Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.

Abstract: To provide a substrate of a cell culture container in which cells are appropriately maintained in dents and the cells in the dents are appropriately observed, and a cell culture container. The substrate of a cell culture container of the present invention has a bottom face and a surface having a dent-formed region having a plurality of dents formed, wherein the average depth of the plurality of dents is 200 µm or more, the formula ?1<90-?2+sin-1{sin(?2)×1.38/n} is satisfied wherein ?1 (deg) is the angle formed by a first tangent line which passes a connecting point of a first curved line corresponding to a first dent and a second curved line corresponding to a second dent and which is in contact with the first curved line, and a base line which passes the connecting point and which is in parallel with the bottom face, and n is the refractive index of the substrate, and the formula ?2<90-?1+sin-1{sin(?1)×1.

Abstract: A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B2O3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.

Abstract: A manufacturing method of a glass plate having holes, includes: (1) having a first surface of a glass base material irradiated with a laser, to form initial holes each having a first initial opening, wherein each initial hole is an initial through hole or non-through hole, wherein the first initial opening has a maximum dimension ?1S of 5 ?m or greater, and wherein in each initial hole, denoting a depth as d1, an aspect ratio (d1/?1S) is 15 or greater; and (2) etching the glass base material with an alkaline solution, to form processed holes from the initial holes, wherein each processed hole has a first opening on the first surface, and wherein the first opening has a diameter ?1 defined as an average of diameters of circumscribed and inscribed circles of the first opening, and a roundness P1, and a ratio P1/?1 is 10% or less.

Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.

Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

Abstract: A translucent substrate includes a glass substrate containing at least one element selected from a group consisting of Bi, Ti and Sn; a coating layer formed on the glass substrate; and a transparent conductive film formed on the coating layer, wherein the coating layer is deposited by a dry depositing method.

Abstract: A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d1/Rt1” of a thickness “d1” of the glass substrate with respect to a diameter “Rt1” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.

Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.

Abstract: A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 ?m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.

Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Abstract: A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d1/Rt1” of a thickness “d1” of the glass substrate with respect to a diameter “Rt1” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.

Abstract: There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.

Abstract: A translucent substrate includes a glass substrate containing at least one element selected from a group consisting of Bi, Ti and Sn; a coating layer formed on the glass substrate; and a transparent conductive film formed on the coating layer, wherein the coating layer is deposited by a dry depositing method.

Abstract: A phase difference layer 12 and a reflection layer 13 are provided. Then, adjustment is performed such that the phase difference layer 12 and the reflection layer 13 impart a predetermined phase difference to light having a particular wavelength bandwidth or plural kinds of light of different wavelengths that enter in an oblique direction relative to the normal direction of the plane of the phase difference layer 12. By virtue of this, the light 16a that goes forward and backward through the phase difference layer 12 and then exits the layer has an ellipticity ? of 0.7 or greater. Thus, in particular, when this wave plate is employed in an optical head device, the function of reflection and the function of a ¼-wave plate are integrated. Thus, stable recording and reproduction of an optical disk are achieved, and size reduction is achieved in the optical head device.