Abstract: There are provided: an aluminum alloy magnetic disk substrate including: an aluminum alloy base material including an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter, simply referred to as “%”) of Fe, 0.1 to 3.0% of Mn, 0.005 to 1.000% of Cu, and 0.005 to 1.000% of Zn, with the balance of Al and unavoidable impurities; and an electroless Ni—P plated layer formed on a surface of the aluminum alloy base material, in which the peak value (BLEI) of Fe emission intensity at an interface between the electroless Ni—P plated layer and the aluminum alloy base material, as determined by a glow discharge optical emission spectrometry device, is lower than Fe emission intensity (AlEI) in the interior of the aluminum alloy base material, as determined by the glow discharge optical emission spectrometry device; and a method for producing the aluminum alloy magnetic disk substrate.

Abstract: There are provided: an aluminum alloy substrate for a magnetic disk, including 2.0 to 10.0 mass % (hereinafter, simply referred to as “%”) of Mg, 0.003 to 0.150% of Cu, 0.05 to 0.60% of Zn, 0.03 to 1.00% of Mn, and 0.00001 to 0.00200% of Be, as well as Fe restricted to 0.50% or less, Si restricted to 0.50% or less, Cr restricted to 0.30% or less, and Cl restricted to 0.005% or less, with the balance of Al and unavoidable impurities; and a method of producing the aluminum alloy substrate for a magnetic disk.

Abstract: An aluminum alloy substrate for a magnetic disk, wherein the sum of the circumferences of second phase particles having the longest diameter of 4 ?m or more and 30 ?m or less in the metal microstructure is 10 mm/mm2 or more.

Abstract: A wire harness pipe includes an aluminum pipe, a heat shrink tube that coats the outer surface side of the aluminum pipe, and an adhesive layer that is disposed between the aluminum pipe and the heat shrink tube.

Abstract: A wire harness pipe includes an aluminum pipe, a heat shrink tube that coats the outer surface side of the aluminum pipe, and an adhesive layer that is disposed between the aluminum pipe and the heat shrink tube.

Abstract: A process for manufacturing a copper tube with a tinned inner surface by circulating a substitution-type electroless tin plating solution inside the copper tube. The process is characterized by comprising a first plating step wherein the rate of deposition of a tin film is adjusted so that the total copper ion concentration in the plating solution, immediately after flowing from the copper tube, after having been circulated inside the tube divided by the tin (II) ion concentration in this plating solution is 0.8 or less, and a second plating step wherein plating is carried out at a plating solution temperature higher than the plating solution temperature in the first plating step. A plating solution comprising 0.05-0.3 mol/l of Sn.sup.2 ion, 0.5-2.0 mol/l of thiourea, 0.5-2.0 mol/l of sulfuric acid, 0.05-2.0 mol/l of alkyl benzene sulfonic acid, and 0.5-5.0 g/l of a nonionic surface active agent is preferably used.

Abstract: A spot welding electrode is made of a copper base material such as copper, copper alloy, or alumina dispersion strengthened copper, and has a Sn coating layer formed at the part making contact with the material being welded. The formed Sn coating layer reduces electrode wear and prolongs electrode life.