Abstract: A laminate for electrode pattern production includes an underlying metal disposed on one face in the thickness direction of the transparent substrate, wherein the one face in the thickness direction thereof has an arithmetical roughness Ra calculated in conformity with JIS B 0601 of 100 nm or more; and an electrode layer disposed on the one face in the thickness direction of the underlying metal.

Abstract: An electroless plating solution is contained in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive layer formed of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. The potentiostat controls an electric current that flows between the conductive layer formed of the long-sized substrate and the counter electrode such that a potential of the conductive layer formed of the long-sized substrate (working electrode) is at a constant level with respect to a potential of the reference electrode.

Abstract: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Abstract: An electroless plating solution is accommodated in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive portion of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. A main control device controls the potential of the conductive portion of the long-sized substrate by a potentiostat such that the potential of the conductive portion of the long-sized substrate with respect to a potential of the reference electrode is equal to a potential of the independent portion of the long-sized substrate with respect to the potential of the reference electrode.

Abstract: An electroless plating solution is contained in a plating tank of an electroless plating apparatus. A reference electrode and a counter electrode are immersed in the electroless plating solution. A conductive member is provided to be electrically in contact with a conductive layer formed of a long-sized substrate. The conductive member, the reference electrode, and the counter electrode are connected to a potentiostat. The potentiostat controls an electric current that flows between the conductive layer formed of the long-sized substrate and the counter electrode such that a potential of the conductive layer formed of the long-sized substrate (working electrode) is at a constant level with respect to a potential of the reference electrode.

Abstract: A substrate includes an insulating layer and a reflective film. The reflective film includes a conductor layer, a barrier layer and a thin silver film in this order. The surface of the conductor layer is subjected to planarization processing to attain not more than 0.35 ?m. The surface roughness of the barrier layer is not more than 0.2 ?m. The conductor layer is formed on the insulating layer. The thin silver film is formed on the conductor layer with the barrier layer sandwiched therebetween. The thin silver film on the conductor layer has a surface roughness of not more than 0.2 ?m, a gloss level of not less than 0.8 and a reflectivity of not less than 90% for light of a wavelength of 460 nm.

Abstract: Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized circuit board is stopped. Thereafter, the screen printing of a solder resist is performed to the printing block of the long-sized circuit board by a screen printing device.

Abstract: A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.

Abstract: The present invention provides a process for producing a wiring circuit board which can be inhibited from developing whiskers and can be reduced in the unevenness of connectivity with electronic parts while retaining the connectivity. According to the present invention, a wiring pattern 12 comprising a thin metal film 31 and a conductor layer 33 is formed on a base insulating layer BIL. A tin-plated layer 34 is formed by electroless plating so as to coat the wiring pattern 12 therewith. The wiring pattern 12 and the tin-plated layer 34 are then subjected to a heat treatment. The heat treatment temperature and heat treatment period are regulated to 175 to 225° C. and 2 to 10 minutes, respectively. By the heat treatment, a mixture layer 35 comprising copper and tin is formed. Thereafter, a solder resist SOL is formed over the base insulating layer so as to cover the wiring pattern 12 and tin-plated layer 34 in given regions. Subsequently, the solder resist SOL is subjected to a heat curing treatment.

Abstract: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Abstract: Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized circuit board is stopped. Thereafter, the screen printing of a solder resist is performed to the printing block of the long-sized circuit board by a screen printing device.

Abstract: A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.

Abstract: The present invention provides a process for producing a wiring circuit board which can be inhibited from developing whiskers and can be reduced in the unevenness of connectivity with electronic parts while retaining the connectivity. According to the present invention, a wiring pattern 12 comprising a thin metal film 31 and a conductor layer 33 is formed on a base insulating layer BIL. A tin-plated layer 34 is formed by electroless plating so as to coat the wiring pattern 12 therewith. The wiring pattern 12 and the tin-plated layer 34 are then subjected to a heat treatment. The heat treatment temperature and heat treatment period are regulated to 175 to 225° C. and 2 to 10 minutes, respectively. By the heat treatment, a mixture layer 35 comprising copper and tin is formed. Thereafter, a solder resist SOL is formed over the base insulating layer so as to cover the wiring pattern 12 and tin-plated layer 34 in given regions. Subsequently, the solder resist SOL is subjected to a heat curing treatment.

Abstract: A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from being stripped, and a production method of the same wired circuit board. After a thin metal film 2 formed of nickel-chromium alloy having a chromium content of 8-20 weight % is formed on an insulating layer 1, a wired circuit pattern 4 of copper is formed on the thin metal film 2. Then, a tin plating layer 5 is formed on exposed surfaces of the wired circuit pattern 4 by electroless tin plating.

Abstract: An airflow meter has a membrane type sensor element. The sensor element is supported on a support member so that a sensing surface of the sensor element is in parallel to the airflow direction. The airflow meter has at least one means for protecting the sensor element from dust such as foreign particles. The protecting means is provided with an obstruction member that is disposed upstream or downstream of the sensor element with respect to the airflow direction. The sensor element is hidden behind the obstruction member. The obstruction member has gradually spreading surfaces and gradually converging surfaces along the airflow direction. Alternatively, the protecting means can be provided with a deflector, a cover member, a flow guide member, an inlet or a dust collector.

Abstract: An airflow meter has a membrane type sensor element. The sensor element is supported on a support member so that a sensing surface of the sensor element is in parallel to the airflow direction. The airflow meter has at least one means for protecting the sensor element from dust such as foreign particles. The protecting means is provided with an obstruction member that is disposed upstream or downstream of the sensor element with respect to the airflow direction. The sensor element is hidden behind the obstruction member. The obstruction member has gradually spreading surfaces and gradually converging surfaces along the airflow direction. Alternatively, the protecting means can be provided with a deflector, a cover member, a flow guide member, an inlet or a dust collector.

Abstract: A thermal type air flow amount measuring apparatus is provided for measuring, a amount of air flowing in an air flow passage. The apparatus includes a bypass passage unit for bypassing a part of the air flowing through the air flow passage into the bypass passage. A flow amount measuring device is disposed in the bypass passage unit. A throttle unit is disposed upstream of the flow amount measuring device in the bypass passage unit and a support unit is disposed downstream over the throttle unit to support the flow amount measuring unit.

Abstract: An air flow meter disposed in an intake pipe has a bypass member having a U-shaped bypass passage, into which part of air flowing through the intake pipe is introduced. An outflow port disposed at a downstream air side of the bypass passage is surrounded at its three sides by opposing surfaces of a pair of side walls and a wall surface of a partition wall disposed at “an upstream air side of the outflow port”. Further, the outflow port is opened in an air flow direction in the bypass passage and in an air flow direction in the air flow passage. Therefore, air flowing through the bypass passage is partially discharged into the air flow passage through the outflow port gradually before joining main air flow in the air flow passage, thereby restricting decrease in air flow velocity and occurrence of turbulence in the bypass passage.