Patents by Inventor Mami Yamamoto
Mami Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934986Abstract: Provided are an index value calculator to calculate an index value obtained by quantifying a degree of status for evaluation items, a teamwork evaluator to evaluate a teamwork based on the index value, a support content determiner to select target persons to be supported including the members of the team based on the evaluation result of the teamwork and determine support contents in accordance with the target persons to be supported, and a presentation information generator to generate presentation information for presenting the determined support contents for each of the output devices corresponding to the selected target persons to be supported, and the teamwork evaluator evaluates the teamwork using an evaluation logic configured by combining logical formulas for comparing a threshold value set for evaluation items with the calculated index value.Type: GrantFiled: March 23, 2020Date of Patent: March 19, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kenta Fukami, Mami Naruse, Mitsunobu Yoshinaga, Nami Yamamoto
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Publication number: 20190079080Abstract: The present invention provides an antibody specific to a C-terminal domain of a human profilaggrin gene, wherein the C-terminal domain is a peptide comprising the amino acid sequence set forth in SEQ ID NO:1 or a variant thereof, a method for detecting a filaggrin gene mutation using the antibody, and a kit for the detection.Type: ApplicationFiled: September 20, 2018Publication date: March 14, 2019Applicant: Shiseido Company, Ltd.Inventors: Toshihiko HIBINO, Mami YAMAMOTO, Masaya TAKAGI, Junichi SAKABE, Yoshiki TOKURA
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Patent number: 9722127Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: GrantFiled: May 26, 2016Date of Patent: August 1, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Mami Yamamoto, Yoshio Noguchi
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Publication number: 20160268241Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: ApplicationFiled: May 26, 2016Publication date: September 15, 2016Inventors: Mami Yamamoto, Yoshio Noguchi
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Patent number: 9379273Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: GrantFiled: September 21, 2015Date of Patent: June 28, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Mami Yamamoto, Yoshio Noguchi
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Patent number: 9379095Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.Type: GrantFiled: June 30, 2015Date of Patent: June 28, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Yoshio Noguchi, Mami Yamamoto, Naoya Takai
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Publication number: 20160013353Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: ApplicationFiled: September 21, 2015Publication date: January 14, 2016Inventors: Mami Yamamoto, Yoshio Noguchi
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Patent number: 9171969Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: GrantFiled: January 23, 2014Date of Patent: October 27, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Mami Yamamoto, Yoshio Noguchi
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Publication number: 20150303180Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.Type: ApplicationFiled: June 30, 2015Publication date: October 22, 2015Inventors: Yoshio Noguchi, Mami Yamamoto, Naoya Takai
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Publication number: 20150262986Abstract: An optical coupling device includes a mounting member, a light receiving element, a first resin layer, a light emitting element, and a second resin layer. The mounting member includes an insulating layer having a recess in an upper surface thereof, input terminals, and output terminals insulated from the input terminals. The light receiving element is provided on a bottom surface of the recess. The first resin layer is provided in the recess and covers the light receiving element. The light emitting element is adhered to an upper surface of the first resin layer such that a lower surface of the light emitting element has a light emitting surface facing the light receiving surface, and is connected to the input terminals. The second resin layer covers the light emitting element, an upper surface of the insulating layer, the first resin layer, and the input terminals.Type: ApplicationFiled: September 1, 2014Publication date: September 17, 2015Inventors: Naoya TAKAI, Yoshio NOGUCHI, Mami YAMAMOTO
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Publication number: 20150262985Abstract: A photorelay includes an insulation board, input and output terminals, a die pad portion, a light receiving element, a light emitting element, a MOSFET, and a first sealing resin layer. The insulation board has first and second surfaces. The input terminal includes a first conductive region. The output terminal includes a first conductive region. The light receiving element is bonded on the die pad portion. The light emitting element is bonded on an exposed surface of the light receiving element, and connected to the first conductive region of the input terminal. The MOSFET is connected to the first conductive region of the output terminal. A connecting electrode is included as a part of the input or output terminal. Attachment conductive regions included respectively in the input and output terminals are provided on a side surface of the insulation board as the attachment surface of the photorelay to a wiring substrate.Type: ApplicationFiled: August 29, 2014Publication date: September 17, 2015Inventors: Naoya TAKAI, Mami YAMAMOTO, Yoshio NOGUCHI, Eiji NAKASHIMA
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Patent number: 9099602Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.Type: GrantFiled: January 23, 2014Date of Patent: August 4, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Yoshio Noguchi, Mami Yamamoto, Naoya Takai
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Patent number: 9068228Abstract: The present invention provides a method for screening and evaluating ameliorants of dry skin caused by atopic dermatitis, comprising: evaluating a candidate drug as being an ameliorant of dry skin caused by atopic dermatitis in the case the candidate drug significantly increases expression and/or activity of bleomycin hydrolase in comparison with a control drug.Type: GrantFiled: November 6, 2014Date of Patent: June 30, 2015Assignee: Shiseido Company, Ltd.Inventors: Toshihiko Hibino, Yayoi Kamata, Mami Yamamoto
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Publication number: 20150118686Abstract: The present invention provides a method for screening and evaluating ameliorants of dry skin caused by atopic dermatitis, comprising: evaluating a candidate drug as being an ameliorant of dry skin caused by atopic dermatitis in the case the candidate drug significantly increases expression and/or activity of bleomycin hydrolase in comparison with a control drug.Type: ApplicationFiled: November 6, 2014Publication date: April 30, 2015Applicant: Shiseido Company, Ltd.Inventors: TOSHIHIKO HIBINO, YAYOI KAMATA, MAMI YAMAMOTO
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Publication number: 20150069423Abstract: A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.Type: ApplicationFiled: January 23, 2014Publication date: March 12, 2015Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Mami Yamamoto, Yoshio Noguchi
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Publication number: 20150060892Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.Type: ApplicationFiled: January 23, 2014Publication date: March 5, 2015Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yoshio Noguchi, Mami Yamamoto, Naoya Takai
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Patent number: 8906629Abstract: The present invention provides a method for screening and evaluating ameliorants of dry skin caused by atopic dermatitis, comprising: evaluating a candidate drug as being an ameliorant of dry skin caused by atopic dermatitis in the case the candidate drug significantly increases expression and/or activity of bleomycin hydrolase in comparison with a control drug.Type: GrantFiled: December 2, 2010Date of Patent: December 9, 2014Assignee: Shiseido Company, Ltd.Inventors: Toshihiko Hibino, Yayoi Kamata, Mami Yamamoto
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Publication number: 20140287431Abstract: The present invention provides an antibody specific to a C-terminal domain of a human profilaggrin gene, wherein the C-terminal domain is a peptide comprising the amino acid sequence set forth in SEQ ID NO:1 or a variant thereof, a method for detecting a filaggrin gene mutation using the antibody, and a kit for the detection.Type: ApplicationFiled: November 8, 2012Publication date: September 25, 2014Inventors: Toshihiko Hibino, Mami Yamamoto, Masaya Takagi, Junichi Sakabe, Yoshiki Tokura
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Publication number: 20130307014Abstract: According to an embodiment, a semiconductor light emitting device includes a insulating base and a semiconductor light emitting element and resin. The insulating base includes a first face, a second face opposite to the first face, and a side face connecting to the first face and the second face, a recess portion being provided on the side face extending from the first face to the second face. The insulating base also includes a first metal layer blocking an opening of the recess portion, a second metal layer on an inner face of the recess portion, and a third metal layer on the second face, the third metal being electrically connected to the first metal layer via the second metal layer. A semiconductor light emitting element is fixed on the first face; and resin covers the first face and seals the semiconductor light emitting element.Type: ApplicationFiled: September 13, 2012Publication date: November 21, 2013Applicant: Kabushiki Kaisha ToshibaInventors: Mami Yamamoto, Kazuhiro Inoue, Yasunori Nagahata, Teruo Takeuchi, Hidenori Egoshi
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Patent number: 8525202Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 ?m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.Type: GrantFiled: August 3, 2010Date of Patent: September 3, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Gen Watari, Satoshi Shimizu, Mami Yamamoto, Hidenori Egoshi, Hiroaki Oshio, Tatsuo Tonedachi, Kazuhisa Iwashita, Tetsuro Komatsu, Teruo Takeuchi