Abstract: An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.

Abstract: An inhaler has a cap body for defining a flow path and having first and second air inhalation openings for introducing outside air into the flow path from the outside; an air inhalation valve for opening and closing the first air inhalation opening by using the difference in pressure between the flow path and the outside; and a shielding section capable of selectively shielding either of the first and second air inhalation openings. The inhaler is configured to be switchable between two states that are a first state where the second air inhalation opening is shielded by the shielding section and outside air can be introduced through the first air inhalation opening by using the pressure difference and a second state where the first air inhalation opening is shielded by the shielding section and communication between the flow path and the outside through the second air inhalation opening is constantly maintained.

Abstract: A nebulizer includes a nebulizer body and a relay pipe. The nebulizer body includes a connection portion that has an aerosol lead-out port to lead out aerosol, and the relay pipe includes a connection portion that has an aerosol introduction port to introduce the aerosol. The nebulizer body and the relay pipe can take a first connection state in which the relay pipe is detachably connected to the nebulizer body and a second connection state in which the relay pipe is connected to the nebulizer body so as to be not able to be detached from the nebulizer body. In the first connection state, the aerosol introduction port and the aerosol lead-out port are communicated with each other. In the second connection state, the aerosol lead-out port is blocked by a blocking portion provided in the relay pipe. Therefore, the nebulizer in which reuse of the nebulizer body or relay pipe is simply prohibited after the usage can be provided by the configuration.

Abstract: A mobile communication apparatus configured to be provided with an extra antenna has a printed board provided with an antenna feed point, an antenna having a spring-like contact and provided on the printed board, and a housing constituted by a first case and a second case fixed into each other. The printed board and the antenna are arranged between and pressed by the first case and the second case. The antenna feed point and the spring-like contact are in contact with and electrically connected to each other by means of elastic force of the spring-like contact caused upon the first case and the second case being fixed into each other. The housing has a space for containing the extra antenna such that the extra antenna is electrically connected to the antenna feed point by means of the elastic force.

Abstract: A wireless device includes: a casing having a first face; a display configured to be visible from the first face; a touch sensor formed by a transparent material and mounted in the casing with respect to the display as a part of the first face; a substrate mounted to a side opposite to the first face with respect to the display; and an antenna element including: a first portion built in the casing, connected to a feeding point included in the substrate, and located within a first range occupied by the touch sensor when viewed from a direction perpendicular to the first face; and a second portion located within a second range other than the first range.

Abstract: Provided is a test apparatus that tests a device under test having a test function for sequentially outputting, from a single test terminal, signals that would be output from a plurality of terminals, the test apparatus comprising: a test section that supplies the device under test with a test signal and receives signals that are sequentially output from the test terminal in response to the test signal; an identifying section that identifies a correspondence between each signal sequentially received by the test section and a signal that would be output from one of the terminals of the device under test; and a counting section that counts a number of signals judged to be unacceptable from among the signals sequentially received by the test section for each terminal of the device under test, based on the correspondence identified by the identifying section.

Abstract: The disclosure concerns a semiconductor tester for testing a MUT, comprising a pattern generator; a pattern formatter; a comparator comparing a result signal from the MUT with an expectation value; a bad block memory; an AFM pre-storing pass/fail information of each of memory cells; a data compressor compressing data of pass/fail information in the AFM; a compression failure buffer memory storing data compressed; a good block register storing an address number of a good block prepared; and an address generator, wherein when the block to be compressed is a good one, the good block register sends a address number of the good block to the compress failure buffer memory.

Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.

Abstract: The disclosure concerns a semiconductor tester for testing a memory under test. The semiconductor tester comprises a pattern generator generating address information on the pages and generating a test pattern; a waveform shaper shaping the test pattern and outputting a test signal based on the shaped test pattern to the memory cells in the page identified by the address information; a comparator comparing a result signal output from the memory under test receiving the test signal with an expectation value; and a bad block memory storing information on a bad block in the memory under test in advance, when the page identified by the address information is included in the bad block, the bad block memory outputting a bad signal used to skip from the address information on the page included in the bad block to the address information on the page included in a next block under test.

Abstract: A method of manufacturing a rotary driving device is disclosed. The method includes the steps of: mounting a turntable, which is equipped with an anti-slipping section on a disc-placeable surface, to a rotary shaft; rotating the turntable; and shaving off a disc-contact surface, with which a disc contacts when the disc is placed, of the anti-slipping section with a cutting tool through a cutting off machining method from outside of the disc-placeable surface toward the rotary shaft. A cutting edge of the cutting tool is placed widthwise in parallel with an end face of the anti-slipping section and thickness-wise along an axial direction of the rotary shaft. The cutting edge is set such that the sections of the tool other than the cutting edge do not touch the anti-slipping section.

Abstract: The invention relates to a method for producing a semiconductor wafer with a polished edge, said method comprising the following steps: a polishing of at least one side of the semiconductor wafer, and a polishing of the edge of the polished semiconductor wafer, wherein the edge is polished in the presence of a polishing agent by means of a polishing cloth containing fixed abrasive.

Abstract: A mouthpiece (160) has a concave portion (161A) provided in a wall surface defining a flow path, and the concave portion (161A) is formed to have a curved surface that is curved only in one direction when seen from the above. The concave portion (161A) is provided with slit-like communication holes (162), and a valve body (170) is fixed by a fixing member (180) to the mouthpiece (160) at a generally central portion of the concave portion (161A) in the direction in which the concave portion (161A) is curved, so as to close the communication holes (162). With this structure, even if the valve body deteriorates over time due to long-term use, or the valve body deforms due to long-term use or cleaning and disinfection, its function as an exhalation valve is less likely to be impaired, and as a result, an inhaler capable of preventing leakage of aerosol can be provided.

Abstract: An electronic device includes: a first molded body having a recessed cross section and made of resin; a second molded body having a recessed cross section and made of resin, the second molded body being fitted inside the first molded body; and an antenna pattern sandwiched between the first and second molded body. Among the surfaces of the first molded body, the surface on the side not adjacent to the antenna pattern constitutes an outer surface.

Abstract: An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.

Abstract: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.

Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.

Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part.

Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.

Abstract: A first thermistor 8 and a second thermistor 9 are arranged forwardly and rearwardly of a thermopile sensor 5. A thermopile chip 55 is arranged and interposed between the first thermistor 8 and an integrated thermistor 57. A sensor cover is mounted in contact with front and side portions of a can portion 59 of a thermopile casing 56. A temperature or a radiant quantity of infrared rays on the front portion of the can portion is estimated from a temperature change of the integrated thermistor per second.