Abstract: A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Abstract: A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Abstract: A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Abstract: A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Abstract: A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Abstract: A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Abstract: A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and (2) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

Abstract: A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and (2) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

Abstract: A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Abstract: A resin composition, a resin and a method for manufacturing the same. The resin composition includes a plant oil derivative, and a multifunctional carboxylic acid, anhydride compound or a copolymer containing anhydride. The multifunctional carboxylic acid, the anhydride compound or the copolymer containing anhydride has an amount of 5-60 parts by weight relative to 100 parts by weight of the plant oil derivative.

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract: Fabrication device of organic light emitting diode (OLED) includes a Substrate, a transparent conductive layer, an insulating film layer, an organic light-emitting layer, and a conductive layer; when a suitable potential is applied thereto, an organic light-emitting layer emits a visible light, however, it usually occurs breakdown between cathode and anode or bad signal, therefore, the present invention provides a positive insulating film photoresist with an easily inclining obtuse angle, smooth surface, and easily controlled fabrication condition to cover the edge of a transparent electrode (anode) in order to avoid that when the edge of ITO transparent electrode is sharp it causes an organic light-emitting layer film breakdown and results from signal lost or weaken to increase the yields.

Abstract: The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.

Abstract: Fabrication device of organic light emitting diode (OLED) includes a Substrate, a transparent conductive layer, an insulating film layer, an organic light-emitting layer, and a conductive layer; when a suitable potential is applied thereto, an organic light-emitting layer emits a visible light, however, it usually occurs breakdown between cathode and anode or bad signal, therefore, the present invention provides a positive insulating film photoresist with an easily inclining obtuse angle, smooth surface, and easily controlled fabrication condition to cover the edge of a transparent electrode (anode) in order to avoid that when the edge of ITO transparent electrode is sharp it causes an organic light-emitting layer film breakdown and results from signal lost or weaken to increase the yields.

Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Abstract: A method for making high-density multilayer printed circuit boards is disclosed.