Patents by Inventor Mallikarjun Veeramurthy

Mallikarjun Veeramurthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Split panel array plate assemblies for electrified vehicle battery packs
    Patent number: 11724604
    Abstract: This disclosure details battery assemblies for use within electrified vehicle battery packs. An exemplary battery assembly includes a grouping of battery cells and an array plate assembly contacting a portion of the battery assembly. The array plate assembly may embody a split panel design that includes an outer panel and an inner panel that are arranged to nest together. One or both of the outer panel and the inner panel may include an embossing pattern. Among various other advantages, the split panel design increases the stiffness of the array plate assembly without significantly increasing the overall package depth of the array plate assembly or the battery assembly.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: August 15, 2023
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Saravanan Paramasivam, Rajaram Subramanian, Mallikarjun Veeramurthy, Bhaskara Boddakayala, David J. Pfeiffer
  • SPLIT PANEL ARRAY PLATE ASSEMBLIES FOR ELECTRIFIED VEHICLE BATTERY PACKS
    Publication number: 20190393457
    Abstract: This disclosure details battery assemblies for use within electrified vehicle battery packs. An exemplary battery assembly includes a grouping of battery cells and an array plate assembly contacting a portion of the battery assembly. The array plate assembly may embody a split panel design that includes an outer panel and an inner panel that are arranged to nest together. One or both of the outer panel and the inner panel may include an embossing pattern. Among various other advantages, the split panel design increases the stiffness of the array plate assembly without significantly increasing the overall package depth of the array plate assembly or the battery assembly.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Inventors: Saravanan Paramasivam, Rajaram Subramanian, Mallikarjun Veeramurthy, Bhaskara Boddakayala, David J. Pfeiffer