Patents by Inventor Mamoru Okada

Mamoru Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11986847
    Abstract: Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: May 21, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yoshitaka Abe, Nobuhito Shima, Hiromi Okada, Shinya Morita, Mamoru Ohishi
  • Patent number: 11928266
    Abstract: The information processing apparatus includes a pointing stick which is disposed on a keyboard, has an operable stick and is possible to detect a displacement in an installation plane direction of the stick and a displacement in a direction which is vertical to the installation plane and a main control unit which displays a predetermined menu screen on a display unit in a case where the pointing stick detects a specific operation which includes the displacement of the stick in the vertical direction.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: March 12, 2024
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Daisuke Watanabe, Takahide Wada, Akihiro Miyano, Mamoru Okada, Naoyuki Araki
  • Publication number: 20230205323
    Abstract: The information processing apparatus includes a pointing stick which is disposed on a keyboard, has an operable stick and is possible to detect a displacement in an installation plane direction of the stick and a displacement in a direction which is vertical to the installation plane and a main control unit which displays a predetermined menu screen on a display unit in a case where the pointing stick detects a specific operation which includes the displacement of the stick in the vertical direction.
    Type: Application
    Filed: October 26, 2022
    Publication date: June 29, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Daisuke Watanabe, Takahide Wada, Akihiro Miyano, Mamoru Okada, Naoyuki Araki
  • Patent number: 11287856
    Abstract: An electronic apparatus includes: a processing unit which executes system processing; a detection unit which detects an object present within a predetermined detection range; an operation control unit which activates the operation of the processing unit when the object is detected within the predetermined range by the detection unit; and a detection range control unit which sets the predetermined detection range according to the operating state of the system processing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 29, 2022
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Kazuhiro Kosugi, Masashi Nishio, Mamoru Okada
  • Publication number: 20200201401
    Abstract: An electronic apparatus includes: a processing unit which executes system processing; a detection unit which detects an object present within a predetermined detection range; an operation control unit which activates the operation of the processing unit when the object is detected within the predetermined range by the detection unit; and a detection range control unit which sets the predetermined detection range according to the operating state of the system processing.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 25, 2020
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Kazuhiro Kosugi, Masashi Nishio, Mamoru Okada
  • Patent number: 10331219
    Abstract: An aspect provides a method, including: operating one or more sensors to detect gesture input proximate to a surface of an input device of an information handling device, wherein the input device is configured to receive one or more input types in addition to gesture input; determining, using a processor, if the gesture input detected matches a predetermined gesture; and executing at least one response action associated with the predetermined gesture. Other aspects are described and claimed.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: June 25, 2019
    Assignee: Lenovo (Singaore) Pte. Ltd.
    Inventors: Michaela Rose Case, Aaron Michael Stewart, Wesley Abram Luttrell, Mamoru Okada, Xin Feng
  • Patent number: 9679596
    Abstract: A portable computing device prevents a magnetic disk unit protecting function from impairing usability for a user when the processor is used as a tablet PC. The portable computing device includes a magnetic disk unit, a magnetic disk unit protecting section operable when predicting an occurrence of an impact to carry out a magnetic disk unit protecting function for retracting a head of the magnetic disk unit, and a detecting section that detects whether a user is holding the portable computing device or not, and responsive to detecting that the user is holding the portable computing device, temporarily deactivating the magnetic disk unit protecting function.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 13, 2017
    Assignee: Lenovo (Singapore) PTE. LTD.
    Inventors: Kazuhiro Kosugi, Takashi Yomo, Mamoru Okada, Tomoaki Kosugi
  • Publication number: 20160124517
    Abstract: Systems and methods are provided for analyzing key compression patterns on a keyboard using one or more computer servers and storage devices. In general, the systems and methods can include a computer system that keeps track of input from a keyboard over time and analyzes the resulting key compression patterns to determine whether the patterns satisfy predetermined criteria for activating one or more keyboard functions. The criteria can be defined to accommodate user error or inability to create a desired key compression pattern. In an exemplary embodiment, the computer system waits for a specified amount of time after receiving the keyboard input before activating certain keyboard functions. In this way, where a user accidentally waits too long before pressing a desired key, or where a user is not capable of pressing keys quickly, the computer system can still ascertain a user's intent to create a particular key compression pattern.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Markus Takashi Heberlein, Mamoru Okada
  • Publication number: 20150116222
    Abstract: A keyboard may provide a user with a customizable keyboard layout. Keys may be moved from their default position into a new key position while retaining their indicated keystroke function. In some embodiments, two keys may be swappable so that the keystroke function associated with the first key may be moved into the keyboard position of the second key and vice versa. In some embodiments, the keyboard positions may include more than one switch to provide more than one keystroke function at keyboard positions. Key caps may be configured to actuate their corresponding indicated keystroke function by actuating one or more switches at different keyboard positions.
    Type: Application
    Filed: October 24, 2013
    Publication date: April 30, 2015
    Applicant: LENOVO (SINGAPORE) PTE, LTD
    Inventors: Markus Takashi Heberlein, Mamoru Okada
  • Publication number: 20150092297
    Abstract: A portable computing device prevents a magnetic disk unit protecting function from impairing usability for a user when the processor is used as a tablet PC. The portable computing device includes a magnetic disk unit, a magnetic disk unit protecting section operable when predicting an occurrence of an impact to carry out a magnetic disk unit protecting function for retracting a head of the magnetic disk unit, and a detecting section that detects whether a user is holding the portable computing device or not, and responsive to detecting that the user is holding the portable computing device, temporarily deactivating the magnetic disk unit protecting function.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventors: Kazuhiro Kosugi, Takashi Yomo, Mamoru Okada, Tomoaki Kosugi
  • Publication number: 20150054846
    Abstract: An electronic mobile device with a display may include brightness controls that may be adjusted upon detection in change of orientation of the device. An orientation sensor may be coupled to a processor. The processor, in response to a change in orientation, may determine if the device is oriented such that an ambient light sensor may be rotated. Ambient light sensitivity levels may be adjusted to account for the position of the ambient light sensor in a rotated orientation.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Applicant: LENOVO (SINGAPORE) PTE, LTD
    Inventors: Mamoru Okada, Kazuhir Kosugi
  • Patent number: 8898590
    Abstract: Provided are an information input device, an on-screen arrangement method thereof, and a computer-executable program capable of preventing deterioration of operability even when an input disable region is set on a touch panel. An information input device capable of inputting information by an indicator touching a touch panel formed on a display screen includes an input disable region setting controller that sets an input disable region on a part of the touch panel and a display controller that rearranges an object being displayed on the display screen to avoid the set input disable region.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: November 25, 2014
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Mamoru Okada, Hidetoshi Mori, Masaki Matsubara, Masahiro Tsukiyama
  • Publication number: 20140191972
    Abstract: An aspect provides a method, including: operating one or more sensors to detect gesture input proximate to a surface of an input device of an information handling device, wherein the input device is configured to receive one or more input types in addition to gesture input; determining, using a processor, if the gesture input detected matches a predetermined gesture; and executing at least one response action associated with the predetermined gesture. Other aspects are described and claimed.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Michaela Rose Case, Aaron Michael Stewart, Wesley Abram Luttrell, Mamoru Okada, Xin Feng
  • Publication number: 20120026200
    Abstract: Provided are an information input device, an on-screen arrangement method thereof, and a computer-executable program capable of preventing deterioration of operability even when an input disable region is set on a touch panel. An information input device capable of inputting information by an indicator touching a touch panel formed on a display screen includes an input disable region setting controller that sets an input disable region on a part of the touch panel and a display controller that rearranges an object being displayed on the display screen to avoid the set input disable region.
    Type: Application
    Filed: July 5, 2011
    Publication date: February 2, 2012
    Applicant: LENOVO (SINGAPORE) PTE, LTD.
    Inventors: Mamoru Okada, Hidetoshi Mori, Masaki Matsubara, Masahiro Tsukiyama
  • Patent number: 7507146
    Abstract: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface sides in the chamfered portion is in contact with a polishing pad; then the double-side polishing is performed; as a second chamfered-portion polishing step, at least, the chamfered portion of the wafer is polished so that an end surface of the chamfered portion is in contact with a polishing pad and so that both main surfaces of the wafer are not in contact with a polishing pad. Thereby, when a semiconductor wafer is produced, scratch and such generated in the chamfered portion in a double-side polishing process can be removed and, excessive polishing in a peripheral portion of a main surface can be prevented from being caused in polishing a chamfered portion.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: March 24, 2009
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Tadahiro Kato, Masayoshi Sekizawa, Mamoru Okada, Hisashi Kijima
  • Publication number: 20080096474
    Abstract: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface sides in the chamfered portion is in contact with a polishing pad; then the double-side polishing is performed; as a second chamfered-portion polishing step, at least, the chamfered portion of the wafer is polished so that an end surface of the chamfered portion is in contact with a polishing pad and so that both main surfaces of the wafer are not in contact with a polishing pad. Thereby, when a semiconductor wafer is produced, scratch and such generated in the chamfered portion in a double-side polishing process can be removed and, excessive polishing in a peripheral portion of a main surface can be prevented from being caused in polishing a chamfered portion.
    Type: Application
    Filed: October 12, 2005
    Publication date: April 24, 2008
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Tadahiro Kato, Masayoshi Sekizawa, Mamoru Okada, Hisashi Kijima
  • Publication number: 20070281009
    Abstract: It is intended to provide an N-acetylglucosamine tablet, with which N-acetylglucosamine can be taken in an amount at which a physiological activity can be expected in a small number of tablets, and which has an excellent disintegrating property and solubility in the oral cavity and has an adequate hardness to such an extent that it is not difficult to handle; and a process for producing the same. A saccharide having low moldability is mixed with or sprayed on N-acetylglucosamine to perform coating and/or granulation, and a saccharide having high moldability is mixed with the obtained granulated matter to perform molding, whereby the N-acetylglucosamine tablet disintegrating in oral cavity which has a tablet hardness of 5 to 20 kgf and a mass per tablet of 1,000 to 3,000 mg, and which rapidly disintegrates and dissolves in the oral cavity is obtained.
    Type: Application
    Filed: December 26, 2005
    Publication date: December 6, 2007
    Applicant: Yaizu Suisankagaku Industry Co., Ltd.
    Inventors: Hisayo Kamisono, Mamoru Okada, Yoshinari Tagata, Masatami Nakashima
  • Patent number: 6930023
    Abstract: In a method for thinning a semiconductor wafer by grinding a back surface of the semiconductor wafer in which semiconductor devices 2 are formed on its surface, the surface of the semiconductor wafer 1 is adhered to a support 4 via an adhesive layer 3, the back surface of the semiconductor wafer is ground while holding the support, and then the thinned semiconductor wafer is released from the support. Preferably, a semiconductor wafer is used as the support, a thermal release double-sided adhesive sheet is used as the adhesive layer, and they are separated by heating after grinding. Thus, there are provided a method for thinning a semiconductor wafer, which enables production of semiconductor wafers having a thickness of about 120 ?m or less without generating breakage such as cracking or chipping during the processing step and so forth as much as possible at a low cost, and a semiconductor wafer thinned further compared with conventional products in spite of a large diameter of 6 inches (150 mm) or more.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: August 16, 2005
    Assignee: Shin-Etsu Handotai Co, Ltd.
    Inventors: Mamoru Okada, Yukio Nakajima
  • Publication number: 20030113984
    Abstract: In a method for thinning a semiconductor wafer by grinding a back surface of the semiconductor wafer in which semiconductor devices 2 are formed on its surface, the surface of the semiconductor wafer 1 is adhered to a support 4 via an adhesive layer 3, the back surface of the semiconductor wafer is ground while holding the support, and then the thinned semiconductor wafer is released from the support. Preferably, a semiconductor wafer is used as the support, a thermal release double-sided adhesive sheet is used as the adhesive layer, and they are separated by heating after grinding. Thus, there are provided a method for thinning a semiconductor wafer, which enables production of semiconductor wafers having a thickness of about 120 &mgr;m or less without generating breakage such as cracking or chipping during the processing step and so forth as much as possible at a low cost, and a semiconductor wafer thinned further compared with conventional products in spite of a large diameter of 6 inches (150 mm) or more.
    Type: Application
    Filed: November 15, 2002
    Publication date: June 19, 2003
    Inventors: Mamoru Okada, Yukio Nakajima
  • Publication number: 20020031990
    Abstract: There is disclosed a polishing pad for mirror-polishing a semiconductor wafer, especially in a finish polishing process, by use of a polishing machine which includes a turn table on which a polishing pad is attached, a unit for feeding a polishing agent onto a surface of the polishing pad, and a mechanism for pressing a semiconductor wafer onto the surface of the polishing pad. The polishing pad includes a top layer formed of a porous soft material, a bottom layer formed of a rubber elastomer, and an intermediate layer formed of a hard plastic sheet. The hard plastic sheet is disposed between the top layer and the bottom layer and is bonded to the bottom layer. In the polishing pad, undulation produced in the bottom layer due to a horizontal force generated during polishing is prevented from being transferred to the top layer of the polishing pad, and unevenness in polishing stock removal stemming from warpage or undulation of a wafer itself can be mitigated.
    Type: Application
    Filed: August 23, 2001
    Publication date: March 14, 2002
    Applicant: Shin-Estu Handotai Co., Ltd.
    Inventors: Hisashi Masumura, Makoto Kobayashi, Teruaki Fukami, Tsutomu Takaku, Mamoru Okada