Patents by Inventor Makoto Ohtsuka

Makoto Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7142341
    Abstract: In an actuator for an optical mechanical scanner comprising a positioning element for an optical mirror wherein the positioning element is an electrically heatable flexible element consisting of a shape memory alloy having a Curie temperature and a transformation temperature, and wherein the flexible element is ferromagnetic when cold and can be bent in a first position by a magnet but is heated to exceed the Curie temperature and the transformation temperature so as to become paramagnetic whereby the flexible element becomes deformed in the opposite direction.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: November 28, 2006
    Assignee: Forschungszentrum Karlsruhe GmbH
    Inventors: Manfred Kohl, Koyoshi Yamauchi, Makoto Ohtsuka, Toshiyuki Takagi
  • Publication number: 20040246555
    Abstract: In an actuator for an optical mechanical scanner comprising a positioning element for an optical mirror wherein the positioning element is an electrically heatable flexible element consisting of a shape memory alloy having a Curie temperature and a transformation temperature, and wherein the flexible element is ferromagnetic when cold and can be bent in a first position by a magnet but is heated to exceed the Curie temperature and the transformation temperature so as to become paramagnetic whereby the flexible element becomes deformed in the opposite direction.
    Type: Application
    Filed: July 1, 2004
    Publication date: December 9, 2004
    Inventors: Manfred Kohl, Koyoshi Yamauchi, Makoto Ohtsuka, Toshiyuki Takagi
  • Patent number: 5973392
    Abstract: A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.
    Type: Grant
    Filed: March 3, 1998
    Date of Patent: October 26, 1999
    Assignee: NEC Corporation
    Inventors: Naoji Senba, Yuzo Shimada, Ikusi Morizaki, Hideki Kusamitu, Makoto Ohtsuka, Katsumasa Hashimoto
  • Patent number: 5485604
    Abstract: In each module (11) of three or more central processor modules of a fault tolerant computer system, a detector (45) receives a comparator output signal and like comparator output signals from two adjacent modules and produces a detector output signal which confirms absence and presence of a fault in one of the above-mentioned each module. When the fault is confirmed, a controller or processor (49) isolates the module under consideration from the system by inhibiting delivery of a controlled output signal to a bus (31) and by connecting, with the module in question bypassed, switching units (53(1), 53(2)) of the adjacent modules. Preferably, one of the modules of the system is used as a master module of ordinarily delivering the controlled output signal to the bus with others used as checker modules of ordinarily inhibiting the delivery.
    Type: Grant
    Filed: November 4, 1993
    Date of Patent: January 16, 1996
    Assignee: NEC Corporation
    Inventors: Hiroaki Miyoshi, Yasuhiko Mizushima, Makoto Ohtsuka, Hiroki Hihara