Abstract: A device and a method for monitoring and/or inspecting moving material webs. The method includes taking a first picture of a first portion of a material web at a first point in time with a camera, which has a matrix chip with a binning function, and taking a second picture of a second portion of the material web at a second point in time with the camera. A first binning step level is used for the first picture and a second binning step level is used for the second picture. The first number of pixels which are in each case grouped together is higher or lower than the second number of pixels which are in each case grouped together, as a result of which a physical zoom function is achieved for the second picture.

Abstract: The invention relates to a device and a method for compensating for a material web offset in inspection systems for material webs which are moving in the direction of a material web length and/or a material web width. The method comprises the following steps: taking a first picture of a first portion of a material web at a first point in time with a camera which comprises a matrix chip, and taking a second picture of a second portion of the material web at a second point in time with the camera. A first active partial surface of the matrix chip is used for the first picture and a second active partial surface of the matrix chip is used for the second picture here, wherein the first active partial surface and the second active partial surface are not identical.

Abstract: The invention relates to a device and a method for monitoring and/or inspecting material webs which are moving in the direction of a material web length and/or a material web width, The method comprises the following steps: taking a first picture of a first portion of a material web at a first point in time with a camera which has a matrix chip with a binning function, and taking a second picture of a second portion of the material web at a second point in time with the camera. A first binning step level is used for the first picture here, in each case a first number of pixels of the matrix chip being grouped together using the binning function. A second binning step level is used for the second picture, in each case a second number of pixels of the matrix chip being grouped together using the binning function.

Abstract: The invention relates to a device and a method for compensating for a material web offset in inspection systems for material webs which are moving in the direction of a material web length and/or a material web width. The method comprises the following steps: taking a first picture of a first portion of a material web at a first point in time with a camera which comprises a matrix chip, and taking a second picture of a second portion of the material web at a second point in time with the camera. A first active partial surface of the matrix chip is used for the first picture and a second active partial surface of the matrix chip is used for the second picture here, wherein the first active partial surface and the second active partial surface are not identical.