Patents by Inventor Mandy Mistkawi

Mandy Mistkawi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7427210
    Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: September 23, 2008
    Assignee: Intel Corporation
    Inventors: Robert R. Martinson, Alin Ila, Mandy Mistkawi
  • Publication number: 20070297143
    Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventors: Robert R. Martinson, Alin Ila, Mandy Mistkawi