Patents by Inventor Makoto Yanagida
Makoto Yanagida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240180035Abstract: A thermoelectric power generation system includes a shell-and-tube heat exchanger configured such that a tube including double tubes of an inner tube and an outer tube is inserted into a shell, and a thermoelectric power generation module inserted into between the inner tube and the outer tube. The thermoelectric power generation module generates thermoelectric power using a temperature difference between a first medium flowing in the inner tube, such as coolant, and a second medium flowing outside the outer tube in the shell, such as excess water vapor.Type: ApplicationFiled: March 25, 2022Publication date: May 30, 2024Applicants: E-ThermoGentek Co., Ltd., KAWASAKI JUKOGYO KABUSHIKI KAISHA, KAWASAKI THERMAL ENGINEERING CO., LTD.Inventors: Takashi UNO, Nao MAJIMA, Michio OKAJIMA, Keiichi OHATA, Shutaro NAMBU, Makoto GODA, Minoru NAKAYASU, Yoma KANEDA, Masamichi SAKAGUCHI, Takahide YANAGIDA, Yusei MAEDA
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Publication number: 20240147857Abstract: A thermoelectric power generation system 20 includes a heat exchanger 1 having double tubes which are an inner tube 1a and an outer tube 1b, and a thermoelectric power generation module 2 mounted between the inner tube and the outer tube. The thermoelectric power generation module generates thermoelectric power using a temperature difference between a medium inside the inner tube and a medium outside the outer tube, and a highly thermal conductive elastic sheet 3a, 3b is mounted between the thermoelectric power generation module and the inner tube and/or the outer tube in close contact therewith.Type: ApplicationFiled: February 26, 2021Publication date: May 2, 2024Applicants: E-ThermoGentek Co., Ltd., KAWASAKI JUKOGYO KABUSHIKI KAISHA, KAWASAKI THERMAL ENGINEERING CO., LTD.Inventors: Takashi UNO, Nao MAJIMA, Michio OKAJIMA, Keiichi OHATA, Shutaro NAMBU, Makoto GODA, Minoru NAKAYASU, Yoma KANEDA, Masamichi SAKAGUCHI, Takahide YANAGIDA, Yusei MAEDA
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Publication number: 20240128463Abstract: A laminated resin film includes: a resin layer; and a Cu film provided on one surface or both surfaces of the resin layer, in which in the Cu film, a peak intensity y of a (200) plane is 2 to 30 when a peak intensity of a (111) plane in X-ray diffraction measurement is set to 100, and Expression (1) is satisfied. y?2.5×?7.5??Expression (1) (in Expression (1), y is the peak intensity of the (200) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100, and x is a peak intensity of a (220) plane when the peak intensity of the (111) plane in the X-ray diffraction measurement is set to 100.Type: ApplicationFiled: February 18, 2021Publication date: April 18, 2024Applicant: TDK CORPORATIONInventors: Makoto ENDO, Mingyu CHEN, Yoshihiro KANBAYASHI, Takasi SATOU, Natsumi KOZAI, Yoshihiko TANABE, Syuji TSUKAMOTO, Miyuki YANAGIDA
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Publication number: 20240072239Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.Type: ApplicationFiled: December 13, 2021Publication date: February 29, 2024Applicant: TDK CORPORATIONInventors: Yuhei HORIKAWA, Makoto ENDO, Takuya KAKIUCHI, Miyuki YANAGIDA, Yuki NAITO, Takahiro TASHIRO
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Patent number: 11745482Abstract: The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.Type: GrantFiled: October 27, 2020Date of Patent: September 5, 2023Assignee: RESONAC CORPORATIONInventors: Kosuke Murai, Takao Tanigawa, Minoru Kakitani, Makoto Yanagida, Mami Shimada
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Publication number: 20210187923Abstract: The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.Type: ApplicationFiled: October 27, 2020Publication date: June 24, 2021Inventors: Kosuke MURAI, Takao TANIGAWA, Minoru KAKITANI, Makoto YANAGIDA, Mami SHIMADA
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Patent number: 9215803Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:Type: GrantFiled: May 31, 2011Date of Patent: December 15, 2015Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Makoto Yanagida, Shuuji Gouzu
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Patent number: 8980424Abstract: Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 ?m and a glass filler having an average particle diameter of 1.0 to 3.0 ?m, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.Type: GrantFiled: May 31, 2011Date of Patent: March 17, 2015Assignee: Hitachi Chemical Company, Ltd.Inventors: Shuuji Gouzu, Makoto Yanagida
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Patent number: 8664534Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.Type: GrantFiled: May 19, 2006Date of Patent: March 4, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Nozomu Takano, Masaki Yamaguchi, Makoto Yanagida
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Publication number: 20130126218Abstract: Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 ?m and a glass filler having an average particle diameter of 1.0 to 3.0 ?m, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.Type: ApplicationFiled: May 31, 2011Publication date: May 23, 2013Inventors: Shuuji Gouzu, Makoto Yanagida
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Publication number: 20130108843Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:Type: ApplicationFiled: May 31, 2011Publication date: May 2, 2013Inventors: Makoto Yanagida, Shuuji Gouzu
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Publication number: 20120285732Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).Type: ApplicationFiled: July 16, 2012Publication date: November 15, 2012Inventors: Kazumasa TAKEUCHI, Nozomu Takano, Masaki Yamaguchi, Makoto Yanagida
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Patent number: 7871694Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.Type: GrantFiled: July 25, 2008Date of Patent: January 18, 2011Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi, Katsuyuki Masuda
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Publication number: 20100270059Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.Type: ApplicationFiled: May 19, 2006Publication date: October 28, 2010Inventors: Kazumasa Takeuchi, Nozomu Takano, Masaki Yamaguchi, Makoto Yanagida
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Patent number: 7758951Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.Type: GrantFiled: March 4, 2005Date of Patent: July 20, 2010Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi, Katsuyuki Masuda
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Publication number: 20100065313Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).Type: ApplicationFiled: May 26, 2006Publication date: March 18, 2010Inventors: Kazumasa Takeuchi, Nozomu Takano, Masaki Yamaguchi, Makoto Yanagida
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Publication number: 20080302558Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.Type: ApplicationFiled: July 25, 2008Publication date: December 11, 2008Inventors: Kazumasa TAKEUCHI, Makoto YANAGIDA, Masaki YAMAGUCHI, Katsuyuki MASUDA
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Publication number: 20070287021Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.Type: ApplicationFiled: March 4, 2005Publication date: December 13, 2007Inventors: Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi, Katsuyuki Masuda
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Patent number: 6338382Abstract: In an air conditioner equipped with an air cleaner, a front panel is provided with three air inlets: a first air inlet located on the front face of the front panel, a second air inlet located on the top face thereof, and a third air inlet located therebetween. Each of the first and second air inlets has an opening/closing unit including louvers, and an air cleaner is arranged on the inside of the third air inlet. At the time of cooling/heating operation and at the time of dehumidifying operation, the first and second air inlets are opened and closed by the opening/closing unit, by which the amount of air passing through the air cleaner is changed, thereby utilizing the air cleaner effectively.Type: GrantFiled: August 17, 2000Date of Patent: January 15, 2002Assignee: Fujitsu General LimitedInventors: Tomomi Takahashi, Shinji Sugiyama, Ritsushi Taira, Shunsuke Nakashima, Makoto Yanagida
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Patent number: D449095Type: GrantFiled: February 22, 2001Date of Patent: October 9, 2001Assignee: Fujitsu General LimitedInventors: Makoto Yanagida, Tomohiro Nagayama