Abstract: A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250° C. or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than the reflow temperature. In the package, softening the cover compensates for the stress on the bonded surfaces resulting from a difference in thermal expansion between the case and the cover caused during reflow.

Abstract: An insert terminal containing case includes a bottom wall, four side walls, and an opening at the upper portion, wherein a terminal made of a metal plate is vertically fixed to at least one of the four side walls by insert molding. A groove is vertically arranged at the outer side surface of the side wall fixing the terminal, the groove extending downward, the outer side surface of the terminal is partially exposed at the groove, and the inner side surface opposite the outer side surface of the terminal exposed at the groove is partially exposed at the inner side surface of the side wall. Therefore, when the terminal is provided in the case by insert molding, molding can be performed only using upper and lower dies. Furthermore, the terminal can be reliably exposed at the inner surface of the side wall. The insert terminal containing case has the minimum difference between the opening dimension of the case and the dimension of a piezoelectric diaphragm and is molded without using a sliding die.

Abstract: A piezoelectric electroacoustic transducer includes a piezoelectric sounding body in which bending vibration is generated by applying an alternating signal between two electrodes, a case housing the piezoelectric sounding body, and a pair of terminals insert-molded in the case. In the piezoelectric electroacoustic transducer, internal connection portions of the pair of terminals are exposed on the inside surface of the side wall portion of the case so as to extend in a direction that is substantially perpendicular relative to the piezoelectric sounding body, and the internal connection portions of the terminals are electrically connected to the electrodes of the piezoelectric sounding body by using conductive adhesive. The internal connection portions of the terminals do not largely extend inside the case and accordingly, the dimensional difference between the case and the piezoelectric sounding body is minimized.

Abstract: An insert terminal containing case includes a bottom wall, four side walls, and an opening at the upper portion, wherein a terminal made of a metal plate is vertically fixed to at least one of the four side walls by insert molding. A groove is vertically arranged at the outer side surface of the side wall fixing the terminal, the groove extending downward, the outer side surface of the terminal is partially exposed at the groove, and the inner side surface opposite the outer side surface of the terminal exposed at the groove is partially exposed at the inner side surface of the side wall. Therefore, when the terminal is provided in the case by insert molding, molding can be performed only using upper and lower dies. Furthermore, the terminal can be reliably exposed at the inner surface of the side wall. The insert terminal containing case has the minimum difference between the opening dimension of the case and the dimension of a piezoelectric diaphragm and is molded without using a sliding die.

Abstract: A piezoelectric type electroacoustic transducer includes a piezoelectric vibrating plate including a plurality of piezoelectric ceramic layers laminated to each other with an internal electrode being interposed between the piezoelectric ceramic layers, and main surface electrodes disposed on the main surfaces on the front and back sides of the piezoelectric vibrating plate, whereby the piezoelectric vibrating plate is surface-flexural-vibrated in the thickness direction thereof with an AC signal applied between the main surface electrodes and the internal electrode, and a box having supporting portions on which the outer peripheral portions on the back side of the piezoelectric vibrating plate is supported, the piezoelectric vibrating plate having a protecting film substantially on the entire surface on the back-side only or on the front and back sides of the piezoelectric vibrating plate, and the protecting film being formed by applying a resin in a film-shape and hardening the resin, or by bonding an adhesi

Abstract: A piezoelectric electro-acoustic transducer includes a piezoelectric vibration plate having a plurality of piezoelectric ceramic layers laminated to each other with an internal electrode being interposed between the ceramic layers, and main surface electrodes provided on the front and back surfaces thereof, whereby area bending vibration is produced by applying an AC signal between the main surface electrodes and the internal electrode, respectively, a resin film having a size that is greater than the piezoelectric vibration plate and having the piezoelectric vibration plate bonded substantially to the central portion of the surface thereof, and a casing which accommodates the piezoelectric vibration plate and the resin film. The piezoelectric vibration plate has an area of about 40% to about 70% of that of the resin film.

Abstract: A piezoelectric electroacoustic transducer includes a substantially rectangular piezoelectric diaphragm having an internal electrode, a plurality of laminated piezoelectric ceramic layers having the internal electrode interposed between two of the piezoelectric ceramic layers, principal-surface electrodes disposed on top and bottom principal surfaces of the piezoelectric diaphragm, the piezoelectric diaphragm generating surface bending-vibrations in response to application of an alternating signal between the principal-surface electrodes and the internal electrode, a resin film that is larger than the piezoelectric diaphragm and having the piezoelectric diaphragm affixed onto substantially a central portion of a front surface thereof, and a housing having a support for supporting the outer periphery of the resin film.

Abstract: A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250° C. or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than the reflow temperature. In the package, softening the cover compensates for the stress on the bonded surfaces resulting from a difference in thermal expansion between the case and the cover caused during reflow.

Abstract: A piezoelectric electroacoustic transducer includes a substantially rectangular piezoelectric diaphragm having an internal electrode, a plurality of laminated piezoelectric ceramic layers having the internal electrode interposed between two of the piezoelectric ceramic layers, principal-surface electrodes disposed on top and bottom principal surfaces of the piezoelectric diaphragm, the piezoelectric diaphragm generating surface bending-vibrations in response to application of an alternating signal between the principal-surface electrodes and the internal electrode, a resin film that is larger than the piezoelectric diaphragm and having the piezoelectric diaphragm affixed onto substantially a central portion of a front surface thereof, and a housing having a support for supporting the outer periphery of the resin film.

Abstract: A piezoelectric type electroacoustic transducer includes a piezoelectric vibrating plate including a plurality of piezoelectric ceramic layers laminated to each other with an internal electrode being interposed between the piezoelectric ceramic layers, and main surface electrodes disposed on the main surfaces on the front and back sides of the piezoelectric vibrating plate, whereby the piezoelectric vibrating plate is surface-flexural-vibrated in the thickness direction thereof with an AC signal applied between the main surface electrodes and the internal electrode, and a box having supporting portions on which the outer peripheral portions on the back side of the piezoelectric vibrating plate is supported, the piezoelectric vibrating plate having a protecting film substantially on the entire surface on the back-side only or on the front and back sides of the piezoelectric vibrating plate, and the protecting film being formed by applying a resin in a film-shape and hardening the resin, or by bonding an adhesi

Abstract: A piezoelectric electroacoustic transducer includes a piezoelectric diaphragm having a substantially rectangular shape which vibrates in the thickness direction when an alternating current is applied between electrodes of the piezoelectric diaphragm, a housing which stores the piezoelectric diaphragm, and a pair of terminals formed in the housing by insert molding. One end of each terminal is inserted inside the housing and includes a body portion fixed to the housing and wing portions which extend from both sides of the body portion toward the corners of the housing. The wing portions are not fixed to the housing, and stress-relieving portions are disposed between the body portion and the wing portions so that the wing portions are able to move toward the inside of the housing. Each electrode of the piezoelectric diaphragm is connected to at least one of the wing portions of the terminals by a conductive adhesive.

Abstract: A piezoelectric sounding body includes a metal plate, an insulating layer disposed on the top surface of the metal plate, and a piezoelectric body in which a plurality of piezoelectric ceramic layers are laminated with an internal electrode disposed therebetween and the piezoelectric ceramic layers are polarized in the thickness direction so as to be opposite to each other, the top and bottom surfaces of which external electrodes are provided, and on the bottom surface of which is bonded to the insulating layer.

Abstract: A piezoelectric electro-acoustic transducer includes a piezoelectric vibration plate having a plurality of piezoelectric ceramic layers laminated to each other with an internal electrode being interposed between the ceramic layers, and main surface electrodes provided on the front and back surfaces thereof, whereby area bending vibration is produced by applying an AC signal between the main surface electrodes and the internal electrode, respectively, a resin film having a size that is greater than the piezoelectric vibration plate and having the piezoelectric vibration plate bonded substantially to the central portion of the surface thereof, and a casing which accommodates the piezoelectric vibration plate and the resin film. The piezoelectric vibration plate has an area of about 40% to about 70% of that of the resin film.

Abstract: A piezoelectric electroacoustic transducer includes a substantially square piezoelectric diaphragm flexually vibrating in a plate-thickness direction in response to application of an alternating signal between electrodes, a substantially rectangular insulating case having a supporting member disposed inside sidewalls of the case for supporting the diaphragm, terminals having internal connections exposed in a vicinity of the supporting member and external connections exposed outside the case and electrically connecting to the internal connections, a first adhesive applied to a shortest route located between the external periphery of the diaphragm and the internal connections and connecting the diaphragm to the internal connections so as to fix the diaphragm to the case, a conductive adhesive applied to electrodes of the diaphragm and the internal connections via the upper surface of the first adhesive by detouring from the shortest route to connect the diaphragm to the internal connections for electrically con

Abstract: A piezoelectric electroacoustic transducer includes a piezoelectric diaphragm having a substantially rectangular shape which vibrates in the thickness direction when an alternating current is applied between electrodes of the piezoelectric diaphragm, a housing which stores the piezoelectric diaphragm, and a pair of terminals formed in the housing by insert molding. One end of each terminal is inserted inside the housing and includes a body portion fixed to the housing and wing portions which extend from both sides of the body portion toward the corners of the housing. The wing portions are not fixed to the housing, and stress-relieving portions are disposed between the body portion and the wing portions so that the wing portions are able to move toward the inside of the housing. Each electrode of the piezoelectric diaphragm is connected to at least one of the wing portions of the terminals by a conductive adhesive.

Abstract: A piezoelectric electroacoustic transducer includes a substantially square piezoelectric diaphragm flexually vibrating in a plate-thickness direction in response to application of an alternating signal between electrodes, a substantially rectangular insulating case having a supporting member disposed inside sidewalls of the case for supporting the diaphragm, terminals having internal connections exposed in a vicinity of the supporting member and external connections exposed outside the case and electrically connecting to the internal connections, a first adhesive applied to a shortest route located between the external periphery of the diaphragm and the internal connections and connecting the diaphragm to the internal connections so as to fix the diaphragm to the case, a conductive adhesive applied to electrodes of the diaphragm and the internal connections via the upper surface of the first adhesive by detouring from the shortest route to connect the diaphragm to the internal connections for electrically con

Abstract: The invention provides a solder alloy of Sn, Sb, Ag and Cu, wherein the Sb is about 1.0-3.0 wt %; the Ag is about 1.0 wt % or more and about 2.0 wt % or less; the Cu is about 1.0 wt % or less; and the remainder is Sn. The solder alloy has a comparatively low Young's modulus and sufficient tensile characteristics. Therefore, it resists peeling from the bonded electrode, etc., even though a heat stress is added. Also, a solder which has an excellent solderbility to metal phases such as Cu and Ni can be provided. Therefore, a solder alloy excellent in thermal shock resistance can be provided. The solder alloy may be used for soldering the inside of an electronic component.

Abstract: A terminal for a piezoelectric device has a first contact portion and a second contact portion which are preferably formed as separate metallic elements. Each contact portion has a protrusion disposed thereon. A lubricant is located between the first contact portion and the second contact portion. The lubricant contains a hydrophilic group tending to form a hydrogen bond with a metal element and a lipophilic group extending in a straight chain from any such hydrogen bond and having a length at least several times that of the hydrophilic group. The lipophilic group has a molecular structure which urges away from the metallic surfaces of the contact portions.

Abstract: An apparatus and process for forming at least one electrode of an electronic component includes the steps of preparing a work; placing a mask on a principal plane of the work; and applying an electrode material over the mask onto the principal plane of the work to form at least one electrode. The mask preferably comprises, for instance, a first masking portion having a substantially rectangular loop shape and a second masking portion having a substantially rectangular shape, and four pseudo masking portions shaped into substantially rectangular strips and which support the first masking portion. In this case, four through holes are formed in the masking member by the synergistic function of the first masking portion, the second masking portion, and the pseudo masking portions.

Abstract: A terminal for a piezoelectric device has a base contact portion and a bent contact portion which are preferably formed by folding a metallic material. Each contact portion has a protrusion disposed thereon. A lubricant is located between the base contact portion and the bent contact portion. The lubricant contains a hydrophilic group tending to form a hydrogen bond with a metal element and a lipophilic group extending in a straight chain from any such hydrogen bond and having a length at least several times that of the hydrophilic group. The lipophilic group has a molecular structure which urges away from the metallic surfaces of the contact portions.