Abstract: An integrated outlet guide vane assembly for turbomachinery typically includes at least one outlet guide vane and at least one bifurcation having a leading edge and a trailing edge. The turbomachinery has a central axis of rotation and a defined direction of rotation about the axis. The guide vane comprises an airfoil having a leading edge and a trailing edge and has a non-zero angle of lean in the direction of rotation and a non-zero sweep angle relative to a line perpendicular to the central axis. The leading edge of the bifurcation has a non-zero angle of lean in the direction of rotation and a non-zero sweep angle relative to a line perpendicular to the central axis. The trailing edge of the vane is faired into the leading edge of the bifurcation.

Abstract: An integrated outlet guide vane assembly for turbomachinery typically includes at least one outlet guide vane and at least one bifurcation having a leading edge and a trailing edge. The turbomachinery has a central axis of rotation and a defined direction of rotation about the axis. The guide vane comprises an airfoil having a leading edge and a trailing edge and has a non-zero angle of lean in the direction of rotation and a non-zero sweep angle relative to a line perpendicular to the central axis. The leading edge of the bifurcation has a non-zero angle of lean in the direction of rotation and a non-zero sweep angle relative to a line perpendicular to the central axis. The trailing edge of the vane is faired into the leading edge of the bifurcation.

Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Abstract: A method of depositing various materials onto heat-sensitive targets, particularly oxygen-sensitive materials. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (M3D™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: Method and apparatus for improved maskless deposition of electronic and biological materials using an extended nozzle. The process is capable of direct deposition of features with linewidths varying from a few microns to a fraction of a millimeter, and can be used to deposit features on targets with damage thresholds near 100° C. or less. Deposition and subsequent processing may be performed under ambient conditions and produce linewidths as low as 1 micron, with sub-micron edge definition. The extended nozzle reduces particle overspray and has a large working distance; that is, the orifice to target distance may be several millimeters or more, enabling direct write onto non-planar surfaces. The nozzle allows for deposition of features with linewidths that are approximately as small as one-twentieth the size of the nozzle orifice diameter, and is preferably interchangeable, enabling rapid variance of deposited linewidth.