Patents by Inventor Makoto Ogawa
Makoto Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120243143Abstract: An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.Type: ApplicationFiled: March 5, 2012Publication date: September 27, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Toshiyuki Iwanaga, Makoto Ogawa, Masahito Saruban
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Publication number: 20120236461Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yoji YAMAMOTO, Akihiro MOTOKI, Syunsuke TAKEUCHI, Makoto OGAWA, Toshiyuki IWANAGA
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Patent number: 8254081Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.Type: GrantFiled: November 13, 2009Date of Patent: August 28, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiichi Nishihara, Shuji Matsumoto, Akihiro Motoki, Makoto Ogawa
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Patent number: 8240016Abstract: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 ?m or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.Type: GrantFiled: April 30, 2010Date of Patent: August 14, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi
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Publication number: 20120194031Abstract: In a method of forming an external electrode by growing plated depositions on exposed ends of a plurality of internal electrodes in a component main body, the component main body is polished to increase exposure of the internal electrodes. To prevent decreased external electrode fixing strength, a radius of curvature is reduced to about 0.01 mm or less for an R chamfered section formed in a ridge section of the component main body during polishing by ion milling, and exposed ends of the internal electrodes are recessed from end surfaces of the component main body with a recess length of about 1 ?m or less. Plating films to serve as external electrodes are formed to extend from the end surfaces of the component main body across the R chamfered section, and include end edges located on at least one of the principal surfaces and the side surfaces.Type: ApplicationFiled: January 27, 2012Publication date: August 2, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Wataru OGAWA, Makoto OGAWA, Masahito SARUBAN, Toshiyuki IWANAGA, Akihiro MOTOKI
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Publication number: 20120188683Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: ApplicationFiled: January 25, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Syunsuke TAKEUCHI, Teruyo KATAYAMA, Toshiyuki IWANAGA, Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI
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Publication number: 20120188682Abstract: A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1?t/d?0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.Type: ApplicationFiled: January 20, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Koji SATO, Yukio SANADA, Makoto OGAWA, Yasuhiro NISHISAKA
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Patent number: 8228663Abstract: In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.Type: GrantFiled: November 12, 2009Date of Patent: July 24, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga
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Publication number: 20120183682Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.Type: ApplicationFiled: March 29, 2012Publication date: July 19, 2012Applicant: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Shuji Matsumoto, Seiichi Nishihara
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Publication number: 20120169180Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.Type: ApplicationFiled: December 27, 2011Publication date: July 5, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Masahito SARUBAN, Makoto OGAWA, Wataru OGAWA, Akihiro MOTOKI, Syunsuke TAKEUCHI, Yoji YAMAMOTO
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Publication number: 20120161576Abstract: In a method of manufacturing a laminate type electronic component, while the distance between adjacent exposed ends of a plurality of internal electrodes is adjusted preferably to be about 50 ?m or less, a plurality of conductive particles composed of Pd, Pt, Cu, Au, or Ag are provided on the surface of a component main body. The conductive particles have an average particle size of about 0.1 nm to about 100 nm, which are distributed in island-shaped configurations over the entire surface of the component main body, while the average distance between the respective conductive particles is adjusted to fall within the range of about 10 nm to about 100 nm. The component main body is subjected to electrolytic plating such that plating growth develops in and around a region including the respective exposed ends of the plurality of internal electrodes.Type: ApplicationFiled: December 9, 2011Publication date: June 28, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA
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Publication number: 20120140374Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.Type: ApplicationFiled: February 3, 2012Publication date: June 7, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Kenichi KAWASAKI, Shunsuke TAKEUCHI, Akihiro MOTOKI, Makoto OGAWA, Toshiyuki IWANAGA
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Publication number: 20120139763Abstract: A method for decoding encoded data. The method includes receiving data encoded by replacing each of a plurality of characters with bit strings. The method also includes recording, on the basis of definition information, at least one of the characters as corresponding to each of the bit lengths, and generating decode information based on the number of characters, wherein the decode information includes bit string information for sorting the bit strings in a bit length order that is a predetermined order associated with bit lengths. The method also includes, in response to receiving a particular bit length, generating character information in which the characters are sorted in the bit length order by inserting a character corresponding to the particular bit length into a position corresponding to the particular bit length in an array in which at least one of the bit lengths.Type: ApplicationFiled: December 7, 2011Publication date: June 7, 2012Applicant: International Business Machines CorporationInventors: Kiyoshi Takemura, Nobuyoshi Tanaka, Makoto Ogawa, Tadayuki Okada
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Patent number: 8194391Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.Type: GrantFiled: December 19, 2008Date of Patent: June 5, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Shuji Matsumoto, Seiichi Nishihara
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Patent number: 8184424Abstract: A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.Type: GrantFiled: April 28, 2008Date of Patent: May 22, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
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Patent number: 8154848Abstract: A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.Type: GrantFiled: January 15, 2009Date of Patent: April 10, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Shunsuke Takeuchi, Kenichi Kawasaki
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Patent number: 8149566Abstract: A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.Type: GrantFiled: May 17, 2010Date of Patent: April 3, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi
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Publication number: 20120074677Abstract: Provided are an airbag, an airbag device, and a method for sewing a lid member of an airbag that can make it easier to maintain the internal pressure until inflation and deployment of the airbag are completed and to quickly release gas after an occupant contacts the airbag. An airbag includes a vent hole for releasing gas supplied in the airbag, a lid member for making the vent hole openable and closable, and a tether for applying tension to the lid member. A seam formed by sewing the lid member to the airbag is disposed in a sewing region defined by a straight line shape spaced a predetermined distance from the vent hole, and a curved shape (most curved shape) formed by bringing both ends of the straight line shape close to a center line of the vent hole parallel to the straight line shape. The curvature of the seam can be regulated in view of the lap width between the lid member and the outer edge of the vent hole.Type: ApplicationFiled: September 22, 2011Publication date: March 29, 2012Inventors: Teruhiko Hiruta, Mitsuo Maruoka, Makoto Ogawa, Yoshihiro Kobayashi
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Patent number: 8139342Abstract: A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 ?m. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.Type: GrantFiled: May 15, 2009Date of Patent: March 20, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Shunsuke Takeuchi, Kenichi Kawasaki, Akihiro Motoki, Makoto Ogawa, Toshiyuki Iwanaga
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Publication number: 20120058257Abstract: A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 ?m. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.Type: ApplicationFiled: November 14, 2011Publication date: March 8, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Shunsuke TAKEUCHI, Kenichi KAWASAKI, Akihiro MOTOKI, Makoto OGAWA, Toshiyuki IWANAGA