Patents by Inventor Makoto OBUNAI

Makoto OBUNAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
    Patent number: 9201299
    Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 ?m, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: December 1, 2015
    Assignee: SAN-EI KAGAKU CO., LTD.
    Inventors: Toshimitsu Kounou, Yasuhiro Kuroyanagai, Yukihiro Usui, Makoto Obunai
  • INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME
    Publication number: 20090087775
    Abstract: A curable resin composition comprises: (I) 100 parts by-weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 ?m, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
    Type: Application
    Filed: September 5, 2008
    Publication date: April 2, 2009
    Applicant: SAN-EI KAGAKU CO., LTD.
    Inventors: Toshimitsu KUNOU, Yasuhiro KUROYANAGI, Yukihiro USUI, Makoto OBUNAI