Abstract: What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components (A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C. (B) 10 to 30% by weight of titanium dioxide particles (C) 5 to 20% by weight of glass fibres (D) 5-30% by weight of calcium carbonate. The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.

Abstract: The present invention relates to reinforced polyamide molding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibers or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide molding materials according to the invention are suitable for the production of moldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection molding, direct methods or direct compounding, in which the compounded polyamide molding material is processed directly by injection molding, or other deformation techniques.

Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Abstract: A polyamide molding composition with the following constitution is described: (a) from 40 to 90% by weight of a copolyamide, where this is composed of (a1) 1,6-hexanediamine and 1,10-decanediamine and also (a2) terephthalic acid and at least one other polyamide-forming monomer selected from the group of: dicarboxylic acid having from 8 to 18 carbon atoms, laurolactam, aminolauric acid, and/or mixtures thereof; (b) from 10 to 40% by weight of macromolecular plasticizers, with the proviso that these can have been replaced to some extent by low-molecular-weight plasticizers; (c) from 0 to 20% by weight of additives and/or added substances. Uses of this type of molding composition are also described, in particular for the production of a fuel line, cooling line, oil line or urea line for the automobile sector, as also are production processes to give moldings.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: Polyamide molding composition, in particular for use for components of electronic and/or electrical components, having the following composition: (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of 100% by weight of diacid fraction composed of: 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 28.0-1.7% by weight of isophthalic acid (IPA) and 100% by weight of diamine fraction composed of: 51.0-80.0% by weight of 1,6-hexanediamine (HMDA); 20.0-49.0% by weight of aliphatic, unbranched C9-C12-diamine; (B) 0-70% by weight of fillers and reinforcing materials; (C) 0-25% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Abstract: An unreinforced, halogen-free polyamide moulding composition which is provided with flame retardants and from which it is possible to produce electric and/or electronic components which can be reliably soldered, i.e. in particular without blisters being formed in the soldering process, in particular at 260° C. and possibly higher temperatures after water absorption and in the case of critical designs of the components, and which have an elongation at break of at least 5% and reliably achieve the UL94 classification V0. These polyamide moulding compositions have the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C.

Abstract: What is described is a polyamide moulding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components (A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C. (B) 10 to 30% by weight of titanium dioxide particles (C) 5 to 20% by weight of glass fibres (D) 5-30% by weight of calcium carbonate. The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.

Abstract: Moulded articles having reduced surface carbonization and longer retention of the mechanical properties and methods of producing same are presented. In an embodiment, the moulded article comprises polyamides with nanofillers, which can be produced by means of injection moulding or extrusion, in particular by extrusion blow moulding, coextrusion blow moulding or sequential blow moulding with and without 3D hose manipulation. For example, the polyamide moulding materials for the production of moulded articles have reduced surface carbonization in the moulded articles in subsequent long-term use at elevated temperatures.

Abstract: Polyamide moulding composition, in particular for use for components of electronic and/or electrical components, having the following composition: (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of 100% by weight of diacid fraction composed of: 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 28.0-1.7% by weight of isophthalic acid (IPA) and 100% by weight of diamine fraction composed of: 51.0-80.0% by weight of 1,6-hexanediamine (HMDA); 20.0-49.0% by weight of aliphatic, unbranched C9-C12-diamine; (B) 0-70% by weight of fillers and reinforcing materials; (C) 0-25% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Abstract: A polyamide moulding composition with the following constitution is described: (a) from 40 to 90% by weight of a copolyamide, where this is composed of (a1) 1,6-hexanediamine and 1,10-decanediamine and also (a2) terephthalic acid and at least one other polyamide-forming monomer selected from the group of: dicarboxylic acid having from 8 to 18 carbon atoms, laurolactam, aminolauric acid, and/or mixtures thereof; (b) from 10 to 40% by weight of macromolecular plasticizers, with the proviso that these can have been replaced to some extent by low-molecular-weight plasticizers; (c) from 0 to 20% by weight of additives and/or added substances. Uses of this type of moulding composition are also described, in particular for the production of a fuel line, cooling line, oil line or urea line for the automobile sector, as also are production processes to give mouldings.

Abstract: A polyamide molding composition having the constitution from 30 to 100% by weight of at least one 10T/6T copolyamide composed of from 40 to 95 mol % of 10T units, and from 5 to 60 mol % of 6T units, from 0 to 70% by weight of reinforcing materials and/or fillers, and from 0 to 50% by weight of additives and/or further polymers. Uses and processes for the preparation of this polyamide molding composition are described.

Abstract: The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt.

Abstract: A novel polyamide molding material for highly lustrous and rigid polyamide molded articles contains a polyamide mixture consisting of a semicrystalline linear polyamide, a special branched graft polyamide, an amorphous polyamide, reinforcing substances as well as conventional additives.

Abstract: A polyamide molding composition with the following constitution is described: (A) from 30 to 100% by weight of at least one 10T/6T copolyamide, where this is composed of (A1) from 40 to 95 mol % of 10T units, formed from the monomers 1,10-decanediamine and terephthalic acid (A2) from 5 to 60 mol % of 6T units, formed from the monomers 1,6-hexanediamine and terephthalic acid (B) from 0 to 70% by weight of reinforcing materials and/or fillers (C) from 0 to 50% by weight of additives and/or further polymers where the entirety of components A to C is 100%, with the proviso that in component (A) up to 30 mol %, based on the entirety of the dicarboxylic acids, of the terephthalic acid can have been replaced by other aromatic, aliphatic, or cycloaliphatic dicarboxylic acids, and with the proviso that in component (A) up to 30 mol % of 1,10-decanediamine and respectively 1,6-hexanediamine, based on the entirety of the diamines, can have been replaced by other diamines, and with the proviso that not more than 3

Abstract: Moulded articles having reduced surface carbonization and longer retention of the mechanical properties and methods of producing same are presented. In an embodiment, the moulded article comprises polyamides with nanofillers, which can be produced by means of injection moulding or extrusion, in particular by extrusion blow moulding, coextrusion blow moulding or sequential blow moulding with and without 3D hose manipulation. For example, the polyamide moulding materials for the production of moulded articles have reduced surface carbonization in the moulded articles in subsequent long-term use at elevated temperatures.

Abstract: The present invention relates to reinforced polyamide moulding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibres or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide moulding materials according to the invention are suitable for the production of mouldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection moulding, direct methods or direct compounding, in which the compounded polyamide moulding material is processed directly by injection moulding, or other deformation techniques.

Abstract: The present invention relates to reinforced polyamide moulding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibres or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide moulding materials according to the invention are suitable for the production of mouldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection moulding, direct methods or direct compounding, in which the compounded polyamide moulding material is processed directly by injection moulding, or other deformation techniques.

Abstract: The invention concerns polyamide molding compositions with good surface quality and good flow behavior containing prepolymeric polyamides with a solution viscosity of ?rel 1.01–1.30 in quantities from 0.1 to 20 wt. %.