Abstract: An equipment front-end module (EFEM) includes a with a load port seat and a transfer robot seat. A fan filter unit is supported by the frame assembly and a controls box encloses the fan filter unit and is supported by the fan filter unit. The rear panel has a tunnel seat, is fixed to the frame assembly, and is separated from the load port seat by the transfer robot seat. One of (a) a plate body with an inboard passthrough and (b) a tunnel body with an outboard passthrough fixed at the tunnel seat and coupled to the frame assembly by the rear panel to space a process chamber with a quad chamber arrangement from the frame assembly differently along a transfer extending through the tunnel seat than a process module having a single or a dual chamber arrangement using a singular EFEM arrangement. Semiconductor processing systems and methods of making semiconductor processing systems are also described.

Abstract: A load lock arrangement includes a load lock body having an upper plate member defining an upper accessory seat, an intermediate plate member spaced apart from the upper plate member and defining an intermediate accessory seat, and a lower plate member separated from the upper plate member by the intermediate plate member and defining a lower accessory seat. One of an upper heater and an upper accessory seat blanking plate is fixed to the upper accessory seat; one of an upper chill plate and an intermediate accessory seat blanking plate fixed to the intermediate accessory seat; and one of a lower chill plate, a lower heater, and a lower accessory seat blanking plate fixed to the lower accessory seat. Semiconductor processing systems, methods of making load lock arrangements, and material layer deposition methods are also described.

Abstract: A semiconductor processing system includes a front-end module connected to a load lock, a process module coupled to the front-end module by the load lock, a purge/vent fluid inlet conduit connected to the load lock, a heater element coupled to the load lock by the purge/vent fluid inlet conduit, and a controller. The controller is operably connected to the heater element and responsive to instructions recorded on a memory to transfer a substrate carrying substrate moisture from the front-end module into the load lock, heat a purge/vent fluid using the heater element, flow the heated purge/vent fluid into the load lock using the purge/vent fluid inlet conduit, remove the moisture from the load lock using the heated purge/vent fluid, and transfer the substrate from the load lock to the process module for processing using the process module. Moisture control methods and heated purge/vent fluid arrangements are also described.

Abstract: A self-centering substrate carrier system for a chemical vapor deposition reactor includes a substrate carrier chosen to at least partially support a wafer for CVD processing and that comprises a beveled surface. A rotating tube comprising a beveled surface that matches the beveled surface of the substrate carrier, where a shape and dimensions of a cross section of the substrate carrier are chosen such that a center of mass of the substrate carrier is positioned a distance that is below a plane of contact defined by where a rim of substrate carrier contacts a rim of the rotating tube.

Abstract: A chemical vapor deposition system for semiconductor wafer production is disclosed. The system includes a process cluster coupled to a first end of a transfer chamber. The process cluster is maintained at a pressure that is lower than atmospheric pressure. The process cluster is also configured to apply epitaxial layers on one or more wafers loaded onto a wafer carrier. The system also includes an automatic factory interface coupled to a second end of the transfer chamber. The automatic factory interface is maintained at atmospheric pressure. The system includes one or more wafer carrier cleaning modules coupled to the automatic factory interface and configured to clean one or more of the wafer carriers without removing the wafer carriers from the chemical vapor deposition system.

Abstract: An injector block for supplying one or more reactant gases into a chemical vapor deposition reactor. The injector block including a plurality of first reactant gas distribution channels between one or more first reactant gas inlets and a plurality of first reactant gas distribution outlets to deliver a first reactant gas into the reactor, and a plurality of second reactant gas distribution channels between one or more second reactant gas inlets and a plurality of second reactant gas distribution outlets to deliver a second reactant gas into the reactor, the plurality of second reactant gas distribution outlets partitioned into at least a second reactant gas first zone and a second reactant gas second zone, the second reactant gas second zone at least partially surrounding the second reactant gas first zone.

Abstract: A wafer carrier as described and claimed herein includes a thermal cover and a plurality of platforms with corresponding radially inner and outer pedestals.

Abstract: A robotic handling system loads and unloads wafers (e.g., silicon wafers) and their carriers into and out of an interlock chamber of a loadlock system. The wafer handling system includes an end effector that handles both the wafer and the carrier by their bottom surfaces, avoiding contact with the top surface of the wafer. From the interlock chamber, wafers, seated on the carrier, are moved into a processing chamber under vacuum conditions. Processed wafers, seated on the carrier, are moved from the processing chamber back into the interlock chamber and removed from the interlock chamber by the robotic handling system under atmospheric conditions.

Abstract: A light powered microactuator device of the invention is an integrated device including a solar cell that provides sufficient energy to actuate an electroactive thin film coupled to a thin membrane. The lateral strain response of the electroactive thin film causes the thin membrane to move, providing an actuation force that can be applied in a wide variety of microactuator devices. A preferred embodiment light powered microactuator device of the invention includes a substrate that defines a flexible membrane in a portion thereof. An electroactive thin film is coupled to the flexible membrane such that lateral strain in the electroactive membrane causes flexing of the membrane. An integrated solar cell converts light to voltage that is applied to the electroactive thin film by an integrated electrode.

Abstract: A light powered microactuator device of the invention is an integrated device including a solar cell that provides sufficient energy to actuate an electroactive thin film coupled to a thin membrane. The lateral strain response of the electroactive thin film causes the thin membrane to move, providing an actuation force that can be applied in a wide variety of microactuator devices. A preferred embodiment light powered microactuator device of the invention includes a substrate that defines a flexible membrane in a portion thereof. An electroactive thin film is coupled to the flexible membrane such that lateral strain in the electroactive membrane causes flexing of the membrane. An integrated solar cell converts light to voltage that is applied to the electroactive thin film by an integrated electrode.