Patents by Inventor Manabu Uto

Manabu Uto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Module structure and module comprising it
    Patent number: 7355853
    Abstract: A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 ?m or more and 1,200 ?m or less.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: April 8, 2008
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideyuki Emoto, Masahiro Ibukiyama, Isao Sugimoto, Manabu Uto
  • Module structure and module comprising it
    Publication number: 20050117302
    Abstract: A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 ?m or more and 1,200 ?m or less.
    Type: Application
    Filed: November 8, 2002
    Publication date: June 2, 2005
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideyuki Emoto, Masahiro Ibukiyama, Isao Sugimoto, Manabu Uto