Abstract: An arrangement for detecting a fatigue fracture caused by overstressing of a bolted connection including a bolt and an internal-thread-bearing hollow section which is alternately stressed by an axial flux of force between zero and different maximal values. A transverse crack forms at a predetermined breaking point of the bolted connection, at which the hollow section breaks due to fatigue. The spacing of the predetermined breaking point from the connection ends, and the interaction of the bolt and the hollow section, are designed such that, after the breakage, the bolt forms in the hollow section a residual joining connection which can be alternatingly stressed. In order to signal the occurrence of a crack on the hollow section of the bolted connection in the event of a fracture caused by fatigue in a simple and always noticeable manner, the arrangement has an additional signaling device.

Abstract: A connector assembly that is subjected to alternating loads by an axial flow of force between zero and various maximum values, with an outer assembly component designed as a hollow section and an inner assembly component located in the outer one and fitting by virtue of its shape. In order to detect failure of the assembly caused by a fatigue fracture produced by overloads at the end point in the assembly direction, even before it develops, in a simple fashion within the functional assembly, the assembly comprises a rear area with play that begins at the end of the connection that points in the assembly direction and a forward zero-play area of the inner assembly component that abuts the latter and is located inside the outer assembly component.

Abstract: The invention relates to a circuit plate for the optimal decoupling of circuits with digital integrated circuits. The plate is connected to an SMD capacitor and two conductor tracks connected to the capacitor and leading to the points to be decoupled. The plate is fittable with all precision contact connections present. Furthermore, the plate is adapted to the shape of the IC's or the IC base and, in each case, has a number of bores conforming to the number of contact pins of the IC's or to the number of contact connections of the IC base, whereby the conductor tracks leading to the SMD capacitor are relatively wide and lead to the connections of the points to be decoupled.