Takeda, Yoshiharu Nishino, Hiroaki Ishii
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Publication number: 20030000059Abstract: In a peeling apparatus of an extrusion material batch, a circular blade is arranged at an outlet portion of a kneader, and an outer surface of the extrusion material batch extruded from the outlet portion is peeled uniformly. It is preferred to arrange a longitudinal blade for cutting the peeled waste materials in a radial direction at a periphery of the circular blade. Since a water content of the peeled waste materials is not varied, they can be returned as they are to the inlet hopper of the kneader via a transfer line.Type: ApplicationFiled: May 21, 2002Publication date: January 2, 2003Applicant: NGK Insulators, Ltd.Inventors: Koji Yokoi, Tsutomu Yamamoto, Makoto Koyama
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Patent number: 5657203Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.Type: GrantFiled: March 6, 1995Date of Patent: August 12, 1997Assignee: Nippondenso Co., Ltd.Inventors: Yasunobu Hirao, Takashi Nagasaka, Hidekazu Katsuyama, Makoto Koyama, Yuji Motoyama, Mamoru Urushizaki, Yukihiro Maeda
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Patent number: 5586389Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.Type: GrantFiled: March 6, 1995Date of Patent: December 24, 1996Assignee: Nippondenso Co., Ltd.Inventors: Yasunobu Hirao, Makoto Koyama, Yuji Motoyama
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Patent number: 5408383Abstract: In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.Type: GrantFiled: September 10, 1993Date of Patent: April 18, 1995Assignee: Nippondenso Co., Ltd.Inventors: Takashi Nagasaka, Yuji Motoyama, Yasunobu Hirao, Makoto Koyama, Mamoru Urushizaki, Hidekazu Katsuyama, Yukihiro Maeda