Abstract: To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

Abstract: The present invention provides an immunological detection method that can detect milk allergens, allergens of albumen, flour, buckwheat and peanut with high sensitivity in foods containing these allergens regardless they are denatured/native, and a detection kit to be used therefor. It is a method for detecting allergens by using 2 or more monoclonal antibodies recognizing native and denatured milk allergens, native and denatured albumen allergens, native and denatured flour allergens, native and denatured buckwheat allergens, and native and denatured peanut allergens, using asl casein which is the main protein of milk casein, ?-lactoglobulin which is the main protein of whey, ovalubumin and ovomucoid which are main proteins of albumen, gliadin which is the main protein of flour, protein with a molecular weight of 24 kDa and 76 kDa which are main proteins of buckwheat, and Ara h1 which is the main protein of peanut as an index.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed.

Abstract: An anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film has an irregular surface, wherein a ratio of areas of the surface having an inclination angle of 1° or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5° or more is 20% or less, and a standard deviation of a height of the surface is 0.2 ?m or less. There is also provided a process for preparing an anti-glare optical film.

Abstract: An anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film has an irregular surface, wherein a ratio of areas of the surface having an inclination angle of 1° or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5° or more is 20% or less, and a standard deviation of a height of the surface is 0.2 ?m or less. There is also provided a process for preparing an anti-glare optical film.

Abstract: There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.

Abstract: The present invention provides an immunological detection method that can detect milk allergens, allergens of albumen, flour, buckwheat and peanut with high sensitivity in foods containing these allergens regardless they are denatured/native, and a detection kit to be used therefor. It is a method for detecting allergens by using 2 or more monoclonal antibodies recognizing native and denatured milk allergens, native and denatured albumen allergens, native and denatured flour allergens, native and denatured buckwheat allergens, and native and denatured peanut allergens, using asl casein which is the main protein of milk casein, ?-lactoglobulin which is the main protein of whey, ovalubumin and ovomucoid which are main proteins of albumen, gliadin which is the main protein of flour, protein with a molecular weight of 24 kDa and 76 kDa which are main proteins of buckwheat, and Ara h1 which is the main protein of peanut as an index.

Abstract: There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14, a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.

Abstract: In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.

Abstract: To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

Abstract: A manufacturing apparatus capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member has a plurality of process regions, namely, an atmosphere replacing/heating part, a molten metal push-out part, and a cooling part; and a guide for allowing a mold to pass through these plural process regions. The molds have ceramic members placed therein and are successively inserted into a mold inlet provided in the guide to pass through the guide practically in a shielded state from the atmosphere. A molten metal is poured thereto in the molten-metal push-out part, and the molten metal is cooled and solidified in the cooling part to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

Abstract: There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.

Abstract: An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.

Abstract: To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite member 3 according to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substrates 30 are placed in a mold main body 11 constituting a mold 1, with a ceramic substrate 31 side thereof facing upward, an atmosphere inside and outside the mold 1 is replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metal 42 is poured and filled in a first joining portion 14 that is formed by the molten metal main body 11 and an upper container 13 and that has a shrinkage cavity inducing portion 16 on a metal material holding portion side and a shrinkage cavity inducing portion 18 on an air vent side, and the molten metal 42 is cooled.

Abstract: The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.

Abstract: There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and amethod for producing the same. Inametal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.

Abstract: In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.

Abstract: An object of the present invention is to provide an anti-glare optical film which reduces in whitening of a screen without sacrificing anti-glare property, and a process for preparing the same. There is provided an anti-glare optical film having irregularities on the surface, wherein a ratio of areas of the surface having an inclination angle of 1° or less is 20% or less, a ratio of areas of the surface having an inclination angle of 5° or more is 20% or less, and a standard deviation of a height of the surface is 0.2 ?m or less. There is also provided a process for preparing an anti-glare optical film, comprising the steps of contacting a glass with an aqueous solution containing hydrogen fluoride to obtain a template which comprises the glass having the surface on which a fine irregular shape is formed so that approximately spherical concave shapes are arranged to be substantially compact, and transferring the irregular shape of the surface of the template onto the surface of a resin film.

Abstract: There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. After a molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof. Then, etching resists 16 are printed on the circuit forming metal plate 12 to etch the circuit forming metal plate 12 to form metal circuit plates 12 having the desired circuit pattern.