Patents by Inventor Makoto Nozu

Makoto Nozu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 5622590
    Abstract: The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: April 22, 1997
    Assignee: Matsushita Electronics Corporation
    Inventors: Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani, Keiji Saeki, Yoshifumi Kitayama
  • Semiconductor device
    Patent number: 5550408
    Abstract: The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: August 27, 1996
    Assignee: Matsushita Electronics Corporation
    Inventors: Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani, Keiji Saeki, Yoshifumi Kitayama
  • Semiconductor device and method of manufacturing the same
    Patent number: 5436503
    Abstract: The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.
    Type: Grant
    Filed: November 17, 1993
    Date of Patent: July 25, 1995
    Assignee: Matsushita Electronics Corporation
    Inventors: Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani, Keiji Saeki, Yoshifumi Kitayama