Patents by Inventor Manfred Loddenkoetter

Manfred Loddenkoetter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connecting device for power semiconductor modules with compensation for mechanical stresses
    Patent number: 6483128
    Abstract: A connecting device for power semiconductor modules with compensation for mechanical stresses includes a sleeve connected to a substrate and having a region with a given very small diameter. A wire pin is provided for insertion into the region of the sleeve during operation to form an electrical connection for a board. The wire pin has a diameter greater than the given diameter for clamping the wire pin upon insertion in the region. Axial freedom of movement of the wire pin in the sleeve makes it possible to avoid mechanical stresses resulting from different material characteristics when a temperature change takes place.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: November 19, 2002
    Assignee: Eupec Europaeische Gesellschaft f. Leistungshalbleiter mbH+CO. KG
    Inventors: Manfred Loddenkötter, Thilo Stolze
  • Spring clip for fixing semiconductor modules to a heat sink
    Patent number: 6431259
    Abstract: In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: August 13, 2002
    Assignee: Eupec Europaeische Gesellschaft fuer Leistungshalbleiter MbH & Co. KG
    Inventors: Horst Hellbrück, Ralf Jörke, Konstantin Kanelis, Manfred Loddenkötter, Thilo Stolze
  • Configuration for connecting power semiconductor chips in modules
    Publication number: 20010026434
    Abstract: A configuration for connecting power semiconductor chips in modules is configured such that the power semiconductor chips are positioned in a chessboard pattern and in each case a respective function type of the power semiconductor chips is assigned to a respective “color” of the fields of the chessboard pattern.
    Type: Application
    Filed: March 12, 2001
    Publication date: October 4, 2001
    Inventor: Manfred Loddenkoetter
  • Substrate for power semiconductor modules with through-plating of solder and method for its production
    Publication number: 20010022236
    Abstract: A substrate for power semiconductor modules with a through-plating of solder, includes two metal plates and a ceramic plate which is seated as a layer between the metal plates and has a through hole formed therein. The substrate is plated through by making a through hole in one of the metal plates in alignment with the through hole in the ceramic plate and applying a paste solder to one side of the substrate. The substrate is then subjected to a furnace step, so that the paste solder flows into the through holes and the solder makes a permanent contact between the two metal plates. A method for producing the substrate is also provided.
    Type: Application
    Filed: February 20, 2001
    Publication date: September 20, 2001
    Inventors: Thilo Stolze, Manfred Loddenkoetter