Patents by Inventor Manfred ENGLERT

Manfred ENGLERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Closed loop control
    Patent number: 9758855
    Abstract: A method of controlling a reactive deposition process and a corresponding assembly and/or apparatus are described. The method includes providing power to a cathode with a power supply, providing a voltage set point to the power supply, receiving a power value correlating the power provided to the cathode, and controlling a flow of a process gas in dependence of the power value to provide a closed loop control for the power value.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: September 12, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Thomas Deppisch, Franz-Josef Helle, Manfred Englert, Uwe Hermanns
  • CLOSED LOOP CONTROL
    Publication number: 20150152542
    Abstract: A method of controlling a reactive deposition process and a corresponding assembly and/or apparatus are described. The method includes providing power to a cathode with a power supply, providing a voltage set point to the power supply, receiving a power value correlating the power provided to the cathode, and controlling a flow of a process gas in dependence of the power value to provide a closed loop control for the power value.
    Type: Application
    Filed: November 30, 2011
    Publication date: June 4, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Thomas Deppisch, Franz-Josef Helle, Manfred Englert, Uwe Hermanns
  • PASSIVATION LAYER FOR WAFER BASED SOLAR CELLS AND METHOD OF MANUFACTURING THEREOF
    Publication number: 20110048515
    Abstract: A solar cell module layer stack is described. The layer stack includes a doped silicon wafer substrate, a back contact layer for the solar cell module, and a first sputtered and annealed passivation layer between the wafer substrate and the back contact layer, wherein the passivation layer is selected from the group consisting of: an aluminum containing oxide layer, an aluminum containing nitride layer, an aluminum containing oxynitride layer, and mixtures thereof.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 3, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Manfred ENGLERT, Sven SCHRAMM, Roland TRASSL