Patents by Inventor Mamunur RAHMAN
Mamunur RAHMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162191Abstract: Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: Intel CorporationInventors: Jeremy Ecton, Changhua Liu, Brandon C. Marin, Srinivas V. Pietambaram, Mohammad Mamunur Rahman
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Publication number: 20240120305Abstract: Embodiments of a microelectronic assembly includes: a package substrate and an integrated circuit (IC) die coupled to a surface of the package substrate by first interconnects and second interconnects, the first interconnects and the second interconnects comprising solder. The first interconnects are larger than the second interconnects, the first interconnects and the second interconnects further comprise bumps on the IC die and bond-pads on the surface of the package substrate, with the solder coupled to the bumps and the bond-pads, lateral sides of the bumps have a coating of a material that prevents solder wicking, and the surface of the package substrate includes insulative baffles between the bond-pads.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Applicant: Intel CorporationInventors: Jeremy Ecton, Brandon C. Marin, Suddhasattwa Nad, Srinivas V. Pietambaram, Mohammad Mamunur Rahman
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Publication number: 20240063100Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first layer, where the first layer comprises glass, a second layer over the first layer, where the second layer comprises glass, and a third layer over the second layer, where the third layer comprises glass. In an embodiment, a pair of traces are in the second layer, and a first gap is below the pair of traces, where the first gap is in the first layer and the second layer. In an embodiment, a second gap is above the pair of traces, where the second gap is in the second layer and the third layer.Type: ApplicationFiled: August 16, 2022Publication date: February 22, 2024Inventors: Brandon C. MARIN, Mohammad Mamunur RAHMAN, Jeremy D. ECTON, Gang DUAN, Suddhasattwa NAD, Srinivas V. PIETAMBARAM, Kemal AYGÜN, Cemil GEYIK
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Patent number: 11827507Abstract: The present application provides a micro-ingredient tower for filling a container with a number of different micro-ingredients. The micro-ingredient tower may include a number of micro-ingredient containers therein and a nozzle head. The nozzle head may include a number of dispensing needles therein such that each of the dispensing needles doses a micro-ingredient into the container.Type: GrantFiled: October 17, 2018Date of Patent: November 28, 2023Assignee: THE COCA-COLA COMPANYInventors: Anish Mehta, Gregg Carpenter, Mamunur Rahman, Manuel I. Garcia
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Publication number: 20230248032Abstract: The present disclosure provides a process to make whole soy foodstuff or beverage without removing soy pulp or okara during the process. The process includes liquefying whole soybeans, forming a liquefaction product, wherein the liquefaction product comprises a liquid fraction and a soy pulp fraction; and treating the liquefaction product with an enzyme, thereby forming a whole soy base. The whole soy base can itself serve as a soy beverage, or alternatively combined with other ingredients or subjected to further treatment to make final soy foodstuff or beverages.Type: ApplicationFiled: June 25, 2021Publication date: August 10, 2023Applicant: The Coca-Cola CompanyInventors: Rohan DODAL, Mamunur RAHMAN
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Patent number: 11721650Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures.Type: GrantFiled: June 11, 2019Date of Patent: August 8, 2023Assignee: Intel CorporationInventors: Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Jeremy D. Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman
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Publication number: 20230108843Abstract: A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchannel has a triangular cross-section or a trapezoidal cross-section. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.Type: ApplicationFiled: September 23, 2021Publication date: April 6, 2023Inventors: Mohammad Mamunur RAHMAN, Jeremy D. ECTON, Je-Young CHANG
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Publication number: 20230091720Abstract: A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material with a rectangular cross-section through which a fluid is to flow to spread the heat. The microchannel can be an open channel that is sealed with a pump to cause the fluid to flow through the microchannel. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.Type: ApplicationFiled: September 23, 2021Publication date: March 23, 2023Inventors: Mohammad Mamunur RAHMAN, Jeremy D. ECTON, Je-Young CHANG
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Patent number: 11312604Abstract: The present application provides a filling line for filling a container with one of a number of different beverages. The filling line may include a water circuit with a counter-pressure nozzle to fill the container with carbonated water and one or more micro-ingredient towers with a number of micro-ingredients therein positioned downstream of the counter-pressure nozzle to fill the container with the micro-ingredients.Type: GrantFiled: October 17, 2018Date of Patent: April 26, 2022Assignee: THE COCA-COLA COMPANYInventors: Anish Mehta, Gregg Carpenter, Eric L. Spann, Mamunur Rahman, Hitesh Patel, Dinesh C. Patel, Manuel I. Garcia, Sergey Grey Ivanov
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Publication number: 20200395317Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures.Type: ApplicationFiled: June 11, 2019Publication date: December 17, 2020Inventors: Brandon C. MARIN, Aleksandar ALEKSOV, Georgios DOGIAMIS, Jeremy D. ECTON, Suddhasattwa NAD, Mohammad Mamunur RAHMAN
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Publication number: 20200331739Abstract: The present application provides a filling line for filling a container with one of a number of different beverages. The filling line may include a water circuit with a counter-pressure nozzle to fill the container with carbonated water and one or more micro-ingredient towers with a number of micro-ingredients therein positioned downstream of the counter-pressure nozzle to fill the container with the micro-ingredients.Type: ApplicationFiled: October 17, 2018Publication date: October 22, 2020Inventors: Anish MEHTA, Gregg CARPENTER, Eric L. SPANN, Mamunur RAHMAN, Hitesh PATEL, Dinesh C. PATEL, Manuel I. GARCIA, Sergey Grey IVANOV
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Publication number: 20200247660Abstract: The present application provides a micro-ingredient tower for filling a container with a number of different micro-ingredients. The micro-ingredient tower may include a number of micro-ingredient containers therein and a nozzle head. The nozzle head may include a number of dispensing needles therein such that each of the dispensing needles doses a micro-ingredient into the container.Type: ApplicationFiled: October 17, 2018Publication date: August 6, 2020Inventors: Anish MEHTA, Gregg CARPENTER, Mamunur RAHMAN, Manuel I. GARCIA
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Patent number: 10494284Abstract: This disclosure provides systems and methods for generating potable water from contaminated water sources, particularly well water. By eliminating the purified water holding tank, employing a combination of source tank with carbon and reverse osmosis filters in series, and using an actuated pump to supply impure water from the source, a simple on-demand system is provided that is especially adapted for use in remote locations. The system and method are particularly useful where only direct current power, such as from a solar photovoltaic panel power, is available.Type: GrantFiled: December 16, 2015Date of Patent: December 3, 2019Assignee: The Coca-Cola CompanyInventors: Anish Mehta, Mamunur Rahman
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Publication number: 20190246669Abstract: Systems and methods for blending low solubility ingredients are provided. In one embodiment, a method of blending a low solubility ingredient into a beverage solution includes dissolving the low solubility ingredient in a preselected solvent to provide a first solution. In one embodiment, the preselected solvent is preheated. The method also includes mixing various ingredients from one or more pre-blend batches to form a beverage syrup and mixing the first solution with the beverage syrup to form the beverage solution.Type: ApplicationFiled: October 20, 2017Publication date: August 15, 2019Applicant: The Coca-Cola CompanyInventors: Anish Mehta, Hubertus Ulrich Schubert, Mamunur Rahman, Shumi Baker
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Publication number: 20190092668Abstract: This disclosure provides systems and methods for generating potable water from contaminated water sources, particularly well water. By eliminating the purified water holding tank, employing a combination of source tank with carbon and reverse osmosis filters in series, and using an actuated pump to supply impure water from the source, a simple on-demand system is provided that is especially adapted for use in remote locations. The system and method are particularly useful where only direct current power, such as from a solar photovoltaic panel power, is available.Type: ApplicationFiled: December 16, 2015Publication date: March 28, 2019Applicant: THE COCA-COLA COMPANYInventors: Anish Mehta, Mamunur Rahman
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Publication number: 20190029292Abstract: Functionality is disclosed herein for a pascalization process for food and beverage products, and possibly other materials. The process includes inputting an unprocessed product, pressurizing the unprocessed product to a first pressure to create a pressurized product, holding the pressurized product at the first pressure for a predetermined hold time and depressurizing the pressurized product to a second pressure to create a processed product. The second pressure is less than the first pressure. The process also includes outputting the processed product.Type: ApplicationFiled: January 17, 2017Publication date: January 31, 2019Inventors: Anish MEHTA, Hubertus SCHUBERT, Mamunur RAHMAN, Shumi BAKR, Omari HENDERSON, Roger LUENSE, Indauê Ieda GIRIBONI DE MELLO