Abstract: A method and system for affinity management in a distributed computer system are provided in which a plurality of addressing entities (311-315) need to be balanced across a plurality of service providers (301-304) whilst maintaining group affinities within the addressing entities. An identifier is provided for each of a plurality of addressing entities, wherein the identifier for each member of a group of addressing entities with an affinity is the same group identifier. A list is provided of service providers which are available to be addressed by an addressing entity to provide an instance of a service. The distribution of addressing entities to service providers is managed by an algorithm. The algorithm includes: applying (205) a hash function to the identifier of an addressing entity to obtain a standard integer; dividing (206) the standard integer by the number of service providers and obtaining the modulus; and selecting (207) a service provider by reference to the modulus.

Abstract: The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles less than 25 &mgr;m in size homogenously dispersed therein to provide improved solder alloy powder coalescence and substrate surface wetting while maintaining appropriate solder paste rheology for use in printed circuit board assembly processes.