Patents by Inventor Makoto Shizukuishi
Makoto Shizukuishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11723613Abstract: A computed tomographic (CT) system includes a gantry having a rotating part including a light source, a light source drive control circuit, a rechargeable battery, and a rotating part interface. The gantry includes a detector, a detector control and signal processing circuit, and an image memory. The rotating part may rotate around a central axis. The CT system includes a gantry table on which the gantry is mounted and which includes a host interface. The CT system includes a motor that may cause the gantry to move within a gantry moving range, and a control unit that may process and display image data obtained from the gantry. The rotating part interface may face the host interface, such that the rotating part and host interfaces are configured to be electrically connected with each other, based on the gantry being at a predetermined position within the gantry moving range.Type: GrantFiled: September 12, 2022Date of Patent: August 15, 2023Inventor: Makoto Shizukuishi
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Publication number: 20230000450Abstract: A computed tomographic (CT) system includes a gantry having a rotating part including a light source, a light source drive control circuit, a rechargeable battery, and a rotating part interface. The gantry includes a detector, a detector control and signal processing circuit, and an image memory. The rotating part may rotate around a central axis. The CT system includes a gantry table on which the gantry is mounted and which includes a host interface. The CT system includes a motor that may cause the gantry to move within a gantry moving range, and a control unit that may process and display image data obtained from the gantry. The rotating part interface may face the host interface, such that the rotating part and host interfaces are configured to be electrically connected with each other, based on the gantry being at a predetermined position within the gantry moving range.Type: ApplicationFiled: September 12, 2022Publication date: January 5, 2023Inventor: Makoto SHIZUKUISHI
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Patent number: 11457882Abstract: A computed tomographic (CT) system includes a gantry having a rotating part including a light source, a light source drive control circuit, a rechargeable battery, and a rotating part interface. The gantry includes a detector, a detector control and signal processing circuit, and an image memory. The rotating part may rotate around a central axis. The CT system includes a gantry table on which the gantry is mounted and which includes a host interface. The CT system includes a motor that may cause the gantry to move within a gantry moving range, and a control unit that may process and display image data obtained from the gantry. The rotating part interface may face the host interface, such that the rotating part and host interfaces are configured to be electrically connected with each other, based on the gantry being at a predetermined position within the gantry moving range.Type: GrantFiled: January 8, 2021Date of Patent: October 4, 2022Inventor: Makoto Shizukuishi
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Publication number: 20220151844Abstract: A vehicle includes a computed tomographic system (CT) including a CT gantry having an inner peripheral, and a subject window in a surface of the vehicle. The subject window is configured to be exposed to an exterior of the vehicle via a side face of the vehicle, such that the subject window is configured to enable a subject to enter or exit from the inner peripheral of the CT gantry in a body axis direction of the CT.Type: ApplicationFiled: December 23, 2021Publication date: May 19, 2022Inventor: Makoto SHIZUKUISHI
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Patent number: 11024606Abstract: A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.Type: GrantFiled: September 18, 2019Date of Patent: June 1, 2021Inventor: Makoto Shizukuishi
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Publication number: 20210153825Abstract: A computed tomographic (CT) system includes a gantry having a rotating part including a light source, a light source drive control circuit, a rechargeable battery, and a rotating part interface. The gantry includes a detector, a detector control and signal processing circuit, and an image memory. The rotating part may rotate around a central axis. The CT system includes a gantry table on which the gantry is mounted and which includes a host interface. The CT system includes a motor that may cause the gantry to move within a gantry moving range, and a control unit that may process and display image data obtained from the gantry. The rotating part interface may face the host interface, such that the rotating part and host interfaces are configured to be electrically connected with each other, based on the gantry being at a predetermined position within the gantry moving range.Type: ApplicationFiled: January 8, 2021Publication date: May 27, 2021Inventor: Makoto SHIZUKUISHI
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Publication number: 20200013758Abstract: A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.Type: ApplicationFiled: September 18, 2019Publication date: January 9, 2020Inventor: Makoto SHIZUKUISHI
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Patent number: 10468383Abstract: A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.Type: GrantFiled: January 15, 2016Date of Patent: November 5, 2019Inventor: Makoto Shizukuishi
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Patent number: 10327720Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: GrantFiled: October 19, 2017Date of Patent: June 25, 2019Inventor: Makoto Shizukuishi
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Patent number: 10327721Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: GrantFiled: February 23, 2018Date of Patent: June 25, 2019Inventor: Makoto Shizukuishi
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Publication number: 20180177472Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: ApplicationFiled: February 23, 2018Publication date: June 28, 2018Inventor: Makoto SHIZUKUISHI
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Patent number: 9943275Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: GrantFiled: December 9, 2015Date of Patent: April 17, 2018Inventor: Makoto Shizukuishi
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Publication number: 20180035958Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: ApplicationFiled: October 19, 2017Publication date: February 8, 2018Inventor: Makoto SHIZUKUISHI
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Publication number: 20170373042Abstract: A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.Type: ApplicationFiled: January 15, 2016Publication date: December 28, 2017Inventor: Makoto SHIZUKUISHI
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Patent number: 9808159Abstract: An image sensor includes a first semiconductor chip including first and second surfaces; a second semiconductor chip including first and second surfaces; and a first adhesive layer between the second surface of the first semiconductor chip and the second surface of the second semiconductor chip, the first semiconductor chip being stacked on the second semiconductor chip via the first adhesive layer such that a footprint of the first semiconductor chip is larger than a footprint of the second semiconductor chip with respect to a plan view of the image sensor, the first semiconductor chip including an array of unit pixels configured to capture light corresponding to an image and to generate image signals based on the captured light, the second semiconductor chip including first peripheral circuits configured to control the array of unit pixels and receive the generated image signals.Type: GrantFiled: May 8, 2014Date of Patent: November 7, 2017Inventor: Makoto Shizukuishi
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Patent number: 9634060Abstract: An image sensor includes a first semiconductor chip having a first surface and a second surface, the first semiconductor chip a including an array of unit pixels configured to capture light corresponding to an image and to generate image signals based on the captured light; and a second semiconductor chip having a first surface and a second surface, the second semiconductor chip including first peripheral circuits configured to control the array of pixels and receive the generated image signals, the first peripheral circuits including a vertical scanning circuit, a horizontal scanning circuit, and a signal read-out circuit, the first semiconductor chip being stacked on the second semiconductor chip, the first semiconductor chip not being smaller than the second semiconductor chip.Type: GrantFiled: February 21, 2014Date of Patent: April 25, 2017Inventor: Makoto Shizukuishi
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Patent number: 9484387Abstract: A method of manufacturing a stacked semiconductor device having two or more wafers may include forming a conductor on an upper wafer, the conductor configured to electrically connect input terminals together that have no input protection circuit against ESD; forming front side micro-bumps on a front side of the upper wafer, the front side micro-bumps configured to electrically connect to back side micro-bumps on the upper wafer; forming a TSV structure, the TSV structure configured to facilitate electrical connections between the front and the back side of the upper wafer; forming back side micro-bumps on the back side of the upper wafer, the back side micro-bumps configured to electrically connect with front side micro-bumps on the lower wafer; stacking the upper wafer on the lower wafer; and separating the conductor such that each of the input terminals are electrically independent from other ones of the input terminals.Type: GrantFiled: October 22, 2013Date of Patent: November 1, 2016Inventor: Makoto Shizukuishi
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Publication number: 20160157791Abstract: A tomographic imaging system includes a source configured to irradiate an object; a first image sensor including a first semiconductor substrate having a first face upon which a monolithic first pixel array is located; and a gantry configured to hold the first image sensor and rotate the image sensor around the object about a first rotation axis, the first pixel array including a first plurality of pixels configured to receive light that travels through or from the object based on the irradiation, the first plurality of pixels of the first pixel array being arranged in one or more rows and a plurality of columns such that, a total number of the one or more rows is less than a total number of the plurality of columns, and the one or more rows extend in a first direction, the first image sensor being arranged such that an angle between the first direction and a second direction is greater than 45 degrees and equal to or less than 90 degrees, the second direction being a direction parallel to the rotation axis oType: ApplicationFiled: December 9, 2015Publication date: June 9, 2016Inventor: Makoto SHIZUKUISHI
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Publication number: 20150279881Abstract: A method of manufacturing a stacked semiconductor device having two or more wafers may include forming a conductor on an upper wafer, the conductor configured to electrically connect input terminals together that have no input protection circuit against ESD; forming front side micro-bumps on a front side of the upper wafer, the front side micro-bumps configured to electrically connect to back side micro-bumps on the upper wafer; forming a TSV structure, the TSV structure configured to facilitate electrical connections between the front and the back side of the upper wafer; forming back side micro-bumps on the back side of the upper wafer, the back side micro-bumps configured to electrically connect with front side micro-bumps on the lower wafer; stacking the upper wafer on the lower wafer; and separating the conductor such that each of the input terminals are electrically independent from other ones of the input terminals.Type: ApplicationFiled: October 22, 2013Publication date: October 1, 2015Inventor: Makoto SHIZUKUISHI
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Publication number: 20140334601Abstract: An image sensor includes a first semiconductor chip including first and second surfaces; a second semiconductor chip including first and second surfaces; and a first adhesive layer between the second surface of the first semiconductor chip and the second surface of the second semiconductor chip, the first semiconductor chip being stacked on the second semiconductor chip via the first adhesive layer such that a footprint of the first semiconductor chip is larger than a footprint of the second semiconductor chip with respect to a plan view of the image sensor, the first semiconductor chip including an array of unit pixels configured to capture light corresponding to an image and to generate image signals based on the captured light, the second semiconductor chip including first peripheral circuits configured to control the array of unit pixels and receive the generated image signals.Type: ApplicationFiled: May 8, 2014Publication date: November 13, 2014Inventor: Makoto SHIZUKUISHI